XC7A15T-3FTG256E - 16,640 Logic Cells, 170 I/O | AMD
부품 번호: XC7A15T-3FTG256E ✓ 활성XC7A15T-3FTG256E 개요
A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnect, memory, and I/O resources can be configured after manufacture. Within the product hierarchy, the XC7A15T belongs to the Artix-7 FPGA family and the broader programmable-logic semiconductor category. Its 16,640 logic cells provide moderate implementation capacity for embedded control, signal processing, communications, instrumentation, and general-purpose programmable systems.
The verified device data identifies 921,600 RAM bits for embedded memory and 170 user I/O. Cross-reference material describes the device using either 2,600 logic blocks or 1,300 LAB/CLB groupings, reflecting different counting conventions for the same 16,640-logic-cell device. The target operates from a 1 V core supply, enabling the energy-efficient 28 nm architecture associated with the Artix-7 family.
The FTG256 package uses 256 BGA sites and is intended for surface-mount PCB assembly. BGA construction supports compact designs but requires careful escape-routing, ground-plane continuity, via-in-pad considerations where appropriate, and assembly process control. AMD package pinout resources are available for board-layout validation, while the complete electrical and timing limits must be taken from the manufacturer data sheet.
Typical uses include industrial automation, test and measurement, embedded video and control, low-cost communications equipment, sensor processing, and education or prototyping platforms. The 170 I/O make it especially relevant to designs needing multiple parallel digital interfaces while retaining substantial programmable logic capacity.
Designers should verify power sequencing, decoupling, signal integrity, configuration interface requirements, and exposed thermal behavior against the manufacturer documentation. Migration candidates must be checked for package, speed grade, temperature range, configuration scheme, bank voltage, and pinout rather than relying on the XC7A15T family name alone.
This product page consolidates verified distributor specifications, package and pinout resources, source links, and same-package migration options. It also distinguishes directly comparable speed and temperature variants from different-package devices that cannot be treated as drop-in replacements.
드롭인 대체품: XC7A15T-3FTG256E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A15T-3FTG256E (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Logic Cells, Package.
XC7A15T-2FTG256C
✅ 드롭인가격 문의
데이터시트 보기 →XC7A15T-1FTG256I
✅ 드롭인가격 문의
데이터시트 보기 →XC7A15T-3FTG256E 최대 정격 & 전기적 특성
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 16,640 cells |
| Adaptive Logic Modules | 2,600 ALMs |
| LAB/CLB Count | 1,300 LABs/CLBs |
| Embedded Memory | 921,600 RAM bits |
| User I/O | 170 I/O |
| Core Supply Voltage | 1 V |
| Process Technology | 28 nm |
| 패키지 | 256-pin FTG256 BGA |
| 실장 유형 | Surface Mount |
| Series | Artix-7 |
| Speed Grade | -3 |
| Temperature Grade | Extended |
| Device Family | XC7A15T |
| Packaging | Tray |
| Programmable Logic | FPGA |
| Pricing | From 16.359 USD as of 2026-10-29 |
XC7A15T-3FTG256E 256-pin ftg256 bga 핀 구성 가이드
XC7A15T-3FTG256E(256-pin ftg256 bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7A15T-3FTG256E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7A15T-3FTG256E 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Test and Measurement Instrumentation, Communications and Protocol Bridging, Embedded Video and Image Processing, Sensor Processing and Acquisition, Prototyping and Education Platforms.
Industrial Automation and Control
The AMD XC7A15T-3FTG256E suits industrial automation systems that require parallel digital control, timing-critical logic, and multiple external interfaces. Its 16,640 logic cells provide room for control state machines, communication bridges, and sensor aggregation, while the 170 I/O support encoder inputs, actuator outputs, and fieldbus interfaces. The extended-temperature ordering option is relevant to equipment operating beyond commercial conditions, although the final environmental qualification must follow the system specification. Designers should use the -3 timing constraints during implementation and verify power sequencing, decoupling, and industrial EMC requirements using the AMD family documentation.
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Test and Measurement Instrumentation
The XC7A15T-3FTG256E can implement parallel acquisition logic, trigger sequencing, pattern generation, and data-processing pipelines in a compact FPGA-based instrument. Its 921,600 RAM bits provide usable buffer storage for captured samples, while 16,640 logic cells support control and transformation stages. The -3 speed grade is useful when timing closure requires more margin than the -2 alternative. For precision instrumentation, the design must still address analog conditioning, clock jitter, grounding, calibration, and signal integrity separately from the FPGA. Verify all pin constraints against the FTG256 package files before committing the PCB.
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Communications and Protocol Bridging
The AMD XC7A15T-3FTG256E is suitable for low-cost communications equipment that requires protocol conversion, packet buffering, or parallel-to-serial interface bridging. The 170 user I/O allow multiple data buses and control signals to be connected without using a large package, while 921,600 RAM bits can support packet queues and transmit buffers. The 1 V core supply and 28 nm Artix-7 architecture suit compact, power-conscious designs. Clock-domain crossings, transceiver characteristics, impedance-controlled routing, and protocol-specific timing must be engineered around the selected external components and verified against the AMD timing data.
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Embedded Video and Image Processing
The XC7A15T-3FTG256E provides enough programmable logic for modest image-processing pipelines, pixel routing, exposure timing, and display-interface control. Its 16,640 cells can implement parallel processing stages, while the 921,600 RAM bits offer line buffers or small frame storage where full-frame buffering is unnecessary. The 170 I/O support camera inputs, synchronization, and display interfaces when suitable external PHY devices are used. High-speed video links require disciplined length matching, controlled-impedance routing, clean clocking, and careful BGA escape routing. The -3 grade provides a timing-performance option, subject to actual speed-grade limits in the manufacturer data sheet.
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Sensor Processing and Acquisition
The AMD XC7A15T-3FTG256E fits sensor-acquisition systems that need simultaneous sampling coordination, digital filtering, calibration tables, and local decision logic. The 170 I/O can connect multiple sensors and digital interfaces, while the available RAM supports FIFOs, calibration coefficients, and working buffers. The extended-temperature suffix makes the ordering code relevant for industrial sensing environments, but system-level environmental testing remains necessary. Designers should isolate analog inputs appropriately, establish deterministic clocking, decouple every required supply rail, and verify FTG256 ball assignments using AMD’s official package files before fabrication.
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Prototyping and Education Platforms
The XC7A15T-3FTG256E is practical for FPGA prototyping, digital-logic education, and embedded-systems experimentation because it combines 16,640 logic cells, embedded RAM, and 170 I/O in a single device. Students can implement processors, protocol engines, digital filters, and custom peripherals while gaining experience with BGA layout and AMD FPGA workflows. The -3 speed grade is useful for timing-sensitive demonstrations. Prototype boards should nevertheless provide robust power distribution, accessible configuration methods, expansion interfaces, and careful BGA escape routing so the learning platform remains reliable after repeated programming and handling.
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추천 제품 요약
엔지니어링 참조 데이터: XC7A15T-3FTG256E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A15T-2FTG256C | XC7A15T-1FTG256I |
|---|---|---|---|
| Brand | AMD | AMD | AMD |
| Package | FTG256 BGA | FTG256 BGA - same package | FTG256 BGA - same package |
| Logic Cells | 16,640 cells | 16,640 cells | 16,640 cells |
| LAB/CLB Count | 1,300 LABs/CLBs | 1,300 LABs/CLBs | 1,300 LABs/CLBs |
| Embedded Memory | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits |
| User I/O | 170 I/O | 170 I/O | 170 I/O |
| Speed Grade | -3 | -2, one grade slower | -1, two grades slower |
| Temperature Ordering Option | Extended | Commercial, 0°C to +85°C | Industrial |
| Process Technology | 28 nm | 28 nm | 28 nm |
| Programmable Logic | FPGA | FPGA | FPGA |
주요 차별점
- Higher speed-grade option within the same FTG256 migration path (vs XC7A15T-2FTG256C)
- Extended-temperature ordering option (vs XC7A15T-2FTG256C)
- Same-density same-package baseline for controlled migration (vs XC7A15T-1FTG256I)
설계 노트
Design the FTG256 footprint around the official AMD package pinout files rather than a generic 256-ball BGA symbol. Confirm ball pitches, power and ground assignments, configuration pins, and the FTG256-specific mechanical drawing. The verified data confirms a 256-pin FTG256 package but does not provide a complete ball table, so use AMD’s official package file before routing power, signals, or the PCB stack-up.
Treat the 1 V core rail as a high-current digital supply requiring short return paths and local decoupling. Follow the manufacturer’s recommended capacitor values, voltage tolerances, power-up sequence, and current limits; these details are not present in the verified search data and therefore must not be guessed. Connect ground balls through multiple nearby vias and avoid placing sensitive analog routing beneath switching or high-current power paths.
BGA escape routing should prioritize configuration signals, clocks, high-speed interfaces, and supply connections. Use a stack-up that supports the selected escape strategy, maintain the fabricator’s via and pad rules, and validate differential or length-sensitive routes with the intended FPGA speed grade. The -3 device has less timing margin available than slower-grade alternatives, so post-route timing analysis should use the exact XC7A15T-3 device constraints.
Do not treat family-name similarity as proof of drop-in compatibility. XC7A15T-1FGG484I and XC7A15T-2CSG325C use different packages from the FTG256 target and were therefore excluded from the drop-in list. For any accepted migration, compare package drawings, speed grade, temperature grade, I/O standards, configuration pins, power rails, timing constraints, and the generated bitstream before production release.
규정 준수 정보
The verified web results did not contain explicit compliance statements for the exact XC7A15T-3FTG256E ordering code. The E suffix denotes the extended-temperature option and does not by itself establish AEC-Q100 qualification.
