XC7A35T-2FTG256C - 33,280-Cell Artix-7 FPGA | AMD
Référence : XC7A35T-2FTG256C ✓ ActifXC7A35T-2FTG256C Présentation
An FPGA is a programmable semiconductor that lets engineers define digital logic, interfaces, control algorithms, and parallel processing functions after manufacture. The Artix-7 family combines configurable logic blocks, programmable I/O, block RAM, digital signal processing resources, and dedicated clock-management blocks on one device. This combination places the XC7A35T-2FTG256C within the FPGA and programmable-logic hierarchy rather than the fixed-function logic-IC or microprocessor categories.
The verified listing identifies 33,280 logic cells and a -2 performance grade. Distributor records describe the device as an Artix-7 FPGA in a 256-LBGA package. Published Artix-7 information identifies the family as optimized for low power and cost at 28 nm. One distributor listing also highlights the family's packaging options and ease of migration between compatible family members, although pin assignments and power rails must still be checked against the specific package documents before any substitution is approved.
The FTG256 package supports a compact surface-mount implementation while providing numerous programmable connections for external memory, interfaces, clocks, and control peripherals. Because the supplied web data does not include the complete pin table, bank voltage limits, differential I/O standards, or recommended high-speed layout values, those details must be taken directly from AMD's XC7A35T datasheet and package pinout files before schematic or PCB release.
Typical design roles include low-cost control logic, parallel data acquisition, sensor aggregation, industrial automation, communications infrastructure, and compact embedded signal processing. The Artix-7 architecture is especially useful where a microcontroller cannot provide sufficient parallel throughput, where logic must be updated after manufacture, or where several fixed-function ICs would otherwise be combined to implement a custom datapath.
A critical design practice is to treat every complete XC7A35T-2FTG256C migration as a timing, power, and pinout verification exercise. The -2 speed grade should not be replaced by a -1 grade without checking worst-case timing closure, while larger-density devices in the same package can alter embedded resources even if the footprint remains unchanged. Confirm the exact device, package, temperature grade, and bonding or migration constraints in the AMD documentation.
This page consolidates the verified distributor identity, package, logic-cell count, price indication, source links, drop-in candidates, application guidance, and engineering trade-offs. The comparison material is intended to accelerate sourcing while making the remaining datasheet-dependent verification items explicit rather than presenting unsupported assumptions as specifications.
Alternatives de remplacement direct pour XC7A35T-2FTG256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A35T-2FTG256C (même facteur de forme et même empreinte) — différant par Package, Logic Cells, Block RAM, Device Type, Mounting Type.
XC7A35T-1FTG256C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC7A35T-2FTG256I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A35T-1FTG256I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A35T-1FT256I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A50T-2FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A35T-2FTG256C Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 33,280 cells |
| Number of I/Os | 170 I/Os (DigiKey and Octopart listings) |
| Alternate I/O Count Listing | 100 I/Os (Newark listing) |
| Process Technology | 28 nm |
| Speed Grade | -2 |
| Package Type | FTG256, 256-ball low-profile BGA (256-LBGA) |
| Device Family | Artix-7 |
| Architecture | 28 nm FPGA |
| Product Classification | IC FPGA 170 I/O 256FTBGA |
| Programming Technology | Reconfigurable FPGA logic |
| Surface-Mount Form | Surface Mount |
| Lead-Free Packaging Availability | Available in Pb-free package options |
Guide de configuration des broches du XC7A35T-2FTG256C ftg256, 256-ball low-profile bga (256-lbga)
Configuration des broches du XC7A35T-2FTG256C (boîtier ftg256, 256-ball low-profile bga (256-lbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A35T-2FTG256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A35T-2FTG256C convient pour 6 applications: Industrial Automation and Control, Communications Infrastructure, Data Acquisition and Signal Conditioning, Embedded Security and Authentication, Test and Measurement Equipment, Compact Instrumentation and Portable Systems.
Industrial Automation and Control
The XC7A35T-2FTG256C fits compact industrial controllers that combine parallel sensor acquisition, machine-control logic, and communication interfaces in one programmable device. Its 33,280 logic cells provide substantial flexibility for implementing state machines, motion sequencing, and safety-adjacent monitoring without a fixed instruction set. The 256-LBGA package supports dense routing into compact control boards, while the -2 grade targets stronger timing performance than the -1 alternative. Before deployment, confirm the exact commercial or extended temperature suffix, applicable I/O voltage limits, and any sector-specific qualification requirements.
Communications Infrastructure
The XC7A35T-2FTG256C is suitable for custom communications equipment requiring adaptable packet handling, parallel data conversion, or interface bridging. Programmable logic can implement protocol-specific state machines and line-rate transformations, while the -2 speed grade is preferable for designs with demanding clock-domain timing. The target provides 33,280 logic cells and 170 listed I/Os according to DigiKey and Octopart. However, the verified data does not state the available transceiver count, maximum clock, or supported I/O standards, so high-speed SerDes implementations require consultation of the complete Artix-7 device tables.
Data Acquisition and Signal Conditioning
The XC7A35T-2FTG256C can implement parallel ADC or sensor data acquisition, digital filtering, calibration, and real-time control in a single FPGA. Reconfigurable logic is useful when sample widths, channel counts, or conditioning pipelines evolve after hardware release. With 33,280 logic cells and a compact 256-ball BGA package, the device offers meaningful parallelism without requiring a large FPGA. Exact RAM, DSP-slice, and clock specifications were not present in the supplied records, so designers must map the required arithmetic and buffering resources against the complete AMD datasheet before selecting the part.
Embedded Security and Authentication
The XC7A35T-2FTG256C can implement hardware-assisted cryptographic engines, protocol accelerators, random-number logic, and secure boot-support functions that benefit from parallel fixed-function execution. Its programmable fabric allows security algorithms to be updated without changing the PCB, while 33,280 logic cells provide capacity for combining multiple datapaths. The 256-LBGA format enables compact integration with processors and external memory. Designers should separately verify side-channel-resistance requirements, temperature range, device lifecycle commitments, and certification obligations, because these factors are not established by the provided distributor data.
Test and Measurement Equipment
The XC7A35T-2FTG256C is applicable to custom instrumentation that requires simultaneous pattern generation, timing control, data capture, and real-time analysis. Parallel programmable logic can coordinate multiple channels more flexibly than a general-purpose microcontroller, while the -2 speed grade supports timing-sensitive implementations when properly constrained. The verified 33,280-cell capacity offers a useful balance of fabric and package density for compact bench or portable equipment. Exact high-speed I/O and clocking limits remain unavailable in the supplied snippets and must be checked against the complete Artix-7 data sheet.
Compact Instrumentation and Portable Systems
The XC7A35T-2FTG256C fits portable and compact embedded systems where power, board area, and updateability are important constraints. Its 28 nm Artix-7 implementation is positioned by AMD as a low-cost, low-power FPGA family, and the 256-LBGA package minimizes lead count compared with leaded packages. The device can consolidate acquisition, control, and interface logic while retaining post-deployment programmability. The supplied information does not provide a device-specific power figure or exact operating-temperature range, so battery-life calculations and enclosure-temperature qualification must use the AMD power, thermal, and ordering documentation.
Données de référence d'ingénierie pour XC7A35T-2FTG256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A35T-1FTG256C | XC7A35T-2FTG256I | XC7A35T-1FTG256I | XC7A35T-1FT256I | XC7A50T-2FTG256C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FTG256 (256-LBGA) | FTG256 (256-LBGA) - same | FTG256 (256-LBGA) - same | FTG256 (256-LBGA) - same | FTG256 (256-LBGA) - same | FTG256 (256-LBGA) - same |
| Device Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Logic Cells | 33,280 cells | 33,280 cells | 33,280 cells | 33,280 cells | 33,280 cells | 52,160 cells |
| Speed Grade | -2 | -1, slower than target | -2 | -1, slower than target | -1, slower than target | -2 |
| Process Technology | 28 nm | 28 nm Artix-7 generation | 28 nm Artix-7 generation | 28 nm Artix-7 generation | 28 nm Artix-7 generation | 28 nm Artix-7 generation |
| Special Ordering Option | Commercial C suffix | Commercial C suffix with -1 speed grade | I suffix with -2 speed grade | I suffix with -1 speed grade | I suffix with -1 speed grade | Commercial C suffix with -2 speed grade |
Principaux différenciateurs
- Faster speed grade than the documented -1 FTG256 alternative (vs XC7A35T-1FTG256C)
- Lower logic-cell demand for designs that do not require the 50T capacity upgrade (vs XC7A50T-2FTG256C)
- Commercial C ordering option (vs XC7A35T-2FTG256I)
- Verified distributor availability and price indication (vs XC7A35T-1FTG256C)
Notes de conception
Do not treat a shared FTG256 footprint as proof that every 35T or 50T ordering code is automatically interchangeable. The verified search identifies XC7A35T-1FTG256C as slower and XC7A50T-2FTG256C as a higher-density option. Before substitution, compare the AMD package pinout, power rails, I/O standards, bank constraints, embedded-resource usage, and temperature suffix. Re-run synthesis, placement, routing, and post-route timing rather than relying on footprint similarity alone.
The supplied data identifies a 28 nm Artix-7 process but does not provide the target's static and dynamic power values, so a defensible supply calculation cannot be produced from the supplied records. Use the AMD XC7A35T power estimator with the actual clocking, I/O activity, temperature, and utilization. In particular, include configuration-access current, auxiliary rails, and I/O loading because these can materially affect a compact embedded design's thermal budget.
Use AMD's FTG256 package drawing and Artix-7 package pinout files to establish ball coordinates, power distribution, and decoupling requirements. Place supply and ground connections directly according to the official recommendations, use short return paths for high-speed interfaces, and preserve the ball-grid escape channels. Exact via, antipad, and layer-transition rules are not included in the supplied records and must not be guessed from a generic BGA layout guideline.
The verified snippets provide no device-specific junction-temperature, power, or thermal-resistance data for the XC7A35T-2FTG256C. Therefore, estimate junction rise only after obtaining the official thermal data and the board-specific thermal model. Preserve exposed underside copper where the package permits it, distribute high-current connections across multiple balls, and avoid concentrating regulator or switching-converter heat adjacent to temperature-sensitive routing without an airflow study.
Informations de conformité
The LCSC listing states that Artix-7 packages are available in Pb-free options and that selected packages are also offered in a leaded option. Exact RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals statements for this ordering code were not supplied and remain unknown.
