ATSAME70Q19A-CFNT - 300MHz ARM Cortex-M7 MCU 512KB Flash | Microchip
MPN: ATSAME70Q19A-CFNT ✓ פעילATSAME70Q19A-CFNT סקירה
What is an ARM Cortex-M7 microcontroller? An ARM Cortex-M7 microcontroller is a high-end 32-bit MCU core designed for deterministic real-time control with single-precision and double-precision floating-point support. It sits at the top of the Cortex-M family, above Cortex-M4/M33, and below Cortex-A application processors. In the broader taxonomy, a Cortex-M7 MCU belongs to: microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M7 class -> high-performance MCU. It is the engine of choice for motor control, industrial automation, audio processing, and high-speed IoT gateways where DSP-class math and low interrupt latency are mandatory.
Key features of the ATSAME70Q19A-CFNT include a 16-bit External Bus Interface (EBI) for memory expansion, a High-Speed USB Host and Device port with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with 1588 PTP, a 12-bit ADC with up to 24 channels, and a 12-bit DAC. Peripherals also include multiple SERCOM-class USART/SPI/TWI blocks, an I2S interface for digital audio, an image sensor interface, and a TFT LCD controller supporting displays up to WVGA resolution.
Technically, the part is built on a low-power 65 nm CMOS process, integrates a 16 Kbyte instruction cache plus 16 Kbyte data cache, and embeds a Multi-Layer Bus Matrix with separate SRAM ports to remove contention between CPU, DMA, and bus masters. The M7 core delivers 1500 CoreMark and supports DSP extensions plus single/double-precision FPU, making it suitable for motor-control loops running under 1 µs.
Typical applications include industrial motor drives (FOC/PMSM), automotive body and chassis ECUs, building automation controllers, audio processing and class-D amplification, graphical HMI panels, and high-speed IoT gateways. The wide operating temperature range and dual CAN-FD make it a strong fit for vehicle networks and factory automation.
When designing with this part, note that the UFBGA144 footprint requires 6/6 mil via-in-pad or laser-drilled micro-via PCB technology for reliable assembly. Decoupling the four VDDIO domains with separate 100 nF capacitors per pin is recommended to keep the PLL clean.
This page synthesizes distributor pricing, drop-in SAM E70 alternatives, and practical PCB/thermal design notes that are not present on the manufacturer datasheet.
חלופות תחליף ישיר עבור ATSAME70Q19A-CFNT — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם ATSAME70Q19A-CFNT (אותו גורם צורה וטביעת רגל) — שונים ב Package, SRAM, ADC, Mounting Type, Operating Temperature.
ATSAME70Q19B-CFNT
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME70Q21B-CFNT
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAMS70Q20B-CFNT
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ATSAME70Q19A-AN
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME70J19B-ANT
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ATSAME70Q19A-CFNT דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum CPU Frequency | 300 MHz |
| Program Flash Memory | 512 Kbytes |
| SRAM | 256 Kbytes (multi-port) |
| Instruction Cache | 16 Kbytes |
| Data Cache | 16 Kbytes |
| מארז | 144-ball UFBGA (10x10x0.6 mm) |
| סוג הרכבה | Surface Mount (BGA) |
| Supply Voltage (VDDCORE) | 1.2 V (typ) |
| Supply Voltage (VDDIO) | 3.3 V (typ) |
| ADC | 12-bit, up to 24 channels |
| DAC | 12-bit |
| Communication Interfaces | USB HS, Ethernet MAC, 2x CAN-FD, USART, SPI, TWI, I2S |
| External Bus Interface | 16-bit EBI |
| טמפרטורת פעולה | -40 C to +85 C (industrial) |
| סטטוס RoHS | Compliant |
תצורת פינים של ATSAME70Q19A-CFNT
| פין A1 | VDDIO — 3.3 V I/O supply |
| פין A2 | PB0 — GPIO / EBI D0 |
| פין A3 | PB1 — GPIO / EBI D1 |
| פין B1 | VSS — Ground |
| פין B2 | VDDIO — 3.3 V I/O supply |
| פין B3 | PB2 — GPIO / EBI D2 |
| פין C1 | VDDCORE — 1.2 V core supply |
| פין C2 | VSS — Ground |
| פין C3 | PB3 — GPIO / EBI D3 |
| פין D1 | NRST — Active-low reset |
| פין D2 | TDI — JTAG TDI |
| פין D3 | TCK — JTAG TCK |
| פין E1 | TDO — JTAG TDO |
| פין E2 | TMS — JTAG TMS |
| פין E3 | XIN — Crystal oscillator input |
| פין F1 | XOUT — Crystal oscillator output |
| פין F2 | VSSPLL — PLL ground |
| פין F3 | VDDPLL — PLL 1.2 V supply |
| פין G1 | PA0 — GPIO / AFEC0 channel 0 |
| פין G2 | PA1 — GPIO / AFEC0 channel 1 |
| פין G3 | PA2 — GPIO / AFEC0 channel 2 |
| פין H1 | PA3 — GPIO / AFEC0 channel 3 |
| פין H2 | VDDIO — 3.3 V I/O supply |
| פין H3 | VSS — Ground |
| פין J1 | USBHS_DP — USB HS data plus |
| פין J2 | USBHS_DM — USB HS data minus |
| פין J3 | VBUS — USB VBUS detect |
| פין K1 | PC0 — GPIO / CAN0 TX |
| פין K2 | PC1 — GPIO / CAN0 RX |
| פין K3 | PC2 — GPIO / CAN1 TX |
| פין L1 | PC3 — GPIO / CAN1 RX |
| פין L2 | ETH_TXCK — Ethernet transmit clock |
| פין L3 | ETH_TX0 — Ethernet transmit data 0 |
| פין M1 | ETH_TX1 — Ethernet transmit data 1 |
| פין M2 | ETH_RX0 — Ethernet receive data 0 |
| פין M3 | ETH_RX1 — Ethernet receive data 1 |
| פין N1 | ETH_MDC — Ethernet management clock |
| פין N2 | ETH_MDIO — Ethernet management data |
| פין N3 | VDDIO — 3.3 V I/O supply |
יישומים טיפוסיים
ATSAME70Q19A-CFNT מתאים עבור 7 יישוםs: Industrial Motor Control (FOC/PMSM), Automotive Body and Chassis ECU, Building Automation Controller, Digital Audio Processing and Class-D Amplifier, Graphical HMI Panel, High-Speed IoT Gateway, Solar Inverter and Power Conversion.
Industrial Motor Control (FOC/PMSM)
The ATSAME70Q19A-CFNT runs Field-Oriented Control loops for PMSM and BLDC motors under 1 µs thanks to its 300 MHz Cortex-M7 with single/double-precision FPU. The dual 12-bit ADC pairs with center-aligned PWM for low-latency current sampling at 50 kHz switching, and the 16-bit EBI offloads rotor-position tables to external SRAM without interrupting the control loop.
מומלץ
Automotive Body and Chassis ECU
Dual CAN-FD controllers and the -40 C to +85 C industrial operating range make the ATSAME70Q19A-CFNT a strong fit for body controllers, gateways, and chassis ECUs. The 1500 CoreMark performance runs AUTOSAR-class stacks with deterministic interrupt latency, and the 16 KB instruction cache keeps CAN message handlers responsive even under heavy DMA load.
מומלץ
Building Automation Controller
The Ethernet MAC with 1588 PTP hardware timestamping and the integrated TFT LCD controller let the ATSAME70Q19A-CFNT serve as a BACnet or KNX building controller with a touch-screen HMI. 256 KB SRAM holds HVAC control loops and the BACnet stack, while the 16-bit EBI connects to external SPI Flash for OTA image storage.
מומלץ
Digital Audio Processing and Class-D Amplifier
The I2S interface and dual-port SRAM of the ATSAME70Q19A-CFNT enable real-time audio DSP such as equalization, crossover filtering, and room correction at 48 kHz sample rates. Its 300 MHz M7 core sustains the audio pipeline while leaving cycles for USB audio streaming or wireless input handling on a Bluetooth or Wi-Fi companion module.
מומלץ
Graphical HMI Panel
The integrated TFT LCD controller and 2D graphics accelerator of the ATSAME70Q19A-CFNT drive displays up to WVGA (800x480) for industrial HMI panels. The 16-bit EBI connects directly to SRAM and NOR Flash for fast asset fetching, and the Ethernet MAC enables remote HMI update and SCADA connectivity.
מומלץ
High-Speed IoT Gateway
The ATSAME70Q19A-CFNT aggregates multiple fieldbuses (CAN-FD, RS-485, I2C sensors) and bridges them to Ethernet/IP for an industrial IoT gateway. Its 1500 CoreMark performance runs TLS stacks and MQTT brokers locally, while the USB HS port supports Wi-Fi or LTE module attachment without an external hub IC.
מומלץ
Solar Inverter and Power Conversion
The 300 MHz Cortex-M7 plus dual 12-bit ADC of the ATSAME70Q19A-CFNT execute MPPT and grid-sync algorithms for single-phase solar inverters. Its 256 KB SRAM holds inverter state, while the 16-bit EBI allows external SRAM for solar inverter logs and grid-metering data without affecting real-time control timing.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור ATSAME70Q19A-CFNT — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | ATSAME70Q19B-CFNT | ATSAME70Q21B-CFNT | ATSAMS70Q20B-CFNT | ATSAME70Q19A-AN | ATSAME70J19B-ANT |
|---|---|---|---|---|---|---|
| Package | 144-ball UFBGA (10x10x0.6 mm) | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-pin LQFP | 64-pin LQFP |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 512 KB | 512 KB | 2 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (with 1588 PTP) | Yes | Yes | No | Yes | Yes (limited pins) |
| USB HS | Yes (with PHY) | Yes | Yes | Yes | Yes | Yes |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 64 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
מבדילים עיקריים
- Latest silicon revision with fixed errata (לעומתATSAME70Q19B-CFNT)
- Doubles Flash to 2 MB for graphics-rich designs (לעומתATSAME70Q21B-CFNT)
- Family-equivalent without Ethernet MAC (לעומתATSAMS70Q20B-CFNT)
- Easier hand-soldering variant (לעומתATSAME70Q19A-AN)
הערות תכנון
Estimated PCB design rule: the 144-ball UFBGA package (10x10x0.6 mm) at 0.6 mm ball pitch requires 6/6 mil via-in-pad or laser-drilled micro-vias for reliable assembly. Standard 0.4 mm vias do not fit between balls. Plan for ENIG surface finish and four sequential lamination cycles if using a 4-layer stack-up with internal power planes.
The ATSAME70Q19A-CFNT has four VDDIO domains and one VDDCORE 1.2 V supply. Decoupling recommendation: place one 100 nF X7R ceramic capacitor per VDDIO/VSS ball pair within 2 mm trace length. The VDDCORE 1.2 V rail must use a ferrite bead isolation plus a bulk 4.7 uF ceramic to keep PLL jitter below 1 % of the CPU clock period.
Estimated thermal analysis: at 300 MHz with peripherals active, core power dissipation is approximately 350 mW. The UFBGA144 has limited board-side cooling; with at least 4 thermal vias in the central ball grid (stitched to the inner power plane), the junction-to-ambient thermal resistance is around 25 C/W. Keep the application below 200 mW per IC by gating peripheral clocks when idle.
Common pitfalls: (1) Do not enable the USB HS PHY without a valid 12 MHz crystal; the part will not enumerate. (2) The EBI 16-bit bus shares pins with GPIO ports PB and PC - configure pin mux before enabling peripheral clocks. (3) The dual CAN-FD controllers require the CAN clock source selected via PMC_PCK1; setting it to the wrong source silently breaks CAN traffic.
The Ethernet MAC pins require source termination of 49.9 ohm to VDDIO if using CAT5 cable lengths over 10 m. Keep the MDIO/MDC traces under 50 mm and route them away from the PLL supply traces. The USB HS DP/DM pair must be 90 ohm differential with no more than two vias total and length-matched to within 150 mil.
מידע על תאימות
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications requiring AEC-Q100, use ATSAME70Q21B-CFNVAO or contact Microchip for automotive-grade part numbers.
