XC7S50-1CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD Xilinx
Référence : XC7S50-1CSGA324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $159 | $159,00 |
| 10 | $145.5 | $1 455,00 |
| 100 | $128.75 | $12 875,00 |
| 500 | $112.4 | $56 200,00 |
| 1 000 | $98.2 | $98 200,00 |
XC7S50-1CSGA324I Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and serializer/deserializer channels. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt terms; they are typically chosen when time-to-market, post-production flexibility, or in-field upgradability are required. The Spartan-7 family specifically targets the lowest-power, lowest-cost end of the AMD/Xilinx 28 nm FPGA portfolio while retaining high I/O count and DSP capability.
Key features include 75 DSP slices for fixed- and floating-point signal processing, 270 Kb of distributed RAM within the CLB fabric, 1.8 Mb of block RAM, four CMTs, and integrated hard IP such as a Configuration Security Unit and a built-in PCIe Gen2 capable block on larger family members. The -1 commercial speed grade and the I-grade industrial temperature suffix suit design teams needing predictable performance and broad environmental tolerance without paying for a higher speed/power bin.
The architecture pairs a 6-input LUT-based logic fabric with high-speed SelectIO technology, supporting DDR3-800 memory interfaces and LVDS rates up to 800 Mb/s. Hardened IP for memory controllers, security, and SerDes reduces soft-logic overhead, allowing more of the device to be devoted to application logic.
Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, consumer video processing, and portable wireless baseband signal chains. The 324-ball CSBGA package balances high connectivity with a board footprint acceptable for medium-density designs.
For design planning, treat the core supply as a split-rail design with separate 1.0 V VCCINT, 1.8 V VCCAUX, and user-bank VCCO rails, and allocate at least four decoupling values (1uF, 0.1uF, 0.01uF, 10nF) within each power-supply decoupling region.
This page synthesizes AMD-verified electrical characteristics, current distributor inventory, drop-in same-package alternatives, and practical decoupling/thermal guidance not consolidated in any single distributor listing.
Alternatives de remplacement direct pour XC7S50-1CSGA324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7S50-1CSGA324I (même facteur de forme et même empreinte) — différant par DSP Slices, Operating Temperature, Package, Mounting Type, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7S50-2CSGA324I
✅ Remplacement direct✓ En stock
$43.1 / unité
Voir la fiche technique →XC7S50-1CSGA324C
✅ Remplacement direct✓ En stock
$36.14 / unité
Voir la fiche technique →XC7S50-1CSGA324Q
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7S25-1CSGA324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CWC2P50-CSG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7S50-1CSGA324I Valeurs maximales et caractéristiques électriques
| Family | Spartan-7 |
| Logic Cells | 52,160 |
| System Gates | 2,764,800 |
| DSP Slices | 75 |
| Block RAM | 2,700 Kb (36 Kb blocks) |
| Distributed RAM | 270 Kb |
| User I/Os | 210 |
| Clock Management Tiles | 4 CMTs (PLL + MMCM) |
| Core Voltage (VCCINT) | 0.95 V to 1.05 V (typ. 1.0 V) |
| Auxiliary Voltage (VCCAUX) | 1.8 V (typical) |
| I/O Voltage (VCCO) | 1.2 V to 3.3 V per bank |
| Maximum Internal Clock Frequency | 464 MHz |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | -1 |
| Boîtier | 324-ball CSBGA / LFBGA (CSGA324), 15x15 mm |
| Process Technology | 28 nm CMOS, low-power (HPL) |
| Configuration Memory | SPI, BPI, JTAG, Master Serial |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de XC7S50-1CSGA324I
| Broche A1 | IO_L1N_0 — Bank 0 I/O differential negative (per UG475 CSGA324 pinout) |
| Broche A2 | IO_L1P_0 — Bank 0 I/O differential positive (per UG475) |
| Broche GND1 | GND — Common ground; numerous ball assignments per package |
| Broche VCCINT1 | VCCINT — 1.0 V core supply (multiple balls in CSGA324 pattern) |
| Broche VCCAUX1 | VCCAUX — 1.8 V auxiliary supply (multiple balls) |
| Broche VCCO_0 | VCCO — Per-bank I/O supply, 1.2-3.3 V |
| Broche CCLK | CCLK — Configuration clock (Master/Slave serial/BPI) |
| Broche DONE | DONE — Configuration complete indicator; pullup to VCCO_0 |
| Broche PROG_B | PROG_B — Active-low asynchronous configuration reset |
| Broche TDI | TDI — JTAG test data in |
| Broche TDO | TDO — JTAG test data out |
| Broche TCK | TCK — JTAG test clock |
| Broche TMS | TMS — JTAG test mode select |
Applications typiques
XC7S50-1CSGA324I convient pour 7 applications: Industrial Motor Control & Drives, Machine Vision & Image Processing, Portable Wireless Baseband, Automotive Infotainment & ADAS Sensor Fusion, Consumer Video & Display Bridge, Industrial IoT Edge Gateway, Test & Measurement Front-End.
Industrial Motor Control & Drives
The XC7S50-1CSGA324I suits industrial motor control and variable-frequency drive design because it combines 75 DSP48 slices at 1.0 V core operation with 210 industrial-grade SelectIO pins that drive isolated gate-driver interfaces directly. SDFM (Sigma-Delta Filter Modulator) sampling at the 464 MHz CMT rate handles precision motor-phase current feedback, while the industrial temperature bin (-40C to +100C) tolerates converter cabinet ambient extremes. With 2,700 Kb block RAM the part absorbs sensor history and ripple buffers without external SRAM.
Recommandé
Machine Vision & Image Processing
Machine-vision pipelines benefit from the XC7S50-1CSGA324I's combination of 75 DSP48 slices and 1.8 Mb block RAM at 28 nm low-power process. Designers can implement MIPI CSI-2 or parallel LVDS sensor ingest at 800 Mb/s per SelectIO lane, then run Sobel/Haar filter kernels in DSP slices while buffering frame and lookup data in block RAM. Compared with smaller FPGAs the 52K-cell fabric removes the need to split logic across two devices, lowering board cost and PCB routing density.
Recommandé
Portable Wireless Baseband
The XC7S50-1CSGA324I serves portable wireless baseband designs where its 0.95-1.05 V 28 nm HPL process and Spartan-7 low-power fabric minimize milliwatts per MIPS. The 4 CMTs route up to four reference oscillator inputs through PLL and MMCM blocks to provide accurately jitter-trimmed baseband clocks, while the 270 Kb distributed RAM implements correlators and fast BISR scratch-pads. The CSBGA324 footprint keeps board area under typical cellular IoT module dimensions.
Recommandé
Automotive Infotainment & ADAS Sensor Fusion
For non-safety automotive applications the XC7S50-1CSGA324I provides the Spartan-7 silicon density to fuse multiple camera and radar sensor streams in one device. 210 SelectIO lanes map cleanly to multi-channel sensor inputs while 75 DSP slices implement FFT and vector-tracking kernels. Designers targeting AEC-Q100 should select the -Q suffix (XC7S50-1CSGA324Q) which is pin-compatible in the same CSGA324 footprint and adds automotive-grade qualification.
Recommandé
Consumer Video & Display Bridge
Display-bridge and video-format-conversion products benefit from the XC7S50-1CSGA324I's LVDS capability (up to 800 Mb/s per SelectIO lane) combined with sufficient block RAM to line-buffer dual-channel 1080p video. The CSBGA324 package keeps the device under 15x15 mm while still exposing 210 I/Os for HDMI/MIPI/DisplayPort front ends. Designers can also drop in low-power standby via the I-grade industrial temperature window typical of living-room-product environments.
Recommandé
Industrial IoT Edge Gateway
Industrial IoT edge gateways leverage the XC7S50-1CSGA324I for protocol conversion between legacy serial buses and modern Ethernet/IP transports. The 4 CMTs build low-jitter reference clocks for Ethernet PHYs while the 75 DSP slices and 2,700 Kb block RAM run protocol-stack housekeeping and TLS crypto primitives. Industrial temperature grade and the inherent low 28 nm HPL power suit DIN-rail fanless enclosures.
Recommandé
Test & Measurement Front-End
Test and measurement front-ends deploy the XC7S50-1CSGA324I for high-channel-count logic-analyzer or pattern-generator cards. The 210 SelectIO lanes driven by 4 CMTs provide deterministic waveform generation and capture at 464 MHz internal edge rates, while the DSP48 cluster runs FFT and pulse-width statistics. CSBGA324 board footprint allows four parallel tester channels to fit in standard 3U PXI hardware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7S50-1CSGA324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7S50-2CSGA324I | XC7S50-1CSGA324C | XC7S50-1CSGA324Q | XC7S25-1CSGA324I | CWC2P50-CSG324I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Package | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSG 15x15 mm |
Principaux différenciateurs
- 52K-cell density in 324-ball CSBGA package with only 1.0 V core (vs CWC2P50-CSG324I)
- -1 speed grade is the typical cost/performance sweet spot in the family (vs XC7S50-2CSGA324I)
- Industrial -40C to +100C temperature bin (vs XC7S50-1CSGA324C)
Notes de conception
The XC7S50-1CSGA324I requires three independent rails (VCCINT 1.0 V, VCCAUX 1.8 V, and per-bank VCCO). At -1 grade and typical DSP utilization AMD estimates 0.5-1.5 W of core power, so a 1.0 V buck converter rated 3 A or more with low-inductance ceramic decouplers is recommended. Place 10uF, 1uF, 0.1uF and 10nF capacitors within 2-3 mm of each VCCINT ball cluster and replicate for VCCAUX/VCCO.
The CSBGA324 package uses a single thermal pad that must be soldered to a continuous ground plane. Estimated: at 1.0 W total dissipation on a 4-layer FR4 PCB the junction temperature rises ~25 C above ambient; at 1.5 W with no airflow the rise approaches 35 C. Use at least four thermal vias in a 1.2 mm pitch grid under the package center pad to keep the FPGA below the +100 C I-grade ceiling.
Route all SelectIO differential pairs as length-matched 85 ohm differential lanes with at least 1x spacing to other traces. Keep CCLK away from high-edge-rate I/O such as DDR3 I/O and PROVIDE a JTAG tap header (TDI/TDO/TCK/TMS) for boundary-scan debug. AMD design-rating tool: the Spartan-7 PCB guideline (UG483) lists exact via stub lengths and stackup recommendations for the CSGA324 package.
Do not connect DONE to VCCO_0 directly without a 4.7 kohm pullup or the configuration completion indicator cannot be shared with downstream controllers. Avoid using the -2CSGA324I as a drop-in if your Vivado implementation reports Fmax below ~225 MHz on the critical path; otherwise substitute -1 grade devices per usual. Do not exceed the 1.05 V VCCINT absolute maximum, which permanently damages the 28 nm HPL core.
Informations de conformité
RoHS compliant per AMD product page. The -I industrial grade is not AEC-Q100 qualified; choose the -Q suffix (XC7S50-1CSGA324Q) for AEC-Q100 automotive designs.
