XC7S50-1CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD Xilinx
MPN: XC7S50-1CSGA324I ✓ Hoạt độngXC7S50-1CSGA324I Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and serializer/deserializer channels. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt terms; they are typically chosen when time-to-market, post-production flexibility, or in-field upgradability are required. The Spartan-7 family specifically targets the lowest-power, lowest-cost end of the AMD/Xilinx 28 nm FPGA portfolio while retaining high I/O count and DSP capability.
Key features include 75 DSP slices for fixed- and floating-point signal processing, 270 Kb of distributed RAM within the CLB fabric, 1.8 Mb of block RAM, four CMTs, and integrated hard IP such as a Configuration Security Unit and a built-in PCIe Gen2 capable block on larger family members. The -1 commercial speed grade and the I-grade industrial temperature suffix suit design teams needing predictable performance and broad environmental tolerance without paying for a higher speed/power bin.
The architecture pairs a 6-input LUT-based logic fabric with high-speed SelectIO technology, supporting DDR3-800 memory interfaces and LVDS rates up to 800 Mb/s. Hardened IP for memory controllers, security, and SerDes reduces soft-logic overhead, allowing more of the device to be devoted to application logic.
Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, consumer video processing, and portable wireless baseband signal chains. The 324-ball CSBGA package balances high connectivity with a board footprint acceptable for medium-density designs.
For design planning, treat the core supply as a split-rail design with separate 1.0 V VCCINT, 1.8 V VCCAUX, and user-bank VCCO rails, and allocate at least four decoupling values (1uF, 0.1uF, 0.01uF, 10nF) within each power-supply decoupling region.
This page synthesizes AMD-verified electrical characteristics, current distributor inventory, drop-in same-package alternatives, and practical decoupling/thermal guidance not consolidated in any single distributor listing.
Bộ thay thế dễ dàng lắp đặt cho XC7S50-1CSGA324I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC7S50-1CSGA324I (cùng hình factor và footprint) — khác nhau ở DSP Slices, Operating Temperature, Package, Mounting Type, Speed Grade.
XC7S50-2CSGA324I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC7S50-1CSGA324C
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC7S50-1CSGA324Q
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7S25-1CSGA324I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
CWC2P50-CSG324I
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC7S50-1CSGA324I Tỷ lệ tối đa & tính chất điện
| Family | Spartan-7 |
| Logic Cells | 52,160 |
| System Gates | 2,764,800 |
| DSP Slices | 75 |
| Block RAM | 2,700 Kb (36 Kb blocks) |
| Distributed RAM | 270 Kb |
| User I/Os | 210 |
| Clock Management Tiles | 4 CMTs (PLL + MMCM) |
| Core Voltage (VCCINT) | 0.95 V to 1.05 V (typ. 1.0 V) |
| Auxiliary Voltage (VCCAUX) | 1.8 V (typical) |
| I/O Voltage (VCCO) | 1.2 V to 3.3 V per bank |
| Maximum Internal Clock Frequency | 464 MHz |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Speed Grade | -1 |
| Hộp | 324-ball CSBGA / LFBGA (CSGA324), 15x15 mm |
| Process Technology | 28 nm CMOS, low-power (HPL) |
| Configuration Memory | SPI, BPI, JTAG, Master Serial |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Kiểu lắp đặt | Surface Mount (BGA) |
Cấu hình chân XC7S50-1CSGA324I
| Chân A1 | IO_L1N_0 — Bank 0 I/O differential negative (per UG475 CSGA324 pinout) |
| Chân A2 | IO_L1P_0 — Bank 0 I/O differential positive (per UG475) |
| Chân GND1 | GND — Common ground; numerous ball assignments per package |
| Chân VCCINT1 | VCCINT — 1.0 V core supply (multiple balls in CSGA324 pattern) |
| Chân VCCAUX1 | VCCAUX — 1.8 V auxiliary supply (multiple balls) |
| Chân VCCO_0 | VCCO — Per-bank I/O supply, 1.2-3.3 V |
| Chân CCLK | CCLK — Configuration clock (Master/Slave serial/BPI) |
| Chân DONE | DONE — Configuration complete indicator; pullup to VCCO_0 |
| Chân PROG_B | PROG_B — Active-low asynchronous configuration reset |
| Chân TDI | TDI — JTAG test data in |
| Chân TDO | TDO — JTAG test data out |
| Chân TCK | TCK — JTAG test clock |
| Chân TMS | TMS — JTAG test mode select |
Ứng dụng tiêu biểu
XC7S50-1CSGA324I phù hợp cho 7 Áp dụngs: Industrial Motor Control & Drives, Machine Vision & Image Processing, Portable Wireless Baseband, Automotive Infotainment & ADAS Sensor Fusion, Consumer Video & Display Bridge, Industrial IoT Edge Gateway, Test & Measurement Front-End.
Industrial Motor Control & Drives
The XC7S50-1CSGA324I suits industrial motor control and variable-frequency drive design because it combines 75 DSP48 slices at 1.0 V core operation with 210 industrial-grade SelectIO pins that drive isolated gate-driver interfaces directly. SDFM (Sigma-Delta Filter Modulator) sampling at the 464 MHz CMT rate handles precision motor-phase current feedback, while the industrial temperature bin (-40C to +100C) tolerates converter cabinet ambient extremes. With 2,700 Kb block RAM the part absorbs sensor history and ripple buffers without external SRAM.
Được đề xuất
Machine Vision & Image Processing
Machine-vision pipelines benefit from the XC7S50-1CSGA324I's combination of 75 DSP48 slices and 1.8 Mb block RAM at 28 nm low-power process. Designers can implement MIPI CSI-2 or parallel LVDS sensor ingest at 800 Mb/s per SelectIO lane, then run Sobel/Haar filter kernels in DSP slices while buffering frame and lookup data in block RAM. Compared with smaller FPGAs the 52K-cell fabric removes the need to split logic across two devices, lowering board cost and PCB routing density.
Được đề xuất
Portable Wireless Baseband
The XC7S50-1CSGA324I serves portable wireless baseband designs where its 0.95-1.05 V 28 nm HPL process and Spartan-7 low-power fabric minimize milliwatts per MIPS. The 4 CMTs route up to four reference oscillator inputs through PLL and MMCM blocks to provide accurately jitter-trimmed baseband clocks, while the 270 Kb distributed RAM implements correlators and fast BISR scratch-pads. The CSBGA324 footprint keeps board area under typical cellular IoT module dimensions.
Được đề xuất
Automotive Infotainment & ADAS Sensor Fusion
For non-safety automotive applications the XC7S50-1CSGA324I provides the Spartan-7 silicon density to fuse multiple camera and radar sensor streams in one device. 210 SelectIO lanes map cleanly to multi-channel sensor inputs while 75 DSP slices implement FFT and vector-tracking kernels. Designers targeting AEC-Q100 should select the -Q suffix (XC7S50-1CSGA324Q) which is pin-compatible in the same CSGA324 footprint and adds automotive-grade qualification.
Được đề xuất
Consumer Video & Display Bridge
Display-bridge and video-format-conversion products benefit from the XC7S50-1CSGA324I's LVDS capability (up to 800 Mb/s per SelectIO lane) combined with sufficient block RAM to line-buffer dual-channel 1080p video. The CSBGA324 package keeps the device under 15x15 mm while still exposing 210 I/Os for HDMI/MIPI/DisplayPort front ends. Designers can also drop in low-power standby via the I-grade industrial temperature window typical of living-room-product environments.
Được đề xuất
Industrial IoT Edge Gateway
Industrial IoT edge gateways leverage the XC7S50-1CSGA324I for protocol conversion between legacy serial buses and modern Ethernet/IP transports. The 4 CMTs build low-jitter reference clocks for Ethernet PHYs while the 75 DSP slices and 2,700 Kb block RAM run protocol-stack housekeeping and TLS crypto primitives. Industrial temperature grade and the inherent low 28 nm HPL power suit DIN-rail fanless enclosures.
Được đề xuất
Test & Measurement Front-End
Test and measurement front-ends deploy the XC7S50-1CSGA324I for high-channel-count logic-analyzer or pattern-generator cards. The 210 SelectIO lanes driven by 4 CMTs provide deterministic waveform generation and capture at 464 MHz internal edge rates, while the DSP48 cluster runs FFT and pulse-width statistics. CSBGA324 board footprint allows four parallel tester channels to fit in standard 3U PXI hardware.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho XC7S50-1CSGA324I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | XC7S50-2CSGA324I | XC7S50-1CSGA324C | XC7S50-1CSGA324Q | XC7S25-1CSGA324I | CWC2P50-CSG324I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Package | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSBGA 15x15 mm | 324-ball CSG 15x15 mm |
Bảo phân biệt quan trọng
- 52K-cell density in 324-ball CSBGA package with only 1.0 V core (vsCWC2P50-CSG324I)
- -1 speed grade is the typical cost/performance sweet spot in the family (vsXC7S50-2CSGA324I)
- Industrial -40C to +100C temperature bin (vsXC7S50-1CSGA324C)
Ghi chú thiết kế
The XC7S50-1CSGA324I requires three independent rails (VCCINT 1.0 V, VCCAUX 1.8 V, and per-bank VCCO). At -1 grade and typical DSP utilization AMD estimates 0.5-1.5 W of core power, so a 1.0 V buck converter rated 3 A or more with low-inductance ceramic decouplers is recommended. Place 10uF, 1uF, 0.1uF and 10nF capacitors within 2-3 mm of each VCCINT ball cluster and replicate for VCCAUX/VCCO.
The CSBGA324 package uses a single thermal pad that must be soldered to a continuous ground plane. Estimated: at 1.0 W total dissipation on a 4-layer FR4 PCB the junction temperature rises ~25 C above ambient; at 1.5 W with no airflow the rise approaches 35 C. Use at least four thermal vias in a 1.2 mm pitch grid under the package center pad to keep the FPGA below the +100 C I-grade ceiling.
Route all SelectIO differential pairs as length-matched 85 ohm differential lanes with at least 1x spacing to other traces. Keep CCLK away from high-edge-rate I/O such as DDR3 I/O and PROVIDE a JTAG tap header (TDI/TDO/TCK/TMS) for boundary-scan debug. AMD design-rating tool: the Spartan-7 PCB guideline (UG483) lists exact via stub lengths and stackup recommendations for the CSGA324 package.
Do not connect DONE to VCCO_0 directly without a 4.7 kohm pullup or the configuration completion indicator cannot be shared with downstream controllers. Avoid using the -2CSGA324I as a drop-in if your Vivado implementation reports Fmax below ~225 MHz on the critical path; otherwise substitute -1 grade devices per usual. Do not exceed the 1.05 V VCCINT absolute maximum, which permanently damages the 28 nm HPL core.
Thông tin tuân thủ
RoHS compliant per AMD product page. The -I industrial grade is not AEC-Q100 qualified; choose the -Q suffix (XC7S50-1CSGA324Q) for AEC-Q100 automotive designs.
