XCZU42DR-2FSVE1156I - RFSoC, 489K Logic Cells | AMD
Référence : XCZU42DR-2FSVE1156I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4895 | $4 895,00 |
| 10 | $4650 | $46 500,00 |
| 100 | $4410 | $441 000,00 |
| 500 | $4180 | $2 090 000,00 |
| 1 000 | $3950 | $3 950 000,00 |
XCZU42DR-2FSVE1156I Présentation
A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, uniquely, integrated RF data converters (RF-ADC and RF-DAC). This integration eliminates the need for separate discrete converters, reducing board space, power, and latency. The RFSoC family sits within the broader adaptive SoC category, bridging FPGA flexibility with processor-based software programmability.
Key features include the 489K logic cells, 533MHz/1.333GHz processor clocks, and the 1156-FCBGA package. The 'I' suffix indicates an industrial temperature grade (-40C to +100C), making it suitable for demanding environments. The '2' speed grade offers a balance of performance and power. The integrated RF converters support direct RF sampling, simplifying transceiver designs.
Technically, the device leverages AMD's UltraScale+ 16nm FinFET process, providing high logic density and low power. The RFSoC architecture includes dedicated DSP slices, block RAM, and high-speed transceivers, enabling complex digital signal processing. The programmable logic can be configured for custom algorithms, while the ARM cores handle control and protocol processing.
Typical applications include 5G NR base stations, phased array radar, test and measurement equipment, and satellite communications. The integrated RF data converters and high-speed processing make it ideal for software-defined radio (SDR) systems.
When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 1156-FCBGA package requires a multi-layer PCB with adequate decoupling and a thermal solution to dissipate heat from the high-performance cores and RF converters.
Alternatives de remplacement direct pour XCZU42DR-2FSVE1156I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XCZU42DR-2FSVE1156I (même facteur de forme et même empreinte) — différant par Logic Cells, Operating Temperature, Package, Primary Clock Speed, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XCZU42DR-2FFVE1156I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU42DR-2FSVE1156E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU43DR-1FSVE1156E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU42DR-L2FSVE1156I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCZU42DR-2FSVE1156ES9819
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU42DR-2FSVE1156I Valeurs maximales et caractéristiques électriques
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 533MHz (Cortex-A53), 1.333GHz (Cortex-R5) |
| Logic Cells | 489K+ |
| Boîtier | 1156-FCBGA (35x35mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | -2 |
| Series | Zynq UltraScale+ RFSoC |
| Number of Cores | 6 (4x A53, 2x R5) |
| FPGA Architecture | UltraScale+ (16nm FinFET) |
| Statut RoHS | Compliant |
Configuration des broches de XCZU42DR-2FSVE1156I
| Broche A1 | GND — Ground |
| Broche A2 | VCCO_0 — I/O bank 0 supply voltage |
| Broche A3 | IO_L1P_T0_0 — User I/O, differential pair P |
| Broche A4 | IO_L1N_T0_0 — User I/O, differential pair N |
| Broche B1 | VCCINT — Internal core logic supply |
| Broche B2 | GND — Ground |
| Broche C1 | VCCBRAM — Block RAM supply voltage |
| Broche C2 | IO_L2P_T0_0 — User I/O, differential pair P |
| Broche D1 | VCCAUX — Auxiliary supply voltage |
| Broche D2 | IO_L2N_T0_0 — User I/O, differential pair N |
| Broche E1 | GND — Ground |
| Broche E2 | VCCO_1 — I/O bank 1 supply voltage |
Applications typiques
XCZU42DR-2FSVE1156I convient pour 6 applications: 5G NR Base Stations, Phased Array Radar, Test and Measurement Equipment, Satellite Communications, Software Defined Radio (SDR), Wireless Backhaul.
5G NR Base Stations
The XCZU42DR-2FSVE1156I is ideal for 5G NR base stations due to its integrated RF data converters and high-speed processing. The 489K+ logic cells enable complex beamforming algorithms, while the quad-core A53 handles protocol stack processing. The RFSoC's direct RF sampling capability reduces component count and power consumption, making it a cost-effective solution for massive MIMO and mmWave systems. The industrial temperature grade ensures reliable operation in outdoor environments.
Recommandé
Phased Array Radar
The XCZU42DR-2FSVE1156I excels in phased array radar systems by providing integrated RF sampling and massive parallel processing. The FPGA fabric with 489K+ logic cells can implement digital beamforming and pulse compression algorithms. The dual-core Cortex-R5 provides real-time control for antenna steering. The 1156-FCBGA package supports high-density PCB designs, and the industrial temperature range allows deployment in harsh environments. This integration reduces system latency and power compared to discrete solutions.
Recommandé
Test and Measurement Equipment
The XCZU42DR-2FSVE1156I is well-suited for test and measurement equipment such as spectrum analyzers and signal generators. Its integrated RF-ADCs and RF-DACs enable direct RF sampling and generation, simplifying the signal chain. The 489K+ logic cells allow for real-time FFT and signal analysis. The ARM cores provide a user interface and control. The device's high-speed processing and industrial temperature grade make it reliable for benchtop and field instruments.
Recommandé
Satellite Communications
The XCZU42DR-2FSVE1156I is ideal for satellite communication systems, offering integrated RF conversion and high-throughput processing. The RFSoC's direct RF sampling reduces the number of components, which is critical for space-constrained payloads. The 489K+ logic cells can implement advanced modulation and coding schemes. The quad-core A53 handles protocol processing, while the industrial temperature grade ensures operation in the thermal extremes of space. This integration reduces power and weight.
Recommandé
Software Defined Radio (SDR)
The XCZU42DR-2FSVE1156I is a perfect fit for software-defined radio (SDR) platforms. Its integrated RF data converters allow direct sampling of RF signals, eliminating the need for multiple downconversion stages. The 489K+ logic cells provide the flexibility to implement various waveforms and protocols. The ARM cores run the software stack, enabling rapid reconfiguration. The device's high performance and industrial temperature range make it suitable for military and commercial SDR applications.
Recommandé
Wireless Backhaul
The XCZU42DR-2FSVE1156I is well-suited for wireless backhaul systems, providing high-capacity processing and integrated RF conversion. The 489K+ logic cells can handle complex modulation schemes like 256-QAM. The quad-core A53 processes the Ethernet and protocol stacks. The RFSoC's direct RF sampling reduces latency and power, which is critical for high-throughput backhaul links. The industrial temperature grade ensures reliable operation in outdoor cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XCZU42DR-2FSVE1156I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XCZU42DR-2FFVE1156I | XCZU42DR-2FSVE1156E | XCZU43DR-1FSVE1156E |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) | 1156-FCBGA (35x35mm) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -2 | -2 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +110C) | Extended (-40C to +110C) |
| Package Suffix | FSVE | FFVE | FSVE | FSVE |
| Core Processor | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 |
Principaux différenciateurs
- Integrated RF data converters (vs XCZU42DR-2FFVE1156I)
- Industrial temperature grade (vs XCZU42DR-2FSVE1156E)
- Speed grade -2 (vs XCZU43DR-1FSVE1156E)
Notes de conception
The XCZU42DR-2FSVE1156I requires multiple power rails (VCCINT, VCCBRAM, VCCAUX, VCCO) with specific sequencing. According to AMD's power management recommendations, VCCINT must be powered before VCCO. Use a dedicated power management IC (PMIC) or sequencer to ensure correct power-up order. Decouple each rail with a combination of bulk and ceramic capacitors placed close to the BGA pins.
The 1156-FCBGA package can dissipate significant heat, especially with the RF converters active. Use a heatsink with a thermal interface material (TIM) and ensure adequate airflow. The industrial temperature grade allows operation up to +100C, but junction temperature must stay below the maximum rating. Consider a thermal simulation to verify the design.
For the 1156-FCBGA package, use a high-layer-count PCB (at least 12 layers) with dedicated power and ground planes. Follow AMD's layout guidelines for high-speed transceivers and RF signals. Use controlled impedance traces for differential pairs. Place decoupling capacitors on the bottom side of the board directly under the BGA to minimize inductance.
Informations de conformité
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part.
