10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
MPN: 10M08SAE144C8G ✓ פעיל10M08SAE144C8G סקירה
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic, DSP, and memory functions through a software-defined configuration. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than an ASIC, faster and more parallel than a microcontroller, and lower-power-per-compute than a GPU for fixed-function pipelines. The MAX 10 family targets glue logic, motor control, I/O expansion, and small-format digital signal processing where instant-on and integrated analog reduce total bill of materials.
Key features include 8 K logic elements (LEs), 8 K flip-flops, 24 hardware 18x18 multipliers, two analog front-end PLLs, a hard 12-bit successive-approximation ADC (up to 1 MSa/s with up to 17 analog inputs), and dual configuration flash. The integrated ADC eliminates external analog front-end ICs for sensor monitoring, while internal flash removes the boot PROM that CPLDs and SRAM-based FPGAs traditionally require.
Architecturally, the device uses look-up-table (LUT) based logic elements clustered into Logic Array Blocks (LABs), routed through a multi-speed interconnect fabric. The flash configuration cell sits on the same die, allowing field upgrades via JTAG while preserving 100,000+ erase/program cycles. The ADC is a hard IP block sharing analog supply and reference pins with the digital I/O ring.
Typical applications include industrial motor control (BLDC, stepper, servo), factory automation I/O expansion, sensor aggregation with on-chip ADC, video bridging (LVDS/CVBS), medical patient monitoring, and portable test instruments requiring instant-on capability. Designers also use the MAX 10 for protocol bridging (UART/SPI/I2C to Ethernet) in IoT edge nodes.
Design tip: route the exposed thermal pad (EP) to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Without EP soldering, junction-to-ambient thermal resistance degrades significantly and high-utilization designs can exceed the 85C commercial limit.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and package-level guidance not consolidated in any single manufacturer document.
חלופות תחליף ישיר עבור 10M08SAE144C8G — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם 10M08SAE144C8G (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Speed Grade, PLLs, Process Technology.
10M08SAE144I7G
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←10M08SAU144C8G
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
10M08SCE144C8G
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10M08SCE144I7G
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10M08SAE144A7G
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
10M08SAE144C8G דירוגים מרביים ומאפיינים חשמליים
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Adaptive Logic Modules (ALM) | Not applicable (MAX 10 uses LE architecture, not ALM) |
| M9K Embedded Memory Blocks | 378 Kb total |
| Embedded 18x18 Multipliers | 24 |
| User I/O Pins | 101 |
| מארז | 144-LQFP Exposed Pad (EQFP) |
| Process Technology | 55 nm flash-based CMOS |
| Configuration Memory | Internal flash, dual-image |
| Integrated ADC | 12-bit, 1 MSa/s, up to 17 analog inputs |
| PLLs | 2 analog front-end PLLs |
| Maximum User I/O Voltage | 3.3 V (LVCMOS/LVTTL); LVDS supported |
| External Memory Interface | DDR3, DDR2, LPDDR2 |
| טמפרטורת צומת פעולה | 0C to 85C (commercial) |
| סטטוס RoHS | Compliant |
| סוג הרכבה | Surface Mount (LQFP) |
| Lead-Free | Yes |
מדריך תצורת פינים של 10M08SAE144C8G 144-lqfp exposed pad (eqfp)
תצורת פינים עבור 10M08SAE144C8G (מארזת 144-lqfp exposed pad (eqfp)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור 10M08SAE144C8G.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
10M08SAE144C8G מתאים עבור 6 יישוםs: Industrial Motor Control, Factory Automation I/O Expansion, Sensor Aggregation with On-Chip ADC, Video Bridging and Image Processing, Portable Test and Measurement, IoT Edge Protocol Bridging.
Industrial Motor Control
The 10M08SAE144C8G is well suited to BLDC, stepper, and servo motor controllers. Its 8,000 logic elements can host 4 to 8 independent PID loops simultaneously, while the 24 embedded 18x18 multipliers accelerate Clarke and Park transforms for field-oriented control. The 12-bit 1 MSa/s integrated ADC samples phase currents directly from current-sense amplifiers, eliminating a dedicated ADC IC. With 101 user I/Os, the device drives gate drivers, Hall/encoder inputs, and fault outputs in a single chip. DDR3 external memory support enables position history logging for predictive maintenance.
מומלץ
Factory Automation I/O Expansion
In PLC and distributed I/O systems, the 10M08SAE144C8G serves as a flexible I/O expansion and protocol bridge. The 101 user I/Os handle digital inputs, relay outputs, and opto-isolated signal conditioning, while the embedded flash enables instant-on behavior critical for industrial safety circuits. The hard ADC monitors 24V rail health and analog sensor inputs without a separate ADC chip. Designers implement EtherCAT, PROFINET, or Modbus TCP soft cores in the LE fabric using the IP catalog. Internal flash configuration simplifies field firmware updates via JTAG.
מומלץ
Sensor Aggregation with On-Chip ADC
The integrated 12-bit ADC makes the 10M08SAE144C8G ideal for sensor aggregation hubs in industrial monitoring. Up to 17 analog inputs handle temperature, pressure, flow, and humidity sensors at 1 MSa/s aggregate sample rate. The 378 Kb of M9K memory buffers samples before forwarding to an MCU or Ethernet controller via SPI or parallel interface. The 8,000 LEs run calibration linearization, statistical filtering, and threshold detection in hardware. Internal flash lets the calibration firmware survive power cycles without an external EEPROM.
מומלץ
Video Bridging and Image Processing
The 10M08SAE144C8G performs real-time video format conversion, scaling, and bridging tasks. Its LVDS I/O support accepts camera sensor data up to 400 Mbps per lane, while the 24 embedded multipliers execute small-kernel video filters at up to 1080p30. DDR3 external memory interface acts as frame buffer for cross-format bridging between MIPI, LVDS, and parallel RGB. The 8K LE fabric fits a full color-space conversion pipeline plus on-screen display overlay. Internal flash eliminates the boot PROM that traditionally accompanies video processors.
מומלץ
Portable Test and Measurement
Handheld test instruments benefit from the 10M08SAE144C8G's instant-on flash configuration and integrated ADC. Power-on to first-measurement time is under 50 ms because the device boots directly from internal flash with no PROM delay. The 12-bit ADC samples waveform inputs at 1 MSa/s while the LE fabric runs FFT, RMS, and THD calculations in hardware. The 144-EQFP package's exposed pad enables thermal performance sufficient for continuous operation at 85C ambient in enclosed handheld cases.
מומלץ
IoT Edge Protocol Bridging
The 10M08SAE144C8G bridges legacy industrial protocols to modern Ethernet or wireless backhaul in IoT edge nodes. Soft IP cores for UART, SPI, I2C, RS-485, and CAN coexist in the LE fabric alongside 10/100 Ethernet MAC implementations. The 101 user I/Os aggregate fieldbus interfaces and GPIO. Dual-image flash supports secure over-the-air firmware updates with rollback on failure. The commercial 0-85C junction range suits indoor edge gateways; designers select the I7 industrial variant for outdoor deployments.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור 10M08SAE144C8G — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | 10M08SAE144I7G | 10M08SAU144C8G | 10M08SCE144C8G | 10M08SCE144I7G | 10M08SAE144A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| M9K Embedded Memory | 378 Kb | 378 Kb | 378 Kb | 378 Kb | 378 Kb | 378 Kb |
| 18x18 Multipliers | 24 | 24 | 24 | 24 | 24 | 24 |
| Integrated ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | No ADC (U grade) | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Junction Temperature | 0C to 85C (commercial) | -40C to 100C (industrial) | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 100C (industrial) | 0C to 85C (commercial) |
| Speed Grade | C8 | I7 | C8 | C8 | I7 | A7 (faster) |
מבדילים עיקריים
- Integrated 12-bit ADC eliminates external analog front-end (לעומת10M08SAU144C8G)
- Commercial C8 speed grade offers the lowest cost in the MAX 10 family (לעומת10M08SAE144A7G)
- Internal flash configuration enables instant-on without boot PROM (לעומת10M08SCE144C8G)
- EQFP package supports standard SMT assembly versus BGA (לעומת10M08DCU324I7G)
הערות תכנון
The 144-EQFP package requires the exposed thermal pad (EP) be soldered to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Per MAX 10 thermal guidelines, without EP soldering the junction-to-ambient thermal resistance degrades from 25 C/W to over 45 C/W, and high-utilization designs at 85C ambient will exceed the commercial junction limit. Use a minimum 4-layer PCB with EP plane on layer 2 for optimal heat spreading.
Power estimation for the 10M08SAE144C8G should account for both static and dynamic current. Estimated: static core current is approximately 15 mA for the 8K LE fabric at 25C; each MHz of toggle activity on average 50% of LEs adds roughly 0.7 mA. For a 50 MHz design with 70% utilization, total ICC is approximately 110 mA. Decouple with 100 nF X7R close to each VCCINT and VCCIO pin, plus a 10 uF bulk capacitor on each supply rail within 1 inch of the device.
Route JTAG signals (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kohm pull-ups on TCK, TMS, and TDI to VCCIO of the I/O bank. Per MAX 10 hardware design guidelines, keep JTAG trace length under 6 inches and avoid splitting the JTAG chain across multiple I/O banks. The TCK signal should be impedance-controlled to 50 ohms to avoid ringing at high download clock rates.
The 12-bit ADC requires a clean analog supply (VCCA) isolated from digital switching noise. Estimated: a 10 uH ferrite bead between VCCA and VCCDIGITAL plus 100 nF + 10 uF local decoupling suppresses 20-30 dB of switching noise. ADC reference accuracy directly limits ENOB; use the internal 2.5V reference only when 8-bit effective resolution is acceptable, otherwise provide an external low-noise reference like the ADR01.
מידע על תאימות
RoHS compliant per distributor listings. Not AEC-Q100 qualified - for automotive designs use AEC-Q100 qualified MAX 10 variants. Halogen-free status not explicitly stated in the verified web data.
