XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD
Référence : XC6SLX75T-3FG484I ✓ ActifXC6SLX75T-3FG484I Présentation
A field-programmable gate array, or FPGA, is a programmable digital semiconductor within the broader logic IC and semiconductor hierarchy. Its configurable logic blocks, programmable interconnect, and I/O resources implement digital control, signal processing, interface, and embedded systems without requiring a custom mask-programmed ASIC. Spartan-6 devices combine configurable fabric with hard DSP and memory resources for cost-sensitive embedded and high-volume logic designs.
The XC6SLX75T-3FG484I provides 74,637 logic cells and 268 user I/O in the LXT Spartan-6 family. Its 45 nm CMOS construction supports integration of programmable logic with dedicated DSP resources, while the -3 designation identifies the device's performance grade. The 484-ball FBGA package provides a high-pin-count connection option for designs requiring substantial external interface resources.
The LXT family supports communications-oriented designs that combine programmable logic with dedicated hardware suitable for DSP, interface, and embedded processing workloads. A maximum internal frequency of 667 MHz is listed for this device, although achievable system performance depends on the selected clocking architecture, routing, I/O standards, memory interface configuration, and timing constraints implemented in the FPGA design.
Typical uses include industrial control, communications infrastructure, consumer-oriented signal processing, embedded systems, video and image processing, and test equipment. The XC6SLX75T-3FG484I is appropriate when a design requires more logic and I/O than a smaller FPGA while retaining the same 484-pin package used by compatible Spartan-6 options. The -3 grade is suited to designs prioritizing higher performance over lower-speed alternatives.
Board design must account for the large 484-ball FBGA footprint, multilayer PCB construction, controlled-impedance routing, clean power and ground distribution, and adequate thermal management. Designers should use the AMD Spartan-6 package pinout files and device-specific pin constraints when assigning package balls. Configuration storage, clocking, decoupling, and bank-specific voltage requirements also require careful implementation before schematic and PCB signoff.
This product page combines package, density, speed-grade, temperature, and sourcing information with application guidance, engineering design notes, and same-package replacement analysis. It is intended to help engineers assess Spartan-6 LXT design fit, identify pin-compatible options, and prepare a robust 484-FBGA implementation.
Alternatives de remplacement direct pour XC6SLX75T-3FG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
XC6SLX75T-2FG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX75T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75T-3FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75T-3FG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75T-N3FG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75T-3FG484I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-6 LXT field-programmable gate array |
| Logic Cells | 74,637 cells |
| User I/O | 268 I/O |
| Boîtier | 484-pin FBGA |
| Package Dimensions | 23 mm x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Maximum Internal Frequency | 667 MHz |
| Speed Grade | -3 |
| Température de fonctionnement | 0 C to 85 C |
| FPGA Family | Spartan-6 LXT |
| Total Pins | 484 pins |
| Type de montage | Surface Mount |
| Qualification | Industrial temperature range |
Guide de configuration des broches du XC6SLX75T-3FG484I 23 mm x 23 mm
Configuration des broches du XC6SLX75T-3FG484I (boîtier 23 mm x 23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX75T-3FG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX75T-3FG484I convient pour 6 applications: Industrial Control and Automation, Communications Interface Equipment, Consumer-Oriented DSP Processing, Embedded Instrumentation, Video and Image Processing, Test and Measurement Equipment.
Industrial Control and Automation
The XC6SLX75T-3FG484I fits industrial controllers that combine machine sequencing, sensor acquisition, actuator control, and communications in one programmable device. Its 74,637 logic cells provide substantial configurable logic, while 268 user I/O support multiple digital interfaces and control signals. The listed 0 C to 85 C operating range is appropriate for many factory environments. Designers can partition the fabric among real-time control, data validation, diagnostics, and communication protocols. The -3 grade offers additional timing margin for synchronous control paths, although final clock rates must be verified through post-route timing analysis.
Recommandé
Communications Interface Equipment
The XC6SLX75T-3FG484I is suitable for communications interface equipment requiring programmable packet handling, parallel-to-serial conversion, and dedicated control logic. The large I/O count allows the design to connect multiple buses and data sources, while the Spartan-6 LXT fabric can implement protocol state machines, packet filters, and timing controls. Its listed 667 MHz maximum internal frequency provides resources for wide synchronous interfaces. Engineers should use the AMD package pinout files to plan high-speed routing and assign I/O standards carefully, particularly for interfaces requiring controlled impedance or differential clocking.
Recommandé
Consumer-Oriented DSP Processing
The Spartan-6 LXT architecture makes the XC6SLX75T-3FG484I suitable for cost-sensitive consumer DSP, filtering, waveform, and mixed signal-interface designs. Its 74,637 logic cells can accommodate parallel datapaths, control state machines, and digital filtering, while the -3 grade is appropriate for designs with tighter synchronous timing requirements. Dedicated DSP resources should be evaluated against the required sample rate and arithmetic precision during device selection. A practical implementation places high-speed memory and converter interfaces close to their assigned FPGA balls, with separate attention to clock jitter, grounding, and impedance-controlled signal paths.
Recommandé
Embedded Instrumentation
The XC6SLX75T-3FG484I can implement embedded instrumentation systems that combine acquisition control, digital signal processing, local storage, and a host interface. Its 268 user I/O allow multiple sensors, status indicators, memories, and communication ports to share a single FPGA. The -3 speed grade supports demanding synchronous control logic, while the Spartan-6 LXT family provides a balance of programmable resources and device integration. For laboratory or field equipment, designers should define clock domains carefully, validate acquisition timing at each interface, and provide clean references for sensitive converter and analog front-end circuitry.
Recommandé
Video and Image Processing
The XC6SLX75T-3FG484I is suitable for parallel video processing, image preprocessing, pixel transport, and test-pattern generation. Its 74,637 logic cells provide enough parallel capacity for timing control, line and pixel counters, lookup logic, and data-path transformations, while 268 I/O support wide synchronous interfaces. The listed maximum internal frequency of 667 MHz is useful for synchronous video timing, although actual pixel-clock performance depends on routing and memory bandwidth. PCB design should use short matched routes for source-synchronous interfaces and separate noisy digital switching from sensitive reference and power networks.
Recommandé
Test and Measurement Equipment
The XC6SLX75T-3FG484I fits programmable test systems requiring deterministic sequencing, pattern generation, protocol capture, and real-time analysis. The 74,637-cell Spartan-6 LXT device can combine acquisition logic, counters, timing engines, and buffer management within a single package, while 268 I/O support dense fixture or backplane connections. The -3 performance grade is advantageous for synchronous test-clock domains. Engineers should establish timing budgets in the RTL, use the package pinout to optimize clock and data routes, and maintain separate clock, data, and power-supply distribution to preserve measurement repeatability and signal integrity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX75T-3FG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX75T-2FG484I | XC6SLX75T-2FGG484I | XC6SLX75T-3FGG484I | XC6SLX75T-3FG484C | XC6SLX75T-N3FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells |
| User I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -3 | -2 | -2 | -3 | -3 | -N3 |
| Maximum Internal Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
Principaux différenciateurs
- Higher selected speed grade than the -2 replacement (vs XC6SLX75T-2FG484I)
- Industrial-temperature ordering suffix (vs XC6SLX75T-3FG484C)
- Same density, package, and I/O count across the replacement set (vs XC6SLX75T-N3FG484I)
Notes de conception
Use the AMD Spartan-6 package-device pinout files to assign all 484 package balls before routing. Treat VCC, GND, configuration, clock, and general-purpose I/O balls as separate constraint groups. A 23 mm by 23 mm FBGA with 1 mm pitch requires multilayer PCB construction, short escape routes, uninterrupted reference planes, and via arrays placed where they preserve current flow without obstructing neighboring signal escape channels.
Plan the 1.2 V core supply and configurable I/O supplies as separate distribution networks, with local decoupling placed directly beneath or close to the assigned device balls. Use the device datasheet for the exact bank voltage, current, sequencing, and decoupling requirements. Check startup current and worst-case utilization rather than relying on typical power estimates, because the FPGA can draw substantially more current as logic, DSP, and I/O activity increase.
Assign clocks and source-synchronous interfaces according to the device's package and bank constraints. Keep clock traces short, use matched routing for data groups, and provide clean references without routing over split power or ground planes. The listed 667 MHz internal frequency does not by itself guarantee 667 MHz I/O performance; timing analysis must include package delay, board loss, skew, external component delay, and the selected FPGA I/O standard.
Estimate junction temperature from the actual configuration, utilization, switching activity, supply voltage, ambient temperature, and board thermal resistance. A 484-FBGA design can concentrate heat beneath the device even when the air temperature is moderate. Provide uninterrupted copper planes, thermal vias, a balanced placement of decoupling components, and enough enclosure airflow or heat-spreading structure to prevent localized junction temperature from exceeding the device limit.
Do not treat a shared 484-BBGA package as proof that every suffix is an automatic drop-in replacement. Speed grade, temperature grade, configuration method, supported I/O standards, and bitstream compatibility can differ. Rebuild or verify timing with the exact replacement device, confirm the package drawing, and review the AMD device constraints and pinout files before releasing production artwork.
Informations de conformité
The manufacturer documentation identifies the device as a Spartan-6 LXT FPGA, but no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was identified for this ordering code.
