XC7VX415T-2FF1158I - Virtex-7 XT FPGA 412K Logic | AMD
Артикул: XC7VX415T-2FF1158I ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1895 | $1.895,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1500 | $750.000,00 |
| 1.000 | $1400 | $1.400.000,00 |
XC7VX415T-2FF1158I Обзор
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of configurable logic blocks (CLBs) connected via programmable interconnects, allowing them to implement arbitrary digital logic functions. They sit between ASICs (application-specific) and microprocessors (software-programmable) in the design hierarchy, offering hardware-level parallelism and reconfigurability. The Virtex-7 XT family is optimized for high-bandwidth, high-capacity applications.
Key features of the XC7VX415T-2FF1158I include 412,160 logic cells, 32,200 CLBs, and 32,440,320 total RAM bits for data buffering. It provides 350 user I/O pins supporting high-bandwidth interfaces, and the -2 speed grade offers a balance of performance and power. The device also includes integrated DSP slices and high-speed transceivers, though specific transceiver counts require datasheet confirmation. The 1156-ball FCBGA package with 1.00 mm pitch enables dense PCB routing.
Technically, the Virtex-7 XT architecture uses a 28nm high-k metal gate (HKMG) process, delivering high performance with lower power compared to older generations. The FPGA supports partial reconfiguration, advanced clock management, and a rich set of hard IP blocks. The -2 speed grade indicates a mid-range performance tier, suitable for designs that need high throughput without the power penalty of the fastest grade.
Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense signal processing, and high-performance computing. The high logic density and I/O count make it ideal for protocol bridging, packet processing, and beamforming. The industrial temperature range supports deployment in harsh environments.
When designing with this FPGA, ensure adequate power supply decoupling and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Refer to the AMD Virtex-7 datasheet for detailed power and thermal specifications.
Аналоги без доработки для XC7VX415T-2FF1158I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC7VX415T-2FF1158I (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XC7VX415T-2FFV1158I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7VX415T-1FF1158I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX415T-3FF1158I
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XC7VX415T-2FFG1158I
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$8300 / шт.
Открыть даташит →XC7VX415T-2FF1158C
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX415T-2FF1158I Максимальные параметры и электрические характеристики
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| Configurable Logic Blocks (CLBs) | 32200 |
| Total RAM Bits | 32440320 |
| User I/O | 350 |
| Корпус | 1156-BBGA, FCBGA |
| Terminal Pitch | 1.00 mm |
| Рабочая температура | -40°C to +100°C |
| Speed Grade | -2 |
| Тип монтажа | Surface Mount |
Конфигурация выводов XC7VX415T-2FF1158I
| Контакт A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Контакт A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Контакт B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Контакт B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Контакт C1 | VCCINT — Internal core supply voltage |
| Контакт C2 | GND — Ground |
| Контакт D1 | VCCAUX — Auxiliary supply voltage |
| Контакт D2 | GND — Ground |
| Контакт E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Контакт E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Контакт F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Контакт F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
Типичное применение
XC7VX415T-2FF1158I подходит для 6 применениеs: Wired Communications Infrastructure, Data Center Acceleration, Aerospace and Defense Signal Processing, High-Performance Computing (HPC), Medical Imaging and Diagnostics, Test and Measurement Equipment.
Wired Communications Infrastructure
The XC7VX415T-2FF1158I is ideal for wired communications equipment like switches, routers, and base stations. Its 412,160 logic cells and 32,440,320 RAM bits enable complex packet processing and protocol bridging. The 350 user I/O pins support high-bandwidth interfaces to PHYs and network processors. The -2 speed grade balances performance and power, suitable for 100G and 400G line cards. Designers can implement flexible MACs, schedulers, and traffic managers in the FPGA fabric, offloading the CPU. The industrial temperature range supports deployment in central offices and remote sites.
Рекомендуется
Data Center Acceleration
In data centers, the XC7VX415T-2FF1158I accelerates workloads like network function virtualization (NFV), storage, and AI inference. Its high logic density and DSP resources enable custom accelerators for encryption, compression, and search. The 350 I/O pins connect to high-speed SerDes and DDR memory interfaces. The FPGA's reconfigurability allows dynamic workload adaptation, improving resource utilization. The -2 speed grade provides a good trade-off between throughput and power, critical for rack-scale deployments. The industrial temperature range ensures reliable operation in dense server environments.
Рекомендуется
Aerospace and Defense Signal Processing
The XC7VX415T-2FF1158I is well-suited for aerospace and defense applications like radar, electronic warfare, and secure communications. Its 412,160 logic cells and DSP slices enable real-time beamforming, pulse compression, and FFT processing. The industrial temperature range (-40°C to +100°C) meets military environmental requirements. The 350 user I/O pins interface with high-speed ADCs and DACs. The FPGA's reconfigurability allows in-field updates for evolving threats. The -2 speed grade provides sufficient performance for demanding signal processing chains while managing power in space-constrained platforms.
Рекомендуется
High-Performance Computing (HPC)
In HPC systems, the XC7VX415T-2FF1158I accelerates scientific simulations, financial modeling, and genome sequencing. Its high logic density and DSP resources enable custom arithmetic units and dataflow engines. The 350 I/O pins connect to high-bandwidth memory and interconnects like InfiniBand. The FPGA's parallelism provides significant speedups over CPUs for specific workloads. The -2 speed grade balances performance and power, suitable for large-scale clusters. The industrial temperature range ensures reliability in data center environments.
Рекомендуется
Medical Imaging and Diagnostics
The XC7VX415T-2FF1158I is used in medical imaging systems like CT scanners, MRI, and ultrasound. Its 412,160 logic cells and DSP slices enable real-time image reconstruction, filtering, and enhancement. The 350 user I/O pins interface with high-speed sensors and display controllers. The FPGA's deterministic processing ensures consistent image quality. The -2 speed grade provides sufficient performance for real-time processing while managing power in medical equipment. The industrial temperature range supports operation in clinical environments.
Рекомендуется
Test and Measurement Equipment
The XC7VX415T-2FF1158I is ideal for test and measurement instruments like oscilloscopes, logic analyzers, and signal generators. Its high logic density and DSP resources enable custom trigger logic, data acquisition, and waveform generation. The 350 user I/O pins connect to high-speed ADCs and DACs. The FPGA's reconfigurability allows firmware updates for new measurement modes. The -2 speed grade provides a balance of performance and power, suitable for benchtop and modular instruments. The industrial temperature range ensures reliable operation in lab environments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC7VX415T-2FF1158I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC7VX415T-2FFV1158I | XC7VX415T-1FF1158I | XC7VX415T-3FF1158I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same | 1156-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 412160 | 412160 |
| Total RAM Bits | 32440320 | 32440320 | 32440320 | 32440320 |
| User I/O | 350 | 350 | 350 | 350 |
| Speed Grade | -2 | -2 (or -2V) | -1 | -3 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| Terminal Pitch | 1.00 mm | 1.00 mm | 1.00 mm | 1.00 mm |
Ключевые отличия
- Higher logic density than Kintex-7 (против XC7K410T-2FB900I)
- Industrial temperature range (против XC7VX415T-2FF1158C)
- Balanced speed grade (против XC7VX415T-1FF1158I)
Заметки по проектированию
The XC7VX415T-2FF1158I requires multiple supply rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management solution with proper sequencing. Refer to the AMD Virtex-7 datasheet for recommended voltage levels and decoupling capacitor values. Ensure adequate bulk capacitance to handle transient currents during configuration and operation.
The 1156-ball FCBGA package dissipates significant heat under load. Use a heatsink and forced airflow for high utilization designs. The industrial temperature range (-40°C to +100°C) requires careful thermal design to keep junction temperature within limits. Calculate power dissipation using AMD's power estimator tool and design the PCB with thermal vias under the package.
The 1.00 mm pitch FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Route differential pairs with proper spacing and ground planes. Use micro-vias for dense routing. Follow AMD's PCB design guidelines for signal integrity and power integrity. Place decoupling capacitors close to the FPGA pins.
Информация о соответствии
Compliance information not explicitly stated in the provided data. Verify with AMD or distributor for RoHS/REACH status.