XC7A15T-3FTG256E - 16,640 Logic Cells, 170 I/O | AMD
Référence : XC7A15T-3FTG256E ✓ ActifXC7A15T-3FTG256E Présentation
A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnect, memory, and I/O resources can be configured after manufacture. Within the product hierarchy, the XC7A15T belongs to the Artix-7 FPGA family and the broader programmable-logic semiconductor category. Its 16,640 logic cells provide moderate implementation capacity for embedded control, signal processing, communications, instrumentation, and general-purpose programmable systems.
The verified device data identifies 921,600 RAM bits for embedded memory and 170 user I/O. Cross-reference material describes the device using either 2,600 logic blocks or 1,300 LAB/CLB groupings, reflecting different counting conventions for the same 16,640-logic-cell device. The target operates from a 1 V core supply, enabling the energy-efficient 28 nm architecture associated with the Artix-7 family.
The FTG256 package uses 256 BGA sites and is intended for surface-mount PCB assembly. BGA construction supports compact designs but requires careful escape-routing, ground-plane continuity, via-in-pad considerations where appropriate, and assembly process control. AMD package pinout resources are available for board-layout validation, while the complete electrical and timing limits must be taken from the manufacturer data sheet.
Typical uses include industrial automation, test and measurement, embedded video and control, low-cost communications equipment, sensor processing, and education or prototyping platforms. The 170 I/O make it especially relevant to designs needing multiple parallel digital interfaces while retaining substantial programmable logic capacity.
Designers should verify power sequencing, decoupling, signal integrity, configuration interface requirements, and exposed thermal behavior against the manufacturer documentation. Migration candidates must be checked for package, speed grade, temperature range, configuration scheme, bank voltage, and pinout rather than relying on the XC7A15T family name alone.
This product page consolidates verified distributor specifications, package and pinout resources, source links, and same-package migration options. It also distinguishes directly comparable speed and temperature variants from different-package devices that cannot be treated as drop-in replacements.
Alternatives de remplacement direct pour XC7A15T-3FTG256E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A15T-3FTG256E (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Package.
XC7A15T-2FTG256C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC7A15T-1FTG256I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC7A15T-3FTG256E Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 16,640 cells |
| Adaptive Logic Modules | 2,600 ALMs |
| LAB/CLB Count | 1,300 LABs/CLBs |
| Embedded Memory | 921,600 RAM bits |
| User I/O | 170 I/O |
| Core Supply Voltage | 1 V |
| Process Technology | 28 nm |
| Boîtier | 256-pin FTG256 BGA |
| Type de montage | Surface Mount |
| Series | Artix-7 |
| Speed Grade | -3 |
| Temperature Grade | Extended |
| Device Family | XC7A15T |
| Packaging | Tray |
| Programmable Logic | FPGA |
| Pricing | From 16.359 USD as of 2026-10-29 |
Guide de configuration des broches du XC7A15T-3FTG256E 256-pin ftg256 bga
Configuration des broches du XC7A15T-3FTG256E (boîtier 256-pin ftg256 bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A15T-3FTG256E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A15T-3FTG256E convient pour 6 applications: Industrial Automation and Control, Test and Measurement Instrumentation, Communications and Protocol Bridging, Embedded Video and Image Processing, Sensor Processing and Acquisition, Prototyping and Education Platforms.
Industrial Automation and Control
The AMD XC7A15T-3FTG256E suits industrial automation systems that require parallel digital control, timing-critical logic, and multiple external interfaces. Its 16,640 logic cells provide room for control state machines, communication bridges, and sensor aggregation, while the 170 I/O support encoder inputs, actuator outputs, and fieldbus interfaces. The extended-temperature ordering option is relevant to equipment operating beyond commercial conditions, although the final environmental qualification must follow the system specification. Designers should use the -3 timing constraints during implementation and verify power sequencing, decoupling, and industrial EMC requirements using the AMD family documentation.
Recommandé
Test and Measurement Instrumentation
The XC7A15T-3FTG256E can implement parallel acquisition logic, trigger sequencing, pattern generation, and data-processing pipelines in a compact FPGA-based instrument. Its 921,600 RAM bits provide usable buffer storage for captured samples, while 16,640 logic cells support control and transformation stages. The -3 speed grade is useful when timing closure requires more margin than the -2 alternative. For precision instrumentation, the design must still address analog conditioning, clock jitter, grounding, calibration, and signal integrity separately from the FPGA. Verify all pin constraints against the FTG256 package files before committing the PCB.
Recommandé
Communications and Protocol Bridging
The AMD XC7A15T-3FTG256E is suitable for low-cost communications equipment that requires protocol conversion, packet buffering, or parallel-to-serial interface bridging. The 170 user I/O allow multiple data buses and control signals to be connected without using a large package, while 921,600 RAM bits can support packet queues and transmit buffers. The 1 V core supply and 28 nm Artix-7 architecture suit compact, power-conscious designs. Clock-domain crossings, transceiver characteristics, impedance-controlled routing, and protocol-specific timing must be engineered around the selected external components and verified against the AMD timing data.
Recommandé
Embedded Video and Image Processing
The XC7A15T-3FTG256E provides enough programmable logic for modest image-processing pipelines, pixel routing, exposure timing, and display-interface control. Its 16,640 cells can implement parallel processing stages, while the 921,600 RAM bits offer line buffers or small frame storage where full-frame buffering is unnecessary. The 170 I/O support camera inputs, synchronization, and display interfaces when suitable external PHY devices are used. High-speed video links require disciplined length matching, controlled-impedance routing, clean clocking, and careful BGA escape routing. The -3 grade provides a timing-performance option, subject to actual speed-grade limits in the manufacturer data sheet.
Recommandé
Sensor Processing and Acquisition
The AMD XC7A15T-3FTG256E fits sensor-acquisition systems that need simultaneous sampling coordination, digital filtering, calibration tables, and local decision logic. The 170 I/O can connect multiple sensors and digital interfaces, while the available RAM supports FIFOs, calibration coefficients, and working buffers. The extended-temperature suffix makes the ordering code relevant for industrial sensing environments, but system-level environmental testing remains necessary. Designers should isolate analog inputs appropriately, establish deterministic clocking, decouple every required supply rail, and verify FTG256 ball assignments using AMD’s official package files before fabrication.
Recommandé
Prototyping and Education Platforms
The XC7A15T-3FTG256E is practical for FPGA prototyping, digital-logic education, and embedded-systems experimentation because it combines 16,640 logic cells, embedded RAM, and 170 I/O in a single device. Students can implement processors, protocol engines, digital filters, and custom peripherals while gaining experience with BGA layout and AMD FPGA workflows. The -3 speed grade is useful for timing-sensitive demonstrations. Prototype boards should nevertheless provide robust power distribution, accessible configuration methods, expansion interfaces, and careful BGA escape routing so the learning platform remains reliable after repeated programming and handling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A15T-3FTG256E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A15T-2FTG256C | XC7A15T-1FTG256I |
|---|---|---|---|
| Brand | AMD | AMD | AMD |
| Package | FTG256 BGA | FTG256 BGA - same package | FTG256 BGA - same package |
| Logic Cells | 16,640 cells | 16,640 cells | 16,640 cells |
| LAB/CLB Count | 1,300 LABs/CLBs | 1,300 LABs/CLBs | 1,300 LABs/CLBs |
| Embedded Memory | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits |
| User I/O | 170 I/O | 170 I/O | 170 I/O |
| Speed Grade | -3 | -2, one grade slower | -1, two grades slower |
| Temperature Ordering Option | Extended | Commercial, 0°C to +85°C | Industrial |
| Process Technology | 28 nm | 28 nm | 28 nm |
| Programmable Logic | FPGA | FPGA | FPGA |
Principaux différenciateurs
- Higher speed-grade option within the same FTG256 migration path (vs XC7A15T-2FTG256C)
- Extended-temperature ordering option (vs XC7A15T-2FTG256C)
- Same-density same-package baseline for controlled migration (vs XC7A15T-1FTG256I)
Notes de conception
Design the FTG256 footprint around the official AMD package pinout files rather than a generic 256-ball BGA symbol. Confirm ball pitches, power and ground assignments, configuration pins, and the FTG256-specific mechanical drawing. The verified data confirms a 256-pin FTG256 package but does not provide a complete ball table, so use AMD’s official package file before routing power, signals, or the PCB stack-up.
Treat the 1 V core rail as a high-current digital supply requiring short return paths and local decoupling. Follow the manufacturer’s recommended capacitor values, voltage tolerances, power-up sequence, and current limits; these details are not present in the verified search data and therefore must not be guessed. Connect ground balls through multiple nearby vias and avoid placing sensitive analog routing beneath switching or high-current power paths.
BGA escape routing should prioritize configuration signals, clocks, high-speed interfaces, and supply connections. Use a stack-up that supports the selected escape strategy, maintain the fabricator’s via and pad rules, and validate differential or length-sensitive routes with the intended FPGA speed grade. The -3 device has less timing margin available than slower-grade alternatives, so post-route timing analysis should use the exact XC7A15T-3 device constraints.
Do not treat family-name similarity as proof of drop-in compatibility. XC7A15T-1FGG484I and XC7A15T-2CSG325C use different packages from the FTG256 target and were therefore excluded from the drop-in list. For any accepted migration, compare package drawings, speed grade, temperature grade, I/O standards, configuration pins, power rails, timing constraints, and the generated bitstream before production release.
Informations de conformité
The verified web results did not contain explicit compliance statements for the exact XC7A15T-3FTG256E ordering code. The E suffix denotes the extended-temperature option and does not by itself establish AEC-Q100 qualification.
