10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
部品番号: 10M08SAE144C8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $24.41 | $24.41 |
| 10 | $22.5 | $225.00 |
| 100 | $19.95 | $1,995.00 |
| 500 | $17.8 | $8,900.00 |
| 1,000 | $16.25 | $16,250.00 |
10M08SAE144C8G 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic, DSP, and memory functions through a software-defined configuration. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than an ASIC, faster and more parallel than a microcontroller, and lower-power-per-compute than a GPU for fixed-function pipelines. The MAX 10 family targets glue logic, motor control, I/O expansion, and small-format digital signal processing where instant-on and integrated analog reduce total bill of materials.
Key features include 8 K logic elements (LEs), 8 K flip-flops, 24 hardware 18x18 multipliers, two analog front-end PLLs, a hard 12-bit successive-approximation ADC (up to 1 MSa/s with up to 17 analog inputs), and dual configuration flash. The integrated ADC eliminates external analog front-end ICs for sensor monitoring, while internal flash removes the boot PROM that CPLDs and SRAM-based FPGAs traditionally require.
Architecturally, the device uses look-up-table (LUT) based logic elements clustered into Logic Array Blocks (LABs), routed through a multi-speed interconnect fabric. The flash configuration cell sits on the same die, allowing field upgrades via JTAG while preserving 100,000+ erase/program cycles. The ADC is a hard IP block sharing analog supply and reference pins with the digital I/O ring.
Typical applications include industrial motor control (BLDC, stepper, servo), factory automation I/O expansion, sensor aggregation with on-chip ADC, video bridging (LVDS/CVBS), medical patient monitoring, and portable test instruments requiring instant-on capability. Designers also use the MAX 10 for protocol bridging (UART/SPI/I2C to Ethernet) in IoT edge nodes.
Design tip: route the exposed thermal pad (EP) to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Without EP soldering, junction-to-ambient thermal resistance degrades significantly and high-utilization designs can exceed the 85C commercial limit.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and package-level guidance not consolidated in any single manufacturer document.
ドロップイン代替品: 10M08SAE144C8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M08SAE144C8G （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, PLLs, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
10M08SAE144I7G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6.8 / 個
データシートを見る →10M08SAU144C8G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M08SCE144C8G
✅ ドロップイン✓ 在庫あり
$15.95 / 個
データシートを見る →10M08SCE144I7G
✅ ドロップイン✓ 在庫あり
$70.2 / 個
データシートを見る →10M08SAE144A7G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10M08SAE144C8G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Adaptive Logic Modules (ALM) | Not applicable (MAX 10 uses LE architecture, not ALM) |
| M9K Embedded Memory Blocks | 378 Kb total |
| Embedded 18x18 Multipliers | 24 |
| User I/O Pins | 101 |
| パッケージ | 144-LQFP Exposed Pad (EQFP) |
| Process Technology | 55 nm flash-based CMOS |
| Configuration Memory | Internal flash, dual-image |
| Integrated ADC | 12-bit, 1 MSa/s, up to 17 analog inputs |
| PLLs | 2 analog front-end PLLs |
| Maximum User I/O Voltage | 3.3 V (LVCMOS/LVTTL); LVDS supported |
| External Memory Interface | DDR3, DDR2, LPDDR2 |
| 動作接合温度 | 0C to 85C (commercial) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (LQFP) |
| Lead-Free | Yes |
10M08SAE144C8G 144-lqfp exposed pad (eqfp) ピン配置ガイド
10M08SAE144C8G (144-lqfp exposed pad (eqfp) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M08SAE144C8G.
詳細は データシート をご参照ください。
主な用途
10M08SAE144C8G の用途: 6 件s: Industrial Motor Control, Factory Automation I/O Expansion, Sensor Aggregation with On-Chip ADC, Video Bridging and Image Processing, Portable Test and Measurement, IoT Edge Protocol Bridging.
Industrial Motor Control
The 10M08SAE144C8G is well suited to BLDC, stepper, and servo motor controllers. Its 8,000 logic elements can host 4 to 8 independent PID loops simultaneously, while the 24 embedded 18x18 multipliers accelerate Clarke and Park transforms for field-oriented control. The 12-bit 1 MSa/s integrated ADC samples phase currents directly from current-sense amplifiers, eliminating a dedicated ADC IC. With 101 user I/Os, the device drives gate drivers, Hall/encoder inputs, and fault outputs in a single chip. DDR3 external memory support enables position history logging for predictive maintenance.
おすすめ
Factory Automation I/O Expansion
In PLC and distributed I/O systems, the 10M08SAE144C8G serves as a flexible I/O expansion and protocol bridge. The 101 user I/Os handle digital inputs, relay outputs, and opto-isolated signal conditioning, while the embedded flash enables instant-on behavior critical for industrial safety circuits. The hard ADC monitors 24V rail health and analog sensor inputs without a separate ADC chip. Designers implement EtherCAT, PROFINET, or Modbus TCP soft cores in the LE fabric using the IP catalog. Internal flash configuration simplifies field firmware updates via JTAG.
おすすめ
Sensor Aggregation with On-Chip ADC
The integrated 12-bit ADC makes the 10M08SAE144C8G ideal for sensor aggregation hubs in industrial monitoring. Up to 17 analog inputs handle temperature, pressure, flow, and humidity sensors at 1 MSa/s aggregate sample rate. The 378 Kb of M9K memory buffers samples before forwarding to an MCU or Ethernet controller via SPI or parallel interface. The 8,000 LEs run calibration linearization, statistical filtering, and threshold detection in hardware. Internal flash lets the calibration firmware survive power cycles without an external EEPROM.
おすすめ
Video Bridging and Image Processing
The 10M08SAE144C8G performs real-time video format conversion, scaling, and bridging tasks. Its LVDS I/O support accepts camera sensor data up to 400 Mbps per lane, while the 24 embedded multipliers execute small-kernel video filters at up to 1080p30. DDR3 external memory interface acts as frame buffer for cross-format bridging between MIPI, LVDS, and parallel RGB. The 8K LE fabric fits a full color-space conversion pipeline plus on-screen display overlay. Internal flash eliminates the boot PROM that traditionally accompanies video processors.
おすすめ
Portable Test and Measurement
Handheld test instruments benefit from the 10M08SAE144C8G's instant-on flash configuration and integrated ADC. Power-on to first-measurement time is under 50 ms because the device boots directly from internal flash with no PROM delay. The 12-bit ADC samples waveform inputs at 1 MSa/s while the LE fabric runs FFT, RMS, and THD calculations in hardware. The 144-EQFP package's exposed pad enables thermal performance sufficient for continuous operation at 85C ambient in enclosed handheld cases.
おすすめ
IoT Edge Protocol Bridging
The 10M08SAE144C8G bridges legacy industrial protocols to modern Ethernet or wireless backhaul in IoT edge nodes. Soft IP cores for UART, SPI, I2C, RS-485, and CAN coexist in the LE fabric alongside 10/100 Ethernet MAC implementations. The 101 user I/Os aggregate fieldbus interfaces and GPIO. Dual-image flash supports secure over-the-air firmware updates with rollback on failure. The commercial 0-85C junction range suits indoor edge gateways; designers select the I7 industrial variant for outdoor deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M08SAE144C8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M08SAE144I7G | 10M08SAU144C8G | 10M08SCE144C8G | 10M08SCE144I7G | 10M08SAE144A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad (EQFP) |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| M9K Embedded Memory | 378 Kb | 378 Kb | 378 Kb | 378 Kb | 378 Kb | 378 Kb |
| 18x18 Multipliers | 24 | 24 | 24 | 24 | 24 | 24 |
| Integrated ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | No ADC (U grade) | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Junction Temperature | 0C to 85C (commercial) | -40C to 100C (industrial) | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 100C (industrial) | 0C to 85C (commercial) |
| Speed Grade | C8 | I7 | C8 | C8 | I7 | A7 (faster) |
主な差別化要因
- Integrated 12-bit ADC eliminates external analog front-end （vs 10M08SAU144C8G)
- Commercial C8 speed grade offers the lowest cost in the MAX 10 family （vs 10M08SAE144A7G)
- Internal flash configuration enables instant-on without boot PROM （vs 10M08SCE144C8G)
- EQFP package supports standard SMT assembly versus BGA （vs 10M08DCU324I7G)
設計ノート
The 144-EQFP package requires the exposed thermal pad (EP) be soldered to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Per MAX 10 thermal guidelines, without EP soldering the junction-to-ambient thermal resistance degrades from 25 C/W to over 45 C/W, and high-utilization designs at 85C ambient will exceed the commercial junction limit. Use a minimum 4-layer PCB with EP plane on layer 2 for optimal heat spreading.
Power estimation for the 10M08SAE144C8G should account for both static and dynamic current. Estimated: static core current is approximately 15 mA for the 8K LE fabric at 25C; each MHz of toggle activity on average 50% of LEs adds roughly 0.7 mA. For a 50 MHz design with 70% utilization, total ICC is approximately 110 mA. Decouple with 100 nF X7R close to each VCCINT and VCCIO pin, plus a 10 uF bulk capacitor on each supply rail within 1 inch of the device.
Route JTAG signals (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kohm pull-ups on TCK, TMS, and TDI to VCCIO of the I/O bank. Per MAX 10 hardware design guidelines, keep JTAG trace length under 6 inches and avoid splitting the JTAG chain across multiple I/O banks. The TCK signal should be impedance-controlled to 50 ohms to avoid ringing at high download clock rates.
The 12-bit ADC requires a clean analog supply (VCCA) isolated from digital switching noise. Estimated: a 10 uH ferrite bead between VCCA and VCCDIGITAL plus 100 nF + 10 uF local decoupling suppresses 20-30 dB of switching noise. ADC reference accuracy directly limits ENOB; use the internal 2.5V reference only when 8-bit effective resolution is acceptable, otherwise provide an external low-noise reference like the ADR01.
コンプライアンス情報
RoHS compliant per distributor listings. Not AEC-Q100 qualified - for automotive designs use AEC-Q100 qualified MAX 10 variants. Halogen-free status not explicitly stated in the verified web data.
