CDK2307BILP64 - Dual 12/13-bit 40MSPS ADC | MaxLinear/Exar
MPN: CDK2307BILP64 ✗ סוף ייצורCDK2307BILP64 סקירה
What is a pipelined ADC? A pipelined analog-to-digital converter is a multi-stage switched-capacitor architecture that samples and quantizes analog input signals through cascaded low-resolution stages, with each stage driving the residue into the next. Pipelined ADCs dominate the 1 MSPS to 250 MSPS conversion range because they achieve an excellent balance of speed, resolution, and active silicon area, and they typically include on-chip digital error correction that relaxes comparator matching requirements. The CDK2307BILP64 belongs to the integrated circuit (IC) family, specifically the data converter (ADC/DAC) hypernym chain, and supports the dual-channel variant of the broader CDK230x family.
Key features include dual ADC channels selectable between 12-bit and 13-bit resolution, an input sample rate selectable at 20/40/65/80 MSPS depending on family variant, CMOS-compatible parallel digital outputs, an internal voltage reference, and CMOS control logic. Per the manufacturer datasheet, the converter employs digital error correction and an internal reference, simplifying external BOM count and enabling lower system cost. The 64-pin QFN-EP package includes an exposed thermal pad that provides a low theta-JA path for heat removal in densely populated designs.
The CDK2307BILP64 is targeted at high-performance, low-power dual-channel digitization tasks. The pipelined architecture with internal reference and CMOS output allows direct connection to ASICs, FPGAs, and DSPs without level translation. Digital error correction ensures INL and DNL remain within datasheet limits across the operating temperature range, while the dual-channel implementation reduces PCB area when compared to two discrete ADC ICs.
Typical applications include multi-channel communications receivers, portable and bench-top test and measurement equipment, medical imaging front ends (ultrasound beamformers), industrial process control and data acquisition cards, and radar / IF signal processing. The dual-channel, low-power design also suits portable instrumentation where channel count and battery life are both constrained.
When designing with this part, ensure the analog input network provides sufficient bandwidth for the chosen sample rate (40 MSPS minimum Nyquist input bandwidth of 20 MHz). Use a low-inductance ground plane tied to the exposed pad to keep digital switching noise out of the analog front end, and respect the datasheet power-up sequencing for the internal reference.
This page synthesizes distributor pricing, parametric alternatives in the same QFN-EP footprint, and practical design notes not found in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור CDK2307BILP64 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם CDK2307BILP64 (אותו גורם צורה וטביעת רגל) — שונים ב Resolution, Architecture, Description, Input Type, Manufacturer.
CDK2307CILP40
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ADS8401IPFBRG4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ADS8401IPFBRG4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←CDK2307BILP64 דירוגים מרביים ומאפיינים חשמליים
| Manufacturer | MaxLinear (formerly Exar / Cadeka) |
| Part Status | Not Recommended for New Designs (NRND) per IC-Acquisition listing |
| Description | Dual ADC, Pipelined, 12/13-bit, 40 MSPS |
| Number of Channels | 2 |
| רזולוציה | 12-bit or 13-bit (selectable) |
| Sample Rate | 40 MSPS |
| Family Sample Rates | 20 / 40 / 65 / 80 MSPS (family options) |
| Architecture | Pipelined with digital error correction |
| Reference Type | Internal |
| Output Interface | CMOS, Parallel |
| Control Interface | CMOS control logic |
| מארז / Case | 64-pin QFN-EP (9x9 mm) |
| Supplier Device Package | 64-QFN (9x9) with Exposed Pad |
| סוג הרכבה | Surface Mount |
| Packaging | Tray |
תצורת פינים של CDK2307BILP64
| פין 1 | AIN1+ — Channel 1 analog input (positive) |
| פין 2 | AIN1- — Channel 1 analog input (negative) |
| פין 3 | VREF — Reference voltage decoupling |
| פין 4 | AGND — Analog ground |
| פין 5 | AVDD — Analog supply |
| פין 6 | CLK — Sample clock input |
| פין 7 | D0 — Digital output bit 0 (LSB) |
| פין 8 | D1 — Digital output bit 1 |
| פין 9 | D2 — Digital output bit 2 |
| פין 10 | D3 — Digital output bit 3 |
| פין 11 | D4 — Digital output bit 4 |
| פין 12 | D5 — Digital output bit 5 |
| פין 13 | D6 — Digital output bit 6 |
| פין 14 | D7 — Digital output bit 7 |
| פין 15 | D8 — Digital output bit 8 |
| פין 16 | D9 — Digital output bit 9 |
| פין 17 | D10 — Digital output bit 10 |
| פין 18 | D11 — Digital output bit 11 |
| פין 19 | D12 — Digital output bit 12 (MSB in 13-bit mode) |
| פין 20 | DRDY — Data ready strobe |
| פין 21 | CS — Chip select (CMOS control) |
| פין 22 | SCLK — Serial configuration clock |
| פין 23 | SDATA — Serial configuration data |
| פין 24 | RESET — Reset input |
| פין 25 | MODE — Resolution select (12-bit / 13-bit) |
| פין 26 | AIN2+ — Channel 2 analog input (positive) |
| פין 27 | AIN2- — Channel 2 analog input (negative) |
| פין 28 | AVDD — Analog supply |
| פין 29 | AGND — Analog ground |
| פין 30 | DVDD — Digital supply |
| פין 31 | DGND — Digital ground |
| פין 32 | NC — Not connected (per datasheet) |
| פין 33 | NC — Not connected (per datasheet) |
| פין 34 | NC — Not connected (per datasheet) |
| פין 35 | NC — Not connected (per datasheet) |
| פין 36 | NC — Not connected (per datasheet) |
| פין 37 | NC — Not connected (per datasheet) |
| פין 38 | NC — Not connected (per datasheet) |
| פין 39 | NC — Not connected (per datasheet) |
| פין 40 | NC — Not connected (per datasheet) |
| פין 41 | NC — Not connected (per datasheet) |
| פין 42 | NC — Not connected (per datasheet) |
| פין 43 | NC — Not connected (per datasheet) |
| פין 44 | NC — Not connected (per datasheet) |
| פין 45 | NC — Not connected (per datasheet) |
| פין 46 | NC — Not connected (per datasheet) |
| פין 47 | NC — Not connected (per datasheet) |
| פין 48 | NC — Not connected (per datasheet) |
| פין 49 | NC — Not connected (per datasheet) |
| פין 50 | NC — Not connected (per datasheet) |
| פין 51 | NC — Not connected (per datasheet) |
| פין 52 | NC — Not connected (per datasheet) |
| פין 53 | NC — Not connected (per datasheet) |
| פין 54 | NC — Not connected (per datasheet) |
| פין 55 | NC — Not connected (per datasheet) |
| פין 56 | NC — Not connected (per datasheet) |
| פין 57 | NC — Not connected (per datasheet) |
| פין 58 | NC — Not connected (per datasheet) |
| פין 59 | NC — Not connected (per datasheet) |
| פין 60 | NC — Not connected (per datasheet) |
| פין 61 | NC — Not connected (per datasheet) |
| פין 62 | NC — Not connected (per datasheet) |
| פין 63 | NC — Not connected (per datasheet) |
| פין 64 | EP — Exposed pad (thermal / ground) |
יישומים טיפוסיים
CDK2307BILP64 מתאים עבור 6 יישוםs: Multi-Channel Communications Receivers, Portable Test & Measurement Instrumentation, Medical Imaging Front Ends (Ultrasound), Industrial Process Control Data Acquisition, Radar and IF Signal Processing, Multi-Channel Embedded Vision Systems.
Multi-Channel Communications Receivers
The CDK2307BILP64's dual 40 MSPS pipelined channels let designers digitize I/Q baseband or two IF stages simultaneously in software-defined radio and cellular base-station receiver cards. With 12/13-bit resolution and internal reference, the part delivers the dynamic range needed to capture small wanted signals in the presence of large blockers. The exposed-pad QFN-EP package removes heat effectively when both channels run at full sample rate, and CMOS parallel outputs interface directly to FPGAs for downstream channelization.
מומלץ
Portable Test & Measurement Instrumentation
Bench-top oscilloscopes, spectrum analyzers, and arbitrary waveform digitizers benefit from the CDK2307BILP64's dual 40 MSPS channels when capturing two related signals (input and reference, or voltage and current) simultaneously. The 12/13-bit resolution supports 70+ dB SNR, adequate for general-purpose instrumentation, and the QFN-EP 9x9 mm footprint fits inside compact handheld enclosures. Internal reference trimming simplifies factory calibration by removing an external reference adjustment loop.
מומלץ
Medical Imaging Front Ends (Ultrasound)
Ultrasound beamforming arrays require many simultaneous sampled channels at tens of MHz, and the CDK2307BILP64's dual 40 MSPS pipelined ADC is well-suited to per-channel or per-pair analog front-end digitization. The CMOS output bus streams cleanly into FPGA-based beamformer pipelines without level translation. The exposed-pad QFN-EP helps dissipate the moderate continuous-conversion heat across dense probe-handle PCBs, while digital error correction maintains the linearity needed for accurate echo reconstruction.
מומלץ
Industrial Process Control Data Acquisition
Multi-channel PLC and industrial DAQ cards digitizing sensor signals at moderate rates use the CDK2307BILP64 to capture two channels per IC, reducing component count and PCB area versus discrete single-channel ADCs. The internal reference eliminates drift tuning steps during factory calibration, and the pipelined architecture guarantees consistent sample timing across channels. The CMOS parallel interface simplifies connection to industrial microcontrollers and FPGAs in factory-automation systems.
מומלץ
Radar and IF Signal Processing
Doppler radar and IF-stage digitizers in defense and automotive sensors typically run at 20-80 MSPS with 12-bit resolution, which matches the CDK2307BILP64's dual-channel pipelined architecture exactly. Each channel captures I or Q independently while preserving phase coherence for FFT processing downstream. The exposed-pad QFN-EP keeps junction temperatures controlled under continuous sampling, and the CMOS parallel output supports low-latency handoff to FPGA DSP pipelines.
מומלץ
Multi-Channel Embedded Vision Systems
Embedded vision systems that capture dual analog sensor streams (for example, stereo vision front ends or dual-camera front ends) use the CDK2307BILP64 to digitize both channels simultaneously, preserving temporal alignment for downstream stereo processing. The 12/13-bit resolution captures subtle luminance variations, and the QFN-EP package fits alongside the image sensor connector on compact vision boards. Internal reference trimming minimizes pixel-to-pixel brightness variation across channels.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור CDK2307BILP64 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | CDK2307CILP40 | ADS8401IPFBRG4 | ADS8401IPFBR |
|---|---|---|---|---|
| Brand | MaxLinear (Exar / Cadeka) | MaxLinear | Texas Instruments | Texas Instruments |
| Package | 64-pin QFN-EP (9x9 mm) | 64-pin QFN-EP - same | 48-pin TQFP PowerPAD - different footprint, NOT a true drop-in | 48-pin TQFP PowerPAD - different footprint, NOT a true drop-in |
| Channels | 2 | 2 | 1 | 1 |
| Resolution | 12 / 13-bit | 12 / 13-bit | 16-bit | 16-bit |
| Sample Rate | 40 MSPS | 40 MSPS | 1 MSPS | 1 MSPS |
| Architecture | Pipelined with digital error correction | Pipelined | SAR | SAR |
| Output Interface | CMOS Parallel | CMOS Parallel | Parallel | Parallel |
| Pin Count | 64 | 64 | 48 | 48 |
מבדילים עיקריים
- Dual-channel integration in a single QFN-EP (לעומתADS8401IPFBRG4)
- Pipelined architecture for sustained 40 MSPS throughput (לעומתADS8401IPFBRG4)
- Same-family drop-in compatibility (לעומתCDK2307CILP40)
הערות תכנון
The 64-pin QFN-EP exposed pad must be soldered to a continuous ground copper pour with multiple thermal vias to a ground plane on the inner PCB layer. This provides both a low-impedance analog/digital ground reference and a low theta-JB thermal path. Without the exposed-pad solder connection, the part can overheat at continuous 40 MSPS dual-channel operation. Keep analog and digital ground returns separated until they join at the exposed pad to minimize digital switching noise coupling into the analog inputs.
Route the CMOS parallel digital outputs with matched-length traces to the FPGA or ASIC to minimize clock-to-data skew. Place a small series resistor (22-33 ohm) at each CMOS output to dampen transmission-line reflections when driving traces longer than about 25 mm. Keep digital output traces away from the analog input traces and the reference decoupling node; the parallel CMOS bus is a strong source of digital switching noise.
Estimated: based on a typical dual 40 MSPS pipelined ADC current of ~50 mA on AVDD and ~30 mA on DVDD, total supply power is approximately 240 mW with 3.3 V supplies. Provide local 0.1 uF ceramic decoupling capacitors placed within 3 mm of each AVDD and DVDD pin, plus a 10 uF bulk capacitor near the device. Use ferrite beads between analog and digital 3.3 V rails to prevent digital supply noise from corrupting the analog supply rail.
מידע על תאימות
RoHS / REACH / lead-free status not explicitly stated in the provided web data; set to 'unknown' rather than assume. Not AEC-Q100 qualified - this is a commercial/industrial-grade ADC; for automotive designs consult MaxLinear's automotive-grade ADC portfolio.
