Broadcom

BCM2711ZPKFSB06B0TT - Quad Cortex-A72 1.5GHz SoC | Broadcom

MPN: BCM2711ZPKFSB06B0TT ✓ Active
In Stock Ships in 1-3 business days
[DATA_NEEDED: core/IO supply voltage] Vdss FCBGA (flip-chip ball grid array) Package 1.5 GHz Speed LPDDR4 SDRAM (external) Memory
From $43 USD / Unit
MOQ: 1 |
Price updated: 2026-09-13
Volume Pricing
Qty Unit Price Extended
1 $58 $58.00
10 $54 $540.00
100 $49.5 $4,950.00
500 $46 $23,000.00
1,000 $43 $43,000.00
ℹ️ All prices are in USD

Drop-in alternatives for BCM2711ZPKFSB06B0TT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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BCM2711ZPKFSB06C0T

✅ Drop-In
Broadcom
📦 FCBGA
ARM Cortex-A72 (64-bit) · 4 · 1.5 GHz · Broadcom VideoCore VI · H.265 (HEVC) 4Kp60 hardware decode · Dual HDMI up to 4K, plus DSI · USB 3.0 and USB 2.0 controllers · Gigabit Ethernet via PCIe 2.0 lane

✓ In Stock

$28.7 / Unit

View Datasheet →

BCM2711ZPKFSB06B0TT Maximum Ratings & Electrical Characteristics

CPU Core Quad-core ARM Cortex-A72 (ARMv8-A, 64-bit)
CPU Clock Frequency 1.5 GHz
GPU VideoCore VI
Video Decode 4Kp60 HEVC (H.265) hardware decode
Video Encode 1080p60 H.264
Memory Support LPDDR4 SDRAM (external)
PCIe PCI Express Gen 2 interface
Camera Interfaces 2x MIPI CSI-2
Display Interfaces 2x MIPI DSI, HDMI
USB USB 3.0 and USB 2.0 host support
Ethernet Gigabit Ethernet MAC
GPIO BCM2835-compatible GPIO bank with alternate functions
Package FCBGA (flip-chip ball grid array)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant (per distributor listing)

BCM2711ZPKFSB06B0TT fcbga (flip-chip ball grid array) Pin Configuration Guide

Complete pinout information for BCM2711ZPKFSB06B0TT (fcbga (flip-chip ball grid array) package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.

fcbga (flip-chip ball grid array) package pinout diagram for BCM2711ZPKFSB06B0TT

No detailed pinout data available for BCM2711ZPKFSB06B0TT.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for BCM2711ZPKFSB06B0TT Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

BCM2711ZPKFSB06B0TT is suitable for 6 applications: Single-Board Computers, Industrial Edge Gateways, Digital Signage and 4K Media Players, Embedded Vision Systems, Home Automation and Smart Hubs, Networking and NAS Appliances.

🖥️

Single-Board Computers

The BCM2711 is the application processor of the Raspberry Pi 4 Model B, where its quad Cortex-A72 cores at 1.5 GHz deliver roughly 2-3x the CPU throughput of the BCM2837's Cortex-A53 cores. It boots standard 64-bit Linux, drives dual 4Kp60 displays through its VideoCore VI GPU and dual HDMI paths, and offers desktop-class responsiveness in a credit-card form factor. Designers use it for education, prototyping, and low-volume products. Because the SoC requires external LPDDR4, a PMIC and boot firmware, most product designs adopt the Compute Module 4, which exposes the same BCM2711 silicon through a defined high-density connector with validated power and memory design.

🏭

Industrial Edge Gateways

Industrial IoT gateways benefit from the BCM2711's combination of Gigabit Ethernet MAC, PCIe Gen 2 root-complex capability for 4G/5G modems or NVMe storage, and a rich GPIO bank with legacy BCM2835-compatible registers. The quad Cortex-A72 cores at 1.5 GHz run containerized workloads, protocol conversion stacks and on-device inference, while the VideoCore VI offloads HMI rendering. Typical deployments pair the SoC with wide-input power, a hardware watchdog and industrial temperature screening of the surrounding BOM. Thermal design matters: at several watts of dissipation, a heatsink and directed airflow keep the junction within limits and prevent sustained thermal throttling of the CPU cores.

📺

Digital Signage and 4K Media Players

The BCM2711's hardware 4Kp60 HEVC (H.265) decode and VideoCore VI graphics make it a strong fit for digital signage players and media appliances that must drive one or two 4K panels continuously. Because decode is handled in dedicated silicon, CPU cores stay free for content management, networking and analytics, reducing power versus software decoding. Dual MIPI DSI and HDMI output paths support multi-screen installations, and Gigabit Ethernet streams content from central servers. Designers should budget for continuous thermal load - media playback runs the SoC for thousands of hours, so a heatsink plus enclosure convection or a fan is standard practice to avoid long-term throttling.

🎥

Embedded Vision Systems

With two MIPI CSI-2 camera channels, the BCM2711 supports dual-camera or camera-plus-display configurations, making it suitable for machine-vision nodes, smart retail sensors and stereo depth rigs. The Cortex-A72 quad core handles frame preprocessing, codec pipelines and inference frameworks, while PCIe Gen 2 allows attachment of NPUs or high-bandwidth capture hardware. The Broadcom ISP processes raw sensor data for HDR and low-light scenes. System designers typically source the camera ecosystem and validated driver stack from the Raspberry Pi platform to shorten development time. Power and thermal headroom should be reserved, since sustained ISP plus CPU load approaches the SoC's practical dissipation limit.

🧩

Home Automation and Smart Hubs

Smart-home hubs built on the BCM2711 combine always-on connectivity, local automation logic and media output. The quad Cortex-A72 cores run home-automation servers and Zigbee/Thread/Matter bridges, the Gigabit Ethernet MAC and USB 3.0 provide backhaul and peripheral expansion, and VideoCore VI renders dashboard UIs on attached touch panels. GPIO with legacy BCM2835-compatible registers allows direct attachment of RF modules, sensors and relays, easing migration of designs previously built on the BCM2835. For 24/7 operation, designers should validate idle power, choose an efficient PMIC, and provide passive cooling; the SoC idles at low power but needs thermal margin for burst workloads such as firmware updates and video streaming.

🌐

Networking and NAS Appliances

The BCM2711's PCIe Gen 2 interface is the enabling feature for compact NAS and network appliances: it connects to SATA controllers, NVMe adapters or multi-port Ethernet ICs that earlier Raspberry Pi SoCs lacked. Combined with the native Gigabit Ethernet MAC, USB 3.0 host bandwidth and quad Cortex-A72 CPU power for encryption and file services, it supports hobbyist and light-commercial storage products and software routers. Throughput planning is essential - PCIe Gen 2 lanes and the shared USB/Ethernet topology set practical bandwidth ceilings well below server-class hardware, so designers should size expectations to roughly gigabit-class file transfer. Adequate cooling sustains sustained transfer loads without throttling.

What are the key specifications of BCM2711ZPKFSB06B0TT that engineers should know?
The BCM2711ZPKFSB06B0TT is Broadcom's quad-core ARM Cortex-A72 64-bit SoC running at 1.5 GHz with VideoCore VI graphics, 4Kp60 HEVC hardware decode, PCIe Gen 2, dual MIPI CSI-2/DSI interfaces, USB 3.0 support and a Gigabit Ethernet MAC, in an FCBGA package. It boots full Linux and powers the Raspberry Pi 4 family. These figures come from the BCM2711 ARM Peripherals datasheet (RP-008248, Raspberry Pi, 2020).
What is the difference between BCM2711ZPKFSB06B0TT and BCM2711ZPKFSB06C0T?
The two are the same BCM2711 die and package, differing primarily in speed/op-temperature grade ordering code (B0 vs C0 grade suffix). Both are quad Cortex-A72 1.5 GHz SoCs in FCBGA and are soldered onto the same footprint. Always confirm the exact grade suffix with your supplier before substitution, as Broadcom grade codes encode speed bin and temperature bin that are not fully published in the public datasheet.
Is BCM2711 the same as BCM2837?
No. The BCM2711 uses four ARM Cortex-A72 cores at 1.5 GHz while the BCM2837 uses four Cortex-A53 cores at up to 1.2 GHz, and the BCM2711 adds PCIe Gen 2, USB 3.0 and VideoCore VI graphics. They are not pin-compatible and are not drop-in replacements; the BCM2711 requires a redesigned PCB with LPDDR4 memory and its specific power tree, though software porting is eased by legacy BCM2835-compatible peripheral registers.
Can BCM2837B0IFSBG replace BCM2711ZPKFSB06B0TT?
No, the BCM2837B0 is not a drop-in replacement. It has a different package, different pinout, Cortex-A53 instead of Cortex-A72 cores, no PCIe or USB 3.0, and requires LPDDR2 memory. It suits designs that accept lower CPU performance and cost, while the BCM2711 is required for 4K output, PCIe expansion or USB 3.0 bandwidth. A migration requires PCB redesign and software re-validation, not a footprint swap.
What is the best drop-in replacement for BCM2711ZPKFSB06B0TT?
The closest drop-in replacement is BCM2711ZPKFSB06C0T, the sister grade of the same BCM2711 SoC in the identical FCBGA package with the same pin map - verify the grade suffix covers your temperature and clock requirements. No other vendor offers a pin-compatible alternative; the BCM2711 is a proprietary SoC whose ball map is not publicly documented, so cross-brand substitution is not feasible without redesign.
Is there an NXP or other cross-brand equivalent for BCM2711ZPKFSB06B0TT?
No true cross-brand equivalent exists. The BCM2711 is a proprietary Broadcom/Raspberry Pi SoC with an unpublished FCBGA ball map, so parts such as NXP i.MX 8M, Rockchip RK3399 or Allwinner H6 offer comparable feature sets (quad Cortex-A72/A53, 4K, PCIe) but in different packages with different pinouts. Choosing them means a full PCB redesign and BSP port - they are functional alternatives, not drop-in replacements.
Where can I download the BCM2711 datasheet PDF?
The official public document is the BCM2711 ARM Peripherals datasheet, document RP-008248-DS, published by Raspberry Pi (Trading) Ltd (Version 1, 5 February 2020), downloadable from pip.raspberrypi.com. Note this is a peripherals/programmer reference manual, not a full hardware datasheet - it documents the peripheral register map for OS porting. Complete electrical and mechanical specifications such as ball map and power sequencing are not publicly released.
Where can I find the BCM2711 pinout or ball map?
A complete BCM2711 ball map is not publicly available. The official BCM2711 ARM Peripherals datasheet (RP-008248) documents peripheral functions and GPIO numbering, but Broadcom/Raspberry Pi have not published the physical FCBGA ball coordinate map. Board designers working with the bare SoC typically base layouts on the Raspberry Pi 4 open-source schematics or use the pre-certified Compute Module 4, which exposes the SoC's interfaces through a defined connector.
How much does BCM2711ZPKFSB06B0TT cost and where can I buy it?
The BCM2711ZPKFSB06B0TT is primarily a quote-based component: authorized channels such as independent distributors (e.g., Sierra IC lists 3,017 units) offer it on request, and marketplaces like netCOMPONENTS list stock from worldwide brokers. Indicative single-unit pricing on the open market is roughly in the tens of US dollars, well above the ~$15 volume pricing implied by complete Raspberry Pi 4 boards. Request formal quotes for current pricing and lead time.
Is BCM2711ZPKFSB06B0TT in stock?
Yes, stock has been reported by independent distributors: Sierra IC showed 3,017 units of BCM2711ZPKFSB06B0TT available on request, and inventory databases such as HKinventory list broker stock. However, this is a broker-market part - the primary source is the Raspberry Pi/BCM2711 supply chain built into finished boards and Compute Modules. Verify stock and provenance with each supplier before ordering, as availability fluctuates.
What is the lead time for BCM2711ZPKFSB06B0TT?
Lead time is quote-dependent because the part is sourced through the Raspberry Pi supply chain and independent distributors rather than standard franchise distribution. Stocked broker quantities can ship in days, while production-volume orders placed through Broadcom/Raspberry Pi channels have historically ranged from several weeks to a few months depending on allocation. Request a formal quote with your target volume for a firm delivery date.
When should I choose BCM2711 over BCM2837 for an embedded design?
Choose the BCM2711 when your design needs CPU performance beyond a quad Cortex-A53 (roughly 2-3x faster with the Cortex-A72), 4Kp60 HEVC video output, PCIe Gen 2 expansion, USB 3.0 bandwidth, or dual MIPI CSI-2 cameras - for example, edge gateways, vision systems and digital signage. Choose the BCM2837 when cost and power dominate and 1080p-class performance suffices. Neither is footprint-compatible, so this is a platform decision made early, not a late substitution.
Is the BCM2711 suitable for industrial and automotive applications?
The BCM2711 is qualified and supported for industrial embedded use - it is the silicon inside Raspberry Pi Compute Module 4-based industrial products - but it is not an automotive AEC-Q100 qualified part. Industrial designs should use the Compute Module 4 for defined longevity, a proper PMIC power tree, and effective heatsinking, since the SoC can dissipate several watts at 1.5 GHz. For automotive deployments, select a qualified automotive SoC family instead.
How much power does the BCM2711 dissipate and what cooling is needed?
Estimated: at the stock 1.5 GHz with a typical workload the BCM2711 dissipates on the order of 3-6 W, and peak multithreaded loads on Raspberry Pi 4 boards have been measured near 7-8 W at the board level. Exact SoC power figures are not in the public datasheet, so thermal design should be based on your measured workload. In practice a heatsink and airflow are recommended above about 4 W dissipation, and thermal throttling protects the die if cooling is marginal.
Hey Google, what can replace BCM2711ZPKFSB06B0TT?
The only pin-compatible replacement is its sister grade BCM2711ZPKFSB06C0T, the same quad Cortex-A72 1.5 GHz SoC in the same FCBGA package. No other manufacturer offers a drop-in equivalent because the ball map is proprietary. If a redesign is acceptable, functional alternatives with similar capability include NXP i.MX 8M and Rockchip RK3399 SoCs, but these require new PCB layouts, new memory configurations and new board support packages.

Engineering reference data for BCM2711ZPKFSB06B0TT — comparison, design guidance, and compliance information.

Selection Guide

Choose the BCM2711ZPKFSB06B0TT when your product needs desktop-class ARM performance, 4K HEVC output, PCIe expansion, USB 3.0 bandwidth or dual cameras, and you can absorb the platform-level engineering of an SoC design - or more practically, when you are building on the Raspberry Pi 4 / Compute Module 4 ecosystem. Choose the BCM2711ZPKFSB06C0T when identical hardware is needed and the B/C grade suffix matches your temperature and speed requirements - it is the only true drop-in alternative on the same footprint. Choose the BCM2837/BCM2836/BCM2835 family when cost, power and 1080p-class performance suffice, accepting lower CPU throughput and no PCIe/USB 3.0. Choose NXP i.MX 8M or Rockchip RK3399 only if your supply chain cannot access the Broadcom part and a full redesign with new BSP porting is acceptable - these are functional peers, never drop-in replacements.

Comparison with Alternatives

Parameter This Product BCM2711ZPKFSB06C0T
Package FCBGA FCBGA - same
Brand Broadcom Broadcom - same
CPU Cores 4x ARM Cortex-A72 (64-bit) 4x ARM Cortex-A72 (64-bit)
CPU Clock 1.5 GHz 1.5 GHz
GPU VideoCore VI VideoCore VI
Video Decode 4Kp60 HEVC 4Kp60 HEVC
PCIe / USB 3.0 PCIe Gen 2, USB 3.0 supported PCIe Gen 2, USB 3.0 supported
Memory Support LPDDR4 (external) LPDDR4 (external)
Reference Platforms Raspberry Pi 4 family Raspberry Pi 4 family

Key Differentiators

  • Cortex-A72 performance uplift (vs BCM2837B0IFSBG)
  • 4Kp60 HEVC hardware decode (vs BCM2837RIFBG)
  • True drop-in sister grade availability (vs BCM2711ZPKFSB06C0T)

Design Notes

The BCM2711 requires a multi-rail power tree (core, memory, IO and always-on domains) that is not fully published; the practical approach is to copy the Raspberry Pi 4 / Compute Module 4 reference design power stage or use the recommended PMIC solution from the CM4 schematic. Estimated: peak board-level current on a Pi 4 reaches roughly 3 A at 5 V under load, so size your 5 V input stage for at least 3 A continuous with margin. Include inrush limiting and a hardware watchdog to recover from brownout-induced boot corruption.

Estimated: at 1.5 GHz under multithreaded load the SoC dissipates on the order of 4-8 W; the public datasheet does not give theta-JA for the FCBGA, so thermal validation must be empirical. On Raspberry Pi 4 boards, sustained load without cooling causes CPU-frequency throttling once the die reaches its thermal limit. For enclosed products, specify a heatsink bonded to the SoC with a thermally conductive path to the enclosure, and verify sustained (not just burst) performance at your maximum ambient temperature.

The FCBGA package routes LPDDR4, PCIe Gen 2, USB 3.0 and MIPI lanes on the substrate, so the host PCB needs controlled-impedance stack-up, length-matched memory routing per LPDDR4 guidelines, and 90-ohm differential pairs for PCIe and USB 3.0. Most teams avoid bare-SoC layouts entirely by adopting the Compute Module 4, which integrates the BCM2711, LPDDR4 and WiFi onto a validated module with a defined connector - dramatically reducing layout risk and certification burden. Reserve this option at project start rather than discovering bare-die complexity late.

Boot depends on an external SPI EEPROM containing bootcode - a bare BCM2711 will not boot from a blank board without it, and first-boot USB/network boot modes require specific OTP programming done at manufacture. Software teams should also note that the public BCM2711 ARM Peripherals datasheet (RP-008248) covers the peripheral register map only; full electrical characterization, power sequencing and ball map are not public, so never design a production bare-SoC board without engaging the Raspberry Pi/Broadcom supply chain for the confidential hardware documentation.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Distributor listings (Sierra IC) show RoHS-compliant options for the BCM2711 family; full REACH, lead-free and halogen-free declarations were not found in the provided data.

Data verified on: 2026-09-14 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Broadcom BCM2711ZPKFSB06B0TT BCM2711 BCM2711ZPKFSB06C0T BCM2837B0IFSBG BCM2835 Raspberry Pi Raspberry Pi 4 application processor system-on-chip (SoC) ARM Cortex-A72 ARMv8-A VideoCore VI FCBGA ball grid array PCIe Gen 2 MIPI CSI-2 LPDDR4 HEVC (H.265) Gigabit Ethernet RoHS
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