XC7A15T-2FTG256C - 16,640 LEs Artix-7 FPGA | AMD
Référence : XC7A15T-2FTG256C ✓ ActifXC7A15T-2FTG256C Présentation
An FPGA is a reconfigurable digital semiconductor in which the logic, interconnections, and processing resources are configured after manufacture. Within the product hierarchy, the XC7A15T belongs to the Artix-7 FPGA family and combines a programmable logic array, block RAM, DSP resources, and general-purpose input/output blocks in one device. This integration allows designers to implement parallel data processing, control logic, protocol bridging, and interface functions on a single programmable chip.
The principal verified device figures are 16,640 logic cells, 921,600 RAM bits, 170 I/O, and a 256-LBGA package. The -2 designation identifies its performance grade within the Artix-7 family. Its low-cost and power-efficient positioning makes it relevant to industrial automation, machine vision, telecommunications infrastructure, protocol conversion, baseband processing, wireless backhaul, and embedded control systems. The 256-LBGA package also supports compact, high-density board layouts.
Technically, the device combines programmable logic fabric with dedicated memory and DSP blocks, allowing multiple data paths to be processed concurrently. The large 170-I/O count provides substantial connectivity for external memory, sensors, network transceivers, display interfaces, and control peripherals. Its 921,600 RAM bits support buffering and data storage within the FPGA fabric, while the dedicated DSP capability enables fixed-point filtering, transform, and signal-processing functions without requiring separate accelerators.
Typical implementations place the FPGA beside high-speed transceivers, external memory, clock sources, and application-specific peripherals. Machine-vision designs can parallelize image acquisition and filtering, telecom equipment can perform line-card adaptation or protocol bridging, and industrial controllers can combine sensor acquisition with deterministic logic. Because FPGA resources are configurable, the same family can support multiple product variants without changing the PCB footprint when device density and speed-grade requirements permit.
Designers should review the manufacturer Artix-7 datasheet and package pinout files before assigning bank voltages, clock pins, high-speed serial pins, and power rails. Decoupling, PCB return paths, thermal management, configuration interface access, and proper I/O standard selection are critical to reliable implementation. Although the 256-LBGA offers high I/O density, its fine-pitch routing and power-delivery requirements demand careful constraint-driven layout and multilayer PCB planning.
This product data combines verified distributor pricing, Artix-7 family specifications, package information, and practical engineering guidance. It also distinguishes true same-package drop-in options from broader functional FPGA alternatives, helping engineers shortlist a device while still validating timing, power, configuration, and lifecycle requirements against the official AMD documentation.
Alternatives de remplacement direct pour XC7A15T-2FTG256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A15T-2FTG256C (même facteur de forme et même empreinte) — différant par Package, Device Type, Temperature Grade, Logic Cells, Speed Grade.
XC7A15T-1FTG256C
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A15T-1FTG256E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A15T-2FTG256E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A15T-3FTG256C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A15T-3FTG256E
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A15T-2FTG256C Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 16,640 logic cells |
| RAM Capacity | 921,600 RAM bits |
| Input/Output Count | 170 I/O |
| Performance Grade | -2 speed grade |
| Boîtier | 256-LBGA |
| Temperature Range | 0°C to +85°C |
| Logic Process | 28 nm |
| Type de montage | Surface mount |
Guide de configuration des broches du XC7A15T-2FTG256C 256-lbga
Configuration des broches du XC7A15T-2FTG256C (boîtier 256-lbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A15T-2FTG256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A15T-2FTG256C convient pour 6 applications: Industrial Machine Vision, Industrial Protocol Bridging, Telecommunications Line Cards, Wireless Backhaul Data Processing, Embedded Control and Automation, Test and Measurement Instrumentation.
Industrial Machine Vision
The XC7A15T-2FTG256C fits machine-vision preprocessing because its 16,640 logic cells and DSP capability can process multiple pixel streams in parallel. The 170 I/O provide connections to image sensors, line-scan or frame-capture electronics, trigger inputs, and machine-vision controllers. Placing the FPGA between the camera interface and the processor allows exposure, geometry, filtering, and thresholding stages to be consolidated. The -2 speed grade should be selected only after worst-case image-pipeline timing is verified, while the 0°C to +85°C range suits commercial factory equipment.
Recommandé
Industrial Protocol Bridging
The XC7A15T-2FTG256C is appropriate for protocol converters that translate between industrial fieldbus, serial, and parallel interfaces. Its 16,640 logic cells can host parallel-to-serial converters, packetization logic, state machines, and diagnostics, while 170 I/O expand connection options. The commercial 0°C to +85°C specification covers typical indoor control cabinets, and the -2 grade provides a defined performance target for deterministic packet processing. Engineers should validate timing against the slowest required interface and include recovery behavior for malformed or interrupted traffic.
Recommandé
Telecommunications Line Cards
The XC7A15T-2FTG256C can implement cost-sensitive line-card functions such as protocol adaptation, baseband preprocessing, framing, and traffic aggregation. Its programmable fabric supports parallel datapaths, 921,600 RAM bits provide on-chip buffering, and 170 I/O enable dense connectivity to backplane and transceiver circuitry. The -2 performance grade must be checked against the required line rate and worst-case packet latency. Because the device is rated from 0°C to +85°C, outdoor or uncontrolled telecom environments require an extended-temperature grade or additional environmental protection.
Recommandé
Wireless Backhaul Data Processing
The XC7A15T-2FTG256C is suitable for packet processing, time alignment, and control logic around wireless-backhaul radio links. Its DSP resources can accelerate filtering or symbol-processing stages, while the programmable fabric handles scheduling, headers, monitoring, and interface conversion. The 170-I/O count supports radio control, status signals, clocks, and high-speed data paths, and the 256-LBGA keeps the implementation compact. Designers should budget timing closure for the -2 grade and isolate sensitive clock and transceiver paths to prevent data-conversion errors.
Recommandé
Embedded Control and Automation
The XC7A15T-2FTG256C supports parallel embedded-control tasks that combine sensors, counters, state machines, communications, and safety-adjacent interlocks in one programmable device. Its 16,640 logic cells and 921,600 RAM bits accommodate concurrent control channels without requiring a separate microcontroller for every function. The 170 I/O provide broad sensor and actuator connectivity, while the -2 grade targets predictable operational performance. Before deployment, verify interrupt latency, I/O standards, clock tolerance, and recovery behavior under power-up or configuration fault conditions.
Recommandé
Test and Measurement Instrumentation
The XC7A15T-2FTG256C can implement timing, pattern-generation, data-capture, and analysis logic in compact instrumentation. Its 16,640 logic cells provide parallel digital channels, 921,600 RAM bits support sample buffering, and 170 I/O permit connection to test fixtures and control interfaces. The -2 grade must meet the instrument's specified throughput, and the commercial temperature range limits direct use in hot industrial environments. Synchronization of clock domains, deterministic I/O timing, and calibration data are the principal implementation concerns.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A15T-2FTG256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A15T-1FTG256C | XC7A15T-1FTG256E | XC7A15T-2FTG256E | XC7A15T-3FTG256C | XC7A15T-3FTG256E |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FTG256) | FTG256, same package configuration | FTG256, same package configuration | FTG256, same package configuration | FTG256, same package configuration | FTG256, same package configuration |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Logic Cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells | 16,640 logic cells |
| RAM Capacity | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits | 921,600 RAM bits |
| Input/Output Count | 170 I/O | 170 I/O | 170 I/O | 170 I/O | 170 I/O | 170 I/O |
| Speed Grade | -2 | -1 | -1 | -2 | -3 | -3 |
| Temperature Grade | Commercial, 0°C to +85°C | Commercial | Extended temperature | Extended temperature | Commercial | Extended temperature |
| Logic Process | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Principaux différenciateurs
- Commercial-temperature Artix-7 option with the -2 speed grade (vs XC7A15T-1FTG256C)
- Same speed grade with extended-temperature qualification (vs XC7A15T-2FTG256E)
- Higher timing headroom for critical-path designs (vs XC7A15T-3FTG256C)
- Verified compact configuration with substantial I/O density (vs XC7A35T-1FTG256I)
Notes de conception
Use the AMD FTG256 package pinout as the authority for every land, via, and component symbol. The 256-LBGA footprint requires exact ball geometry and a multilayer PCB with short power and ground connections. Place high-speed clocks and serial interfaces away from noisy switching nodes, provide continuous reference planes, and constrain all differential and clock routes. Verify ball assignments against the selected speed and temperature suffix before releasing the PCB.
Partition the design into the voltage rails required by the Artix-7 datasheet and assign each bank to a compatible I/O standard. Place local bulk and high-frequency decoupling close to the associated package balls, and keep switching-converter return currents out of sensitive reference paths. Because the supplied data does not include the complete power-consumption table, calculate worst-case static and dynamic demand from the actual implemented design rather than applying an unverified generic current value.
Reserve the configuration interface and pins required by the selected boot mode, then keep the configuration path away from potential sources of corruption. Plan termination, biasing, and I/O drive according to each external interface rather than applying a single termination strategy across all banks. For clocked interfaces, match trace lengths to the timing requirement and validate skew through post-layout timing analysis. The target's 170 I/O provide density, but unused pins should still be assigned a deliberate state in the constraints.
Do not treat a different Artix-7 density as a transparent drop-in replacement, and do not assume that a -1 or -3 speed grade is electrically and thermally equivalent to -2. A same-package alternative can still change timing margin, power behavior, and configuration support. After substitution, rerun synthesis, implementation, timing analysis, power estimation, and pin-level verification. Confirm the operating-temperature grade as well: the C suffix is commercial, while an E suffix changes the temperature qualification.
Informations de conformité
The supplied web data does not explicitly state compliance status for the target MPN. The commercial 0°C to +85°C temperature rating does not by itself establish AEC-Q100 qualification.
