XC7VX415T-2FF1158I - Virtex-7 XT FPGA 412K Logic | AMD
Référence : XC7VX415T-2FF1158I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1895 | $1 895,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1620 | $162 000,00 |
| 500 | $1500 | $750 000,00 |
| 1 000 | $1400 | $1 400 000,00 |
XC7VX415T-2FF1158I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of configurable logic blocks (CLBs) connected via programmable interconnects, allowing them to implement arbitrary digital logic functions. They sit between ASICs (application-specific) and microprocessors (software-programmable) in the design hierarchy, offering hardware-level parallelism and reconfigurability. The Virtex-7 XT family is optimized for high-bandwidth, high-capacity applications.
Key features of the XC7VX415T-2FF1158I include 412,160 logic cells, 32,200 CLBs, and 32,440,320 total RAM bits for data buffering. It provides 350 user I/O pins supporting high-bandwidth interfaces, and the -2 speed grade offers a balance of performance and power. The device also includes integrated DSP slices and high-speed transceivers, though specific transceiver counts require datasheet confirmation. The 1156-ball FCBGA package with 1.00 mm pitch enables dense PCB routing.
Technically, the Virtex-7 XT architecture uses a 28nm high-k metal gate (HKMG) process, delivering high performance with lower power compared to older generations. The FPGA supports partial reconfiguration, advanced clock management, and a rich set of hard IP blocks. The -2 speed grade indicates a mid-range performance tier, suitable for designs that need high throughput without the power penalty of the fastest grade.
Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense signal processing, and high-performance computing. The high logic density and I/O count make it ideal for protocol bridging, packet processing, and beamforming. The industrial temperature range supports deployment in harsh environments.
When designing with this FPGA, ensure adequate power supply decoupling and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Refer to the AMD Virtex-7 datasheet for detailed power and thermal specifications.
Alternatives de remplacement direct pour XC7VX415T-2FF1158I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7VX415T-2FF1158I (même facteur de forme et même empreinte) — différant par Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7VX415T-2FFV1158I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7VX415T-1FF1158I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX415T-3FF1158I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX415T-2FFG1158I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8300 / unité
Voir la fiche technique →XC7VX415T-2FF1158C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX415T-2FF1158I Valeurs maximales et caractéristiques électriques
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| Configurable Logic Blocks (CLBs) | 32200 |
| Total RAM Bits | 32440320 |
| User I/O | 350 |
| Boîtier | 1156-BBGA, FCBGA |
| Terminal Pitch | 1.00 mm |
| Température de fonctionnement | -40°C to +100°C |
| Speed Grade | -2 |
| Type de montage | Surface Mount |
Configuration des broches de XC7VX415T-2FF1158I
| Broche A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Broche B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Broche B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Broche C1 | VCCINT — Internal core supply voltage |
| Broche C2 | GND — Ground |
| Broche D1 | VCCAUX — Auxiliary supply voltage |
| Broche D2 | GND — Ground |
| Broche E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Broche E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Broche F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Broche F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
Applications typiques
XC7VX415T-2FF1158I convient pour 6 applications: Wired Communications Infrastructure, Data Center Acceleration, Aerospace and Defense Signal Processing, High-Performance Computing (HPC), Medical Imaging and Diagnostics, Test and Measurement Equipment.
Wired Communications Infrastructure
The XC7VX415T-2FF1158I is ideal for wired communications equipment like switches, routers, and base stations. Its 412,160 logic cells and 32,440,320 RAM bits enable complex packet processing and protocol bridging. The 350 user I/O pins support high-bandwidth interfaces to PHYs and network processors. The -2 speed grade balances performance and power, suitable for 100G and 400G line cards. Designers can implement flexible MACs, schedulers, and traffic managers in the FPGA fabric, offloading the CPU. The industrial temperature range supports deployment in central offices and remote sites.
Recommandé
Data Center Acceleration
In data centers, the XC7VX415T-2FF1158I accelerates workloads like network function virtualization (NFV), storage, and AI inference. Its high logic density and DSP resources enable custom accelerators for encryption, compression, and search. The 350 I/O pins connect to high-speed SerDes and DDR memory interfaces. The FPGA's reconfigurability allows dynamic workload adaptation, improving resource utilization. The -2 speed grade provides a good trade-off between throughput and power, critical for rack-scale deployments. The industrial temperature range ensures reliable operation in dense server environments.
Recommandé
Aerospace and Defense Signal Processing
The XC7VX415T-2FF1158I is well-suited for aerospace and defense applications like radar, electronic warfare, and secure communications. Its 412,160 logic cells and DSP slices enable real-time beamforming, pulse compression, and FFT processing. The industrial temperature range (-40°C to +100°C) meets military environmental requirements. The 350 user I/O pins interface with high-speed ADCs and DACs. The FPGA's reconfigurability allows in-field updates for evolving threats. The -2 speed grade provides sufficient performance for demanding signal processing chains while managing power in space-constrained platforms.
Recommandé
High-Performance Computing (HPC)
In HPC systems, the XC7VX415T-2FF1158I accelerates scientific simulations, financial modeling, and genome sequencing. Its high logic density and DSP resources enable custom arithmetic units and dataflow engines. The 350 I/O pins connect to high-bandwidth memory and interconnects like InfiniBand. The FPGA's parallelism provides significant speedups over CPUs for specific workloads. The -2 speed grade balances performance and power, suitable for large-scale clusters. The industrial temperature range ensures reliability in data center environments.
Recommandé
Medical Imaging and Diagnostics
The XC7VX415T-2FF1158I is used in medical imaging systems like CT scanners, MRI, and ultrasound. Its 412,160 logic cells and DSP slices enable real-time image reconstruction, filtering, and enhancement. The 350 user I/O pins interface with high-speed sensors and display controllers. The FPGA's deterministic processing ensures consistent image quality. The -2 speed grade provides sufficient performance for real-time processing while managing power in medical equipment. The industrial temperature range supports operation in clinical environments.
Recommandé
Test and Measurement Equipment
The XC7VX415T-2FF1158I is ideal for test and measurement instruments like oscilloscopes, logic analyzers, and signal generators. Its high logic density and DSP resources enable custom trigger logic, data acquisition, and waveform generation. The 350 user I/O pins connect to high-speed ADCs and DACs. The FPGA's reconfigurability allows firmware updates for new measurement modes. The -2 speed grade provides a balance of performance and power, suitable for benchtop and modular instruments. The industrial temperature range ensures reliable operation in lab environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7VX415T-2FF1158I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7VX415T-2FFV1158I | XC7VX415T-1FF1158I | XC7VX415T-3FF1158I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 412160 | 412160 |
| Total RAM Bits | 32440320 | 32440320 | 32440320 | 32440320 |
| User I/O | 350 | 350 | 350 | 350 |
| Speed Grade | -2 | -2 (or -2V) | -1 | -3 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| Terminal Pitch | 1.00 mm | 1.00 mm | 1.00 mm | 1.00 mm |
Principaux différenciateurs
- Higher logic density than Kintex-7 (vs XC7K410T-2FB900I)
- Industrial temperature range (vs XC7VX415T-2FF1158C)
- Balanced speed grade (vs XC7VX415T-1FF1158I)
Notes de conception
The XC7VX415T-2FF1158I requires multiple supply rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management solution with proper sequencing. Refer to the AMD Virtex-7 datasheet for recommended voltage levels and decoupling capacitor values. Ensure adequate bulk capacitance to handle transient currents during configuration and operation.
The 1156-ball FCBGA package dissipates significant heat under load. Use a heatsink and forced airflow for high utilization designs. The industrial temperature range (-40°C to +100°C) requires careful thermal design to keep junction temperature within limits. Calculate power dissipation using AMD's power estimator tool and design the PCB with thermal vias under the package.
The 1.00 mm pitch FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground planes. Use micro-vias for dense routing. Follow AMD's PCB design guidelines for signal integrity and power integrity. Place decoupling capacitors close to the FPGA pins.
Informations de conformité
Compliance information not explicitly stated in the provided data. Verify with AMD or distributor for RoHS/REACH status.