BCM2711ZPKFSB06B0TT - Quad Cortex-A72 1.5GHz SoC | Broadcom
MPN: BCM2711ZPKFSB06B0TT ✓ פעילBCM2711ZPKFSB06B0TT סקירה
An application processor (AP) is the highest-level device in the embedded computing hierarchy: system-on-chip (SoC) -> application processor -> microprocessor -> computing platform. Unlike a microcontroller, an SoC such as the BCM2711 integrates CPU cores, a graphics pipeline, a memory controller (for LPDDR4 SDRAM), and a full peripheral fabric, and is designed to boot a full operating system such as Linux.
Key features include four 64-bit Cortex-A72 cores with out-of-order execution, hardware H.265/HEVC 4Kp60 decode and H.264 1080p60 encode/decode, a PCIe Gen 2 interface, dual MIPI DSI display and dual MIPI CSI-2 camera channels, USB 3.0 and USB 2.0 host support via external controllers, and a Gigabit Ethernet MAC. A rich GPIO bank and legacy BCM2835-compatible peripheral registers ease porting from earlier Raspberry Pi generations.
Architecturally, the BCM2711 evolved from the earlier BCM2835/2836/2837 family: the Cortex-A72 cores replace the Cortex-A53 of the BCM2837, delivering roughly 2-3x higher CPU throughput, while the VideoCore VI raises graphics performance substantially over the VideoCore IV. The public BCM2711 ARM Peripherals datasheet (RP-008248, Raspberry Pi Trading Ltd, Version 1, 5 February 2020) documents the peripheral map for OS porting.
Typical applications include single-board computers, industrial HMI and edge-AI gateways, digital signage and 4K media players, and embedded vision systems leveraging the dual CSI-2 camera interfaces.
Design consideration: the FCBGA package requires controlled-impedance PCB stack-up for LPDDR4, PCIe and USB 3.0 routing, and the SoC needs an external PMIC and boot EEPROM - it is not a stand-alone module.
This page adds distributor sourcing data, drop-in alternatives, and design notes not found in the manufacturer datasheet.
חלופות תחליף ישיר עבור BCM2711ZPKFSB06B0TT — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם BCM2711ZPKFSB06B0TT (אותו גורם צורה וטביעת רגל) — שונים ב CPU Core, GPU, Memory Support, USB, Video Decode.
BCM2711ZPKFSB06C0T
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←BCM2711ZPKFSB06B0TT דירוגים מרביים ומאפיינים חשמליים
| CPU Core | Quad-core ARM Cortex-A72 (ARMv8-A, 64-bit) |
| CPU Clock Frequency | 1.5 GHz |
| GPU | VideoCore VI |
| Video Decode | 4Kp60 HEVC (H.265) hardware decode |
| Video Encode | 1080p60 H.264 |
| Memory Support | LPDDR4 SDRAM (external) |
| PCIe | PCI Express Gen 2 interface |
| Camera Interfaces | 2x MIPI CSI-2 |
| Display Interfaces | 2x MIPI DSI, HDMI |
| USB | USB 3.0 and USB 2.0 host support |
| Ethernet | Gigabit Ethernet MAC |
| GPIO | BCM2835-compatible GPIO bank with alternate functions |
| מארז | FCBGA (flip-chip ball grid array) |
| סוג הרכבה | Surface Mount (BGA) |
| סטטוס RoHS | Compliant (per distributor listing) |
מדריך תצורת פינים של BCM2711ZPKFSB06B0TT fcbga (flip-chip ball grid array)
תצורת פינים עבור BCM2711ZPKFSB06B0TT (מארזת fcbga (flip-chip ball grid array)). רכיב אנלוגי זה כולל פיני כניסה, יציאה ואספקת מתח. יש לעיין בגיליון הנתונים של היצרן לתצורות פיני איפוס היסט, פיצוי והפעלה. אידיאלי למעגלי עיצוב אותות ומגברים.
אין נתוני פריסת פינים מפורטים עבור BCM2711ZPKFSB06B0TT.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
BCM2711ZPKFSB06B0TT מתאים עבור 6 יישוםs: Single-Board Computers, Industrial Edge Gateways, Digital Signage and 4K Media Players, Embedded Vision Systems, Home Automation and Smart Hubs, Networking and NAS Appliances.
Single-Board Computers
The BCM2711 is the application processor of the Raspberry Pi 4 Model B, where its quad Cortex-A72 cores at 1.5 GHz deliver roughly 2-3x the CPU throughput of the BCM2837's Cortex-A53 cores. It boots standard 64-bit Linux, drives dual 4Kp60 displays through its VideoCore VI GPU and dual HDMI paths, and offers desktop-class responsiveness in a credit-card form factor. Designers use it for education, prototyping, and low-volume products. Because the SoC requires external LPDDR4, a PMIC and boot firmware, most product designs adopt the Compute Module 4, which exposes the same BCM2711 silicon through a defined high-density connector with validated power and memory design.
מומלץ
Industrial Edge Gateways
Industrial IoT gateways benefit from the BCM2711's combination of Gigabit Ethernet MAC, PCIe Gen 2 root-complex capability for 4G/5G modems or NVMe storage, and a rich GPIO bank with legacy BCM2835-compatible registers. The quad Cortex-A72 cores at 1.5 GHz run containerized workloads, protocol conversion stacks and on-device inference, while the VideoCore VI offloads HMI rendering. Typical deployments pair the SoC with wide-input power, a hardware watchdog and industrial temperature screening of the surrounding BOM. Thermal design matters: at several watts of dissipation, a heatsink and directed airflow keep the junction within limits and prevent sustained thermal throttling of the CPU cores.
מומלץ
Digital Signage and 4K Media Players
The BCM2711's hardware 4Kp60 HEVC (H.265) decode and VideoCore VI graphics make it a strong fit for digital signage players and media appliances that must drive one or two 4K panels continuously. Because decode is handled in dedicated silicon, CPU cores stay free for content management, networking and analytics, reducing power versus software decoding. Dual MIPI DSI and HDMI output paths support multi-screen installations, and Gigabit Ethernet streams content from central servers. Designers should budget for continuous thermal load - media playback runs the SoC for thousands of hours, so a heatsink plus enclosure convection or a fan is standard practice to avoid long-term throttling.
מומלץ
Embedded Vision Systems
With two MIPI CSI-2 camera channels, the BCM2711 supports dual-camera or camera-plus-display configurations, making it suitable for machine-vision nodes, smart retail sensors and stereo depth rigs. The Cortex-A72 quad core handles frame preprocessing, codec pipelines and inference frameworks, while PCIe Gen 2 allows attachment of NPUs or high-bandwidth capture hardware. The Broadcom ISP processes raw sensor data for HDR and low-light scenes. System designers typically source the camera ecosystem and validated driver stack from the Raspberry Pi platform to shorten development time. Power and thermal headroom should be reserved, since sustained ISP plus CPU load approaches the SoC's practical dissipation limit.
מומלץ
Home Automation and Smart Hubs
Smart-home hubs built on the BCM2711 combine always-on connectivity, local automation logic and media output. The quad Cortex-A72 cores run home-automation servers and Zigbee/Thread/Matter bridges, the Gigabit Ethernet MAC and USB 3.0 provide backhaul and peripheral expansion, and VideoCore VI renders dashboard UIs on attached touch panels. GPIO with legacy BCM2835-compatible registers allows direct attachment of RF modules, sensors and relays, easing migration of designs previously built on the BCM2835. For 24/7 operation, designers should validate idle power, choose an efficient PMIC, and provide passive cooling; the SoC idles at low power but needs thermal margin for burst workloads such as firmware updates and video streaming.
מומלץ
Networking and NAS Appliances
The BCM2711's PCIe Gen 2 interface is the enabling feature for compact NAS and network appliances: it connects to SATA controllers, NVMe adapters or multi-port Ethernet ICs that earlier Raspberry Pi SoCs lacked. Combined with the native Gigabit Ethernet MAC, USB 3.0 host bandwidth and quad Cortex-A72 CPU power for encryption and file services, it supports hobbyist and light-commercial storage products and software routers. Throughput planning is essential - PCIe Gen 2 lanes and the shared USB/Ethernet topology set practical bandwidth ceilings well below server-class hardware, so designers should size expectations to roughly gigabit-class file transfer. Adequate cooling sustains sustained transfer loads without throttling.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור BCM2711ZPKFSB06B0TT — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | BCM2711ZPKFSB06C0T |
|---|---|---|
| Package | FCBGA | FCBGA - same |
| Brand | Broadcom | Broadcom - same |
| CPU Cores | 4x ARM Cortex-A72 (64-bit) | 4x ARM Cortex-A72 (64-bit) |
| CPU Clock | 1.5 GHz | 1.5 GHz |
| GPU | VideoCore VI | VideoCore VI |
| Video Decode | 4Kp60 HEVC | 4Kp60 HEVC |
| PCIe / USB 3.0 | PCIe Gen 2, USB 3.0 supported | PCIe Gen 2, USB 3.0 supported |
| Memory Support | LPDDR4 (external) | LPDDR4 (external) |
| Reference Platforms | Raspberry Pi 4 family | Raspberry Pi 4 family |
מבדילים עיקריים
- Cortex-A72 performance uplift (לעומתBCM2837B0IFSBG)
- 4Kp60 HEVC hardware decode (לעומתBCM2837RIFBG)
- True drop-in sister grade availability (לעומתBCM2711ZPKFSB06C0T)
הערות תכנון
The BCM2711 requires a multi-rail power tree (core, memory, IO and always-on domains) that is not fully published; the practical approach is to copy the Raspberry Pi 4 / Compute Module 4 reference design power stage or use the recommended PMIC solution from the CM4 schematic. Estimated: peak board-level current on a Pi 4 reaches roughly 3 A at 5 V under load, so size your 5 V input stage for at least 3 A continuous with margin. Include inrush limiting and a hardware watchdog to recover from brownout-induced boot corruption.
Estimated: at 1.5 GHz under multithreaded load the SoC dissipates on the order of 4-8 W; the public datasheet does not give theta-JA for the FCBGA, so thermal validation must be empirical. On Raspberry Pi 4 boards, sustained load without cooling causes CPU-frequency throttling once the die reaches its thermal limit. For enclosed products, specify a heatsink bonded to the SoC with a thermally conductive path to the enclosure, and verify sustained (not just burst) performance at your maximum ambient temperature.
The FCBGA package routes LPDDR4, PCIe Gen 2, USB 3.0 and MIPI lanes on the substrate, so the host PCB needs controlled-impedance stack-up, length-matched memory routing per LPDDR4 guidelines, and 90-ohm differential pairs for PCIe and USB 3.0. Most teams avoid bare-SoC layouts entirely by adopting the Compute Module 4, which integrates the BCM2711, LPDDR4 and WiFi onto a validated module with a defined connector - dramatically reducing layout risk and certification burden. Reserve this option at project start rather than discovering bare-die complexity late.
Boot depends on an external SPI EEPROM containing bootcode - a bare BCM2711 will not boot from a blank board without it, and first-boot USB/network boot modes require specific OTP programming done at manufacture. Software teams should also note that the public BCM2711 ARM Peripherals datasheet (RP-008248) covers the peripheral register map only; full electrical characterization, power sequencing and ball map are not public, so never design a production bare-SoC board without engaging the Raspberry Pi/Broadcom supply chain for the confidential hardware documentation.
מידע על תאימות
Distributor listings (Sierra IC) show RoHS-compliant options for the BCM2711 family; full REACH, lead-free and halogen-free declarations were not found in the provided data.
