XCZU2EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU2EG-1SFVA625E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $495 | $495.00 |
| 10 | $465 | $4,650.00 |
| 100 | $435 | $43,500.00 |
| 500 | $410 | $205,000.00 |
| 1,000 | $390 | $390,000.00 |
Drop-in alternatives for XCZU2EG-1SFVA625E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU2EG-1SFVA625I
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-1SFVA625E
β Drop-Inβ In Stock
$160 / Unit
View Datasheet βXCZU2CG-1SFVA625E
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-2SFVA625E
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-1SFVA625I
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-1SFVA625E Maximum Ratings & Electrical Characteristics
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 103320 |
| Maximum Frequency | 1.5 GHz (Cortex-A53) |
| Package | 625-FCBGA (21x21 mm) |
| Process Technology | 20nm |
| Core Voltage | 0.95V |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of user I/O] |
| DSP Slices | [DATA_NEEDED: number of DSP slices] |
| Block RAM | [DATA_NEEDED: block RAM size] |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Supply Voltage | 0.95V (core) |
| Speed Grade | -1 |
XCZU2EG-1SFVA625E Pin Configuration
| Pin A1 | VCCINT β Core logic power supply (0.95V) |
| Pin A2 | GND β Ground |
| Pin B1 | IO_L1P_T0 β User I/O bank 0 differential pair |
| Pin B2 | IO_L1N_T0 β User I/O bank 0 differential pair |
| Pin C1 | VCCAUX β Auxiliary power supply (1.8V) |
| Pin C2 | GND β Ground |
| Pin D1 | MIO0 β Multiplexed I/O for PS |
| Pin D2 | MIO1 β Multiplexed I/O for PS |
| Pin E1 | DDR_A0 β DDR memory address |
| Pin E2 | DDR_A1 β DDR memory address |
| Pin F1 | DDR_DQ0 β DDR memory data |
| Pin F2 | DDR_DQ1 β DDR memory data |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU2EG-1SFVA625E is suitable for 6 applications: Embedded Vision, Industrial Automation, Software-Defined Radio, Data Center Acceleration, Automotive Driver Assistance, Medical Imaging.
Embedded Vision
The XCZU2EG-1SFVA625E is ideal for embedded vision systems that require real-time image processing. The quad-core ARM Cortex-A53 can run complex algorithms, while the FPGA fabric accelerates pixel-level operations. With 103,320 logic cells, it can implement custom convolution engines and image signal processing pipelines. The Mali-400 GPU supports graphics rendering for display interfaces. This SoC enables high-performance vision applications in industrial inspection, surveillance, and autonomous vehicles, where low latency and high throughput are critical.
Recommended
Industrial Automation
In industrial automation, the XCZU2EG-1SFVA625E provides a powerful platform for motor control, robotics, and PLCs. The dual-core Cortex-R5 is optimized for real-time control, while the FPGA fabric can implement custom communication protocols and high-speed I/O. The device supports industrial temperature ranges (with the 'I' variant) and offers deterministic processing. Its 20nm process ensures low power consumption, making it suitable for factory floor equipment. The integration of processing and logic reduces system complexity and improves reliability.
Recommended
Software-Defined Radio
The XCZU2EG-1SFVA625E is well-suited for software-defined radio (SDR) applications due to its high-speed transceivers and DSP capabilities. The FPGA fabric can implement digital down/up converters, filters, and modulation/demodulation algorithms. The ARM cores handle protocol stack and control functions. With 103,320 logic cells, it can support multiple channels and complex waveforms. The device's flexibility allows for reconfiguration to adapt to different communication standards, making it ideal for military, aerospace, and public safety communications.
Recommended
Data Center Acceleration
The XCZU2EG-1SFVA625E can be used in data center applications for network processing, storage acceleration, and AI inference. The FPGA fabric allows for custom packet processing and offloading of compute-intensive tasks from the CPU. The ARM cores provide management and control plane functions. With support for PCIe and high-speed serial interfaces, it can integrate into server architectures. The device's low latency and high throughput make it suitable for edge computing and real-time analytics.
Recommended
Automotive Driver Assistance
The XCZU2EG-1SFVA625E is suitable for advanced driver assistance systems (ADAS) that require real-time sensor fusion and processing. The FPGA fabric can implement camera and LiDAR data processing, while the ARM cores run fusion algorithms. The Mali-400 GPU supports graphics for displays. The device's high performance and low power make it ideal for in-vehicle systems. It can handle multiple sensor inputs and provide fast response times for safety-critical functions.
Recommended
Medical Imaging
The XCZU2EG-1SFVA625E is used in medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can implement real-time signal processing and image reconstruction algorithms. The ARM cores handle system control and user interface. With high logic density and DSP capabilities, it can process large amounts of data quickly. The device's reliability and long-term availability make it suitable for medical equipment, where uptime is critical.
Recommended
Recommended Products Summary
Engineering reference data for XCZU2EG-1SFVA625E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU2EG-1SFVA625I | XCZU3EG-1SFVA625E | XCZU2CG-1SFVA625E |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21 mm) | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same | 625-FCBGA (21x21 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 103320 | 103320 | 154K | 103K |
| Max Frequency (Cortex-A53) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.2 GHz |
| Temperature Grade | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Speed Grade | -1 | -1 | -1 | -1 |
| Core Voltage | 0.95V | 0.95V | 0.95V | 0.95V |
| Process Technology | 20nm | 20nm | 20nm | 20nm |
Key Differentiators
- Higher logic density than XCZU2CG (vs XCZU2CG-1SFVA625E)
- Extended temperature grade vs industrial (vs XCZU2EG-1SFVA625I)
- Cost-effective compared to XCZU3EG (vs XCZU3EG-1SFVA625E)
Design Notes
The XCZU2EG-1SFVA625E requires multiple power rails: VCCINT at 0.95V, VCCAUX at 1.8V, and various I/O voltages. Use a dedicated power management IC to sequence these rails properly. Refer to the Zynq UltraScale+ MPSoC power supply design guidelines in DS891 for recommended decoupling capacitors and power sequencing requirements.
The 625-FCBGA package has a 21x21 mm footprint with a 0.8mm ball pitch. Ensure adequate via-in-pad or microvia design for routing. Use high-speed design rules for DDR and transceiver signals, including impedance control and length matching. Follow AMD's PCB design guidelines for UltraScale+ devices.
The device can dissipate significant power under heavy load. Use a heatsink or active cooling if the junction temperature exceeds the specified limit. The thermal resistance depends on airflow and PCB design. Calculate the power dissipation based on your application and ensure adequate thermal management.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for this device class.
