XC7A75T-2FGG484I - Artix-7 FPGA, 75K Logic Cells | AMD
Référence : XC7A75T-2FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $74.87 | $74,87 |
| 10 | $71.13 | $711,30 |
| 100 | $67.38 | $6 738,00 |
| 500 | $63.64 | $31 820,00 |
| 1 000 | $59.89 | $59 890,00 |
XC7A75T-2FGG484I Présentation
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that implements digital logic by configuring a fabric of LUTs, flip-flops, block RAM, and DSP slices through a bitstream. FPGAs fill the design gap between ASSPs and ASICs: they provide parallel execution, low-latency I/O, and field upgradeability. In a system hierarchy, the FPGA often sits beside an embedded processor, handling high-throughput signal conditioning while the processor runs control stacks.
Key features of the XC7A75T-2FGG484I include 3,870,720 block RAM bits, 285 versatile user I/Os with LVCMOS/LVDS and other standard interfaces, and integrated clock management tiles containing MMCM and PLL circuits. The FGG484 package enables easy migration between selected Artix-7 family members, reducing redesign risk when scaling density. All packages are lead-free (Pb-free) options.
The Artix-7 architecture is optimized for low-power, cost-sensitive applications while retaining DDR3/DDR4 memory interfaces, multi-gigabit transceivers where available, and PCIe hard blocks in larger devices. The 28nm high-k metal gate process balances static and dynamic power. Designers use AMD Vivado Design Suite for synthesis, implementation, and bitstream generation, with support for IP cores such as MIG, AXI interconnects, and error correction.
Typical applications for the XC7A75T-2FGG484I include industrial motor control and factory automation, software-defined radio baseband processing, machine vision and video pipelines, medical imaging front ends, and test and measurement instrumentation. The industrial temperature range makes it suitable for harsh environments in transportation, energy, and rugged communications.
When designing with this FPGA, pay close attention to power integrity: decouple the 1.0V VCCINT rail with multiple low-ESR ceramic capacitors and follow AMD's PCB design recommendations. The FGG484 package must be assembled with proper BGA reflow profiles, and the JTAG/configuration pins should be made accessible for system-level debug and field updates.
Alternatives de remplacement direct pour XC7A75T-2FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A75T-2FGG484I (même facteur de forme et même empreinte) — différant par Block RAM, Process Technology, Logic Cells, Core Supply Voltage, I/O Standards.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A75T-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-1FGG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A75T-1FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XA7A75T-1FGG484Q
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A100T-2FGG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$45.9375 / unité
Voir la fiche technique →XC7A50T-2FGG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$27.5 / unité
Voir la fiche technique →XC7A75T-2FGG484I Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Logic Cells | 75520 |
| User I/O | 285 |
| Block RAM | 3870720 bits |
| Boîtier | 484-ball FBGA (FGG484) |
| Process Technology | 28nm CMOS |
| Core Supply Voltage | 1 V |
| Speed Grade | -2 |
| Température de fonctionnement | -40C to +100C (industrial) |
| Clock Management | MMCM and PLL |
| I/O Standards | LVCMOS, LVDS and others |
| Type de montage | Surface Mount (BGA) |
| Lead Free | Yes (Pb-free package) |
| Design Software | AMD Vivado Design Suite |
Configuration des broches de XC7A75T-2FGG484I
| Broche A2 | VCCINT — 1.0V core supply |
| Broche B1 | GND — Ground |
| Broche F2 | VCCAUX — 1.8V auxiliary supply |
| Broche H4 | TCK — JTAG test clock |
| Broche H5 | TDI — JTAG test data in |
| Broche J4 | TDO — JTAG test data out |
| Broche J5 | TMS — JTAG test mode select |
| Broche K4 | IO_LxxP — User I/O bank 13 (example LVDS P pair) |
| Broche K5 | IO_LxxN — User I/O bank 13 (example LVDS N pair) |
| Broche L2 | CCLK — Configuration clock |
| Broche M1 | DONE — Configuration done indicator |
| Broche M2 | PROGRAM_B — Configuration reset (active low) |
Applications typiques
XC7A75T-2FGG484I convient pour 6 applications: Industrial Motor Control and Factory Automation, Software-Defined Radio Baseband, Machine Vision and Video Pipelines, Medical Imaging Front Ends, Test and Measurement Instrumentation, Rugged Communications and Transportation.
Industrial Motor Control and Factory Automation
The XC7A75T-2FGG484I fits industrial motor control because its 285 user I/Os and 75,520 logic cells let engineers implement multi-axis PWM generation, encoder decoding, and safety interlocks in parallel with deterministic latency. The industrial -40C to +100C rating survives cabinet environments near drives and hot factories. Placed as a real-time co-processor beside a main controller, it closes high-speed current loops in the fabric while the host runs supervisory logic; the -2 speed grade provides timing margin for dense PWM and filter pipelines at high switching frequencies.
Recommandé
Software-Defined Radio Baseband
For SDR, the XC7A75T-2FGG484I supplies 3,870,720 block RAM bits for buffering ADC/DDC streams and abundant DSP-friendly fabric for filters and mixers at baseband rates. The 28nm process keeps static power low for radio units with thermal budgets, while the FGG484 package offers enough I/O to attach wide parallel LVDS ADC and DAC buses. Designers typically pair the device with high-speed data converters and use Vivado IP for channelization; the -2 speed grade sustains the parallel sample pipelines demanded by modern wideband receivers.
Recommandé
Machine Vision and Video Pipelines
The XC7A75T-2FGG484I suits machine vision because its block RAM and fabric can implement image preprocessing, frame buffering, and camera-protocol bridges (such as parallel/LVDS sensor interfaces) with line-rate latency. The 285 I/Os handle sensor, memory, and display connections without external glue logic, and the industrial temperature range suits factory-floor enclosures. Implemented with DDR3 memory via Vivado MIG IP, the FPGA pipelines pixel operations deterministically; the -2 grade gives setup margin for high pixel-clock paths in 1080p-class inspection systems.
Recommandé
Medical Imaging Front Ends
Medical ultrasound and imaging front ends benefit from the XC7A75T-2FGG484I's ability to aggregate multiple ADC channels over LVDS, apply beamforming and filtering in fabric, and stream results to a processor. The 3.87 Mbit of block RAM supports per-channel sample buffering, while the 28nm process limits power in fanless enclosures. The industrial temperature grade tolerates extended warm environments typical of imaging hardware; the -2 speed grade provides the parallel timing headroom needed for high-channel-count coherent processing paths.
Recommandé
Test and Measurement Instrumentation
Bench and modular instruments use the XC7A75T-2FGG484I for real-time triggering, protocol generation, and data-path acceleration. Its 285 I/Os interface to front-end converters, relays, and backplane connectors, and MMCM/PLL tiles generate low-jitter sample clocks across multiple domains. The industrial -40C to +100C rating supports calibration-tolerant thermal environments, and Vivado IP accelerates instrument firmware development. The FGG484 footprint also allows seamless migration to XC7A100T when instrument channel density grows.
Recommandé
Rugged Communications and Transportation
The XC7A75T-2FGG484I is used in rugged radios, railway, and energy-infrastructure equipment where the -40C to +100C industrial grade and Pb-free FGG484 package meet environmental requirements. The fabric implements framing, FEC, and interface bridging with deterministic latency, while 75,520 logic cells accommodate multi-protocol support in a single device. Combined with isolated transceivers and wide-input power modules, the FPGA forms the digital core of systems exposed to vibration, temperature cycling, and noisy electrical environments in the field.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A75T-2FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A75T-2FGG484C | XC7A75T-1FGG484I | XC7A100T-2FGG484I |
|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484) | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 75520 | 75520 | 75520 | 101440 |
| Speed Grade | -2 | -2 | -1 | -2 |
| User I/O | 285 | 285 | 285 | 285 |
| Block RAM (bits) | 3870720 | 3870720 | 3870720 | 4838400 |
| Temperature Range | -40C to +100C (I) | 0C to +85C (C) | -40C to +100C (I) | -40C to +100C (I) |
| Core Voltage | 1 V | 1 V | 1 V | 1 V |
Principaux différenciateurs
- Industrial temperature grade at -2 speed (vs XC7A75T-2FGG484C)
- Fastest standard speed grade (vs XC7A75T-1FGG484I)
- Footprint-compatible migration to higher density (vs XC7A100T-2FGG484I)
Notes de conception
Decouple the 1.0V VCCINT rail with multiple low-ESR ceramic capacitors placed directly beneath the FGG484 package on via-in-pad connections. Follow AMD power distribution guidance (UG583) for rail sequencing and PDN impedance targets; VCCAUX at 1.8V and each VCCO bank also require local decoupling sized to bank transient current. Artix-7 power varies strongly with toggle rate, so run the Vivado power estimator with post-implementation activity data before finalizing the regulator selection.
The 484-ball FBGA requires a controlled reflow profile per the package assembly specification, with solder paste inspection on the 0.8mm or finer ball pitch land pattern. Route high-speed LVDS pairs with 100-ohm differential impedance and length matching. Use the AMD package pinout files (UG475 CSV/TXT) for symbol and footprint creation rather than hand-drawing the 484-ball map to avoid ball-mapping errors.
Make JTAG (TCK, TDI, TDO, TMS) and configuration pins (CCLK, DONE, PROGRAM_B) accessible via header for Vivado hardware debug and field bitstream updates - burying them forces full board rework on configuration faults. Verify speed-grade timing closure in Vivado before committing to the -2 SKU in production; migrating later between -1 and -2 is electrically drop-in but not timing-identical.
Informations de conformité
Lead-free (Pb-free) FGG484 package per AMD data and distributor listings (LCSC, DigiKey). REACH, halogen-free, and conflict minerals status not stated in provided data.
