XCZU2EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
Référence : XCZU2EG-1SFVA625E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $495 | $495,00 |
| 10 | $465 | $4 650,00 |
| 100 | $435 | $43 500,00 |
| 500 | $410 | $205 000,00 |
| 1 000 | $390 | $390 000,00 |
XCZU2EG-1SFVA625E Présentation
A Zynq UltraScale+ MPSoC is a heterogeneous multiprocessor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single device. The PS includes ARM application and real-time processors, while the PL provides FPGA fabric for custom hardware acceleration. This architecture enables designers to implement complex systems that require both software flexibility and hardware performance, making it ideal for applications such as embedded vision, industrial automation, and software-defined radio.
Key features of the XCZU2EG-1SFVA625E include the quad-core ARM Cortex-A53 MPCore with CoreSight debug, dual-core ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 GPU. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The programmable logic provides 103,320 logic cells, enabling substantial custom logic implementation. The device is designed for industrial temperature ranges and is RoHS compliant.
From a technical perspective, the XCZU2EG-1SFVA625E leverages the UltraScale+ architecture, which offers advanced clocking, routing, and DSP capabilities. The 20nm process technology provides improved power efficiency and performance compared to older generations. The device includes integrated memory controllers, PCIe blocks, and security features, making it a comprehensive solution for high-performance embedded systems.
Typical applications include embedded vision systems, industrial motor control, automotive driver assistance, and data center acceleration. The combination of ARM processing and FPGA fabric allows for real-time processing and hardware acceleration, making it suitable for edge computing and AI inference.
When designing with this device, consider the power supply requirements, including the 0.95V core voltage and multiple I/O banks. Proper decoupling and power sequencing are essential for reliable operation. The device requires a configuration source, such as QSPI flash or SD card, for booting.
Alternatives de remplacement direct pour XCZU2EG-1SFVA625E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XCZU2EG-1SFVA625E (même facteur de forme et même empreinte) — différant par Core Voltage, Logic Cells, Package, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XCZU2EG-1SFVA625I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU3EG-1SFVA625E
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$160 / unité
Voir la fiche technique →XCZU2CG-1SFVA625E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCZU2EG-2SFVA625E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCZU2EG-1SFVA625I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU2EG-1SFVA625E Valeurs maximales et caractéristiques électriques
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 103320 |
| Maximum Frequency | 1.5 GHz (Cortex-A53) |
| Boîtier | 625-FCBGA (21x21 mm) |
| Process Technology | 20nm |
| Core Voltage | 0.95V |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
| Tension d'alimentation | 0.95V (core) |
| Speed Grade | -1 |
Configuration des broches de XCZU2EG-1SFVA625E
| Broche A1 | VCCINT — Core logic power supply (0.95V) |
| Broche A2 | GND — Ground |
| Broche B1 | IO_L1P_T0 — User I/O bank 0 differential pair |
| Broche B2 | IO_L1N_T0 — User I/O bank 0 differential pair |
| Broche C1 | VCCAUX — Auxiliary power supply (1.8V) |
| Broche C2 | GND — Ground |
| Broche D1 | MIO0 — Multiplexed I/O for PS |
| Broche D2 | MIO1 — Multiplexed I/O for PS |
| Broche E1 | DDR_A0 — DDR memory address |
| Broche E2 | DDR_A1 — DDR memory address |
| Broche F1 | DDR_DQ0 — DDR memory data |
| Broche F2 | DDR_DQ1 — DDR memory data |
Applications typiques
XCZU2EG-1SFVA625E convient pour 6 applications: Embedded Vision, Industrial Automation, Software-Defined Radio, Data Center Acceleration, Automotive Driver Assistance, Medical Imaging.
Embedded Vision
The XCZU2EG-1SFVA625E is ideal for embedded vision systems that require real-time image processing. The quad-core ARM Cortex-A53 can run complex algorithms, while the FPGA fabric accelerates pixel-level operations. With 103,320 logic cells, it can implement custom convolution engines and image signal processing pipelines. The Mali-400 GPU supports graphics rendering for display interfaces. This SoC enables high-performance vision applications in industrial inspection, surveillance, and autonomous vehicles, where low latency and high throughput are critical.
Recommandé
Industrial Automation
In industrial automation, the XCZU2EG-1SFVA625E provides a powerful platform for motor control, robotics, and PLCs. The dual-core Cortex-R5 is optimized for real-time control, while the FPGA fabric can implement custom communication protocols and high-speed I/O. The device supports industrial temperature ranges (with the 'I' variant) and offers deterministic processing. Its 20nm process ensures low power consumption, making it suitable for factory floor equipment. The integration of processing and logic reduces system complexity and improves reliability.
Recommandé
Software-Defined Radio
The XCZU2EG-1SFVA625E is well-suited for software-defined radio (SDR) applications due to its high-speed transceivers and DSP capabilities. The FPGA fabric can implement digital down/up converters, filters, and modulation/demodulation algorithms. The ARM cores handle protocol stack and control functions. With 103,320 logic cells, it can support multiple channels and complex waveforms. The device's flexibility allows for reconfiguration to adapt to different communication standards, making it ideal for military, aerospace, and public safety communications.
Recommandé
Data Center Acceleration
The XCZU2EG-1SFVA625E can be used in data center applications for network processing, storage acceleration, and AI inference. The FPGA fabric allows for custom packet processing and offloading of compute-intensive tasks from the CPU. The ARM cores provide management and control plane functions. With support for PCIe and high-speed serial interfaces, it can integrate into server architectures. The device's low latency and high throughput make it suitable for edge computing and real-time analytics.
Recommandé
Automotive Driver Assistance
The XCZU2EG-1SFVA625E is suitable for advanced driver assistance systems (ADAS) that require real-time sensor fusion and processing. The FPGA fabric can implement camera and LiDAR data processing, while the ARM cores run fusion algorithms. The Mali-400 GPU supports graphics for displays. The device's high performance and low power make it ideal for in-vehicle systems. It can handle multiple sensor inputs and provide fast response times for safety-critical functions.
Recommandé
Medical Imaging
The XCZU2EG-1SFVA625E is used in medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can implement real-time signal processing and image reconstruction algorithms. The ARM cores handle system control and user interface. With high logic density and DSP capabilities, it can process large amounts of data quickly. The device's reliability and long-term availability make it suitable for medical equipment, where uptime is critical.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XCZU2EG-1SFVA625E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XCZU2EG-1SFVA625I | XCZU3EG-1SFVA625E | XCZU2CG-1SFVA625E |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21 mm) | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 103320 | 103320 | 154K | 103K |
| Max Frequency (Cortex-A53) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.2 GHz |
| Temperature Grade | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Speed Grade | -1 | -1 | -1 | -1 |
| Core Voltage | 0.95V | 0.95V | 0.95V | 0.95V |
| Process Technology | 20nm | 20nm | 20nm | 20nm |
Principaux différenciateurs
- Higher logic density than XCZU2CG (vs XCZU2CG-1SFVA625E)
- Extended temperature grade vs industrial (vs XCZU2EG-1SFVA625I)
- Cost-effective compared to XCZU3EG (vs XCZU3EG-1SFVA625E)
Notes de conception
The XCZU2EG-1SFVA625E requires multiple power rails: VCCINT at 0.95V, VCCAUX at 1.8V, and various I/O voltages. Use a dedicated power management IC to sequence these rails properly. Refer to the Zynq UltraScale+ MPSoC power supply design guidelines in DS891 for recommended decoupling capacitors and power sequencing requirements.
The 625-FCBGA package has a 21x21 mm footprint with a 0.8mm ball pitch. Ensure adequate via-in-pad or microvia design for routing. Use high-speed design rules for DDR and transceiver signals, including impedance control and length matching. Follow AMD's PCB design guidelines for UltraScale+ devices.
The device can dissipate significant power under heavy load. Use a heatsink or active cooling if the junction temperature exceeds the specified limit. The thermal resistance depends on airflow and PCB design. Calculate the power dissipation based on your application and ensure adequate thermal management.
Informations de conformité
RoHS compliant per distributor listings. AEC-Q100 not applicable for this device class.
