XC7A35T-2FTG256C vs XC7A35T-2FTG256I Comparaison
Comparaison détaillée côte à côte de XC7A35T-2FTG256C par AMD et XC7A35T-2FTG256I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC7A35T-2FTG256C | XC7A35T-2FTG256I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 33,280 cells | 33,280 |
| Number of I/Os | 170 I/Os (DigiKey and Octopart listings) | — |
| Alternate I/O Count Listing | 100 I/Os (Newark listing) | — |
| Process Technology | 28 nm | — |
| Speed Grade | -2 | -2 |
| Package Type | FTG256, 256-ball low-profile BGA (256-LBGA) | — |
| Device Family | Artix-7 | — |
| Architecture | 28 nm FPGA | — |
| Product Classification | IC FPGA 170 I/O 256FTBGA | — |
| Programming Technology | Reconfigurable FPGA logic | — |
| Surface-Mount Form | Surface Mount | — |
| Lead-Free Packaging Availability | Available in Pb-free package options | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | 1,843,200 bits (50 x 36 Kb blocks) |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| Fréquence d'horloge maximale | [DATA_NEEDED: maximum clock frequency] | — |
| I/O Standard Support | [DATA_NEEDED: supported I/O standards] | — |
| Family | — | Artix-7 |
| Slices | — | 5,200 |
| DSP48E1 Slices | — | 90 |
| User I/Os (max in FTBGA-256) | — | 170 |
| Clock Management Tiles (CMTs) | — | 4 (1 MMCM + 2 PLLs each) |
| GTP Transceivers | — | 4 (up to 6.6 Gb/s) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Process Node | — | 28 nm HKMG |
| Boîtier | — | 256-ball FTBGA (FTG256) |
| Type de montage | — | Surface Mount (BGA) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Lead-free | — | Yes |