EP20K300EFI672-2X - APEX 20KE 300K Gates FPGA | Intel / Altera
MPN: EP20K300EFI672-2X ✗ סוף ייצורEP20K300EFI672-2X סקירה
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement arbitrary digital logic, memory, and I/O functions through software configuration. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and structured ASICs, and are widely used for parallel processing, glue logic, high-speed interfacing, and hardware prototyping. The APEX 20KE family was Altera's first multi-core architecture combining Look-Up Table (LUT) logic, Embedded System Blocks (ESBs) for memory, and a high-bandwidth interconnect.
Key features of the APEX 20KE series include MultiCore™ architecture combining fine-grained logic elements with embedded memory, up to 147 kbit of on-chip SRAM distributed across ESBs, 408 user I/Os supporting multiple I/O standards, and in-system programmability via IEEE 1149.1 JTAG. The 672-ball FineLine BGA package provides ample signal breakout for high-pin-count designs while maintaining a manageable 1.0 mm or 1.27 mm ball pitch depending on variant.
Typical applications for the EP20K300EFI672-2X include telecommunications infrastructure (line cards, ATM switches, SONET/SDH framers), high-speed data acquisition systems, custom DSP coprocessors, glue logic for ASIC/ASSP replacement, and industrial control systems. Its industrial temperature range and 300K-gate capacity make it suitable for embedded computing where off-the-shelf processors cannot meet throughput requirements.
When designing with this device, note that the APEX 20KE family is now classified as mature/legacy by Altera/Intel; designers should confirm last-time-buy and support status before committing to new designs. Quartus II development software is required, and pin-compatible migration to Cyclone or Stratix devices typically requires board redesign. This page synthesizes distributor pricing, drop-in alternatives within the APEX 20KE family, and design guidance not found in the manufacturer datasheet.
חלופות תחליף ישיר עבור EP20K300EFI672-2X — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP20K300EFI672-2X (אותו גורם צורה וטביעת רגל) — שונים ב Operating Temperature, Package, Family, Process Technology, Speed Grade.
EP20K300EFI672-2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K300EFC672-2X
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K300EFC672-2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K300EFC672-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K300EFC672-1
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K300EFI672-2X דירוגים מרביים ומאפיינים חשמליים
| Family | APEX 20KE |
| System Gates | 300,000 |
| Logic Elements (Cells) | 11,520 |
| Embedded Memory | 147,456 bits |
| User I/Os | 408 |
| Maximum Internal Frequency | 350 MHz |
| Propagation Delay | 1.68 ns |
| Core Supply Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| מארז | 672-ball FineLine BGA (FBGA) |
| Package Pin Count | 672 |
| טמפרטורת פעולה | -40 °C to +85 °C (industrial) |
| סוג הרכבה | Surface Mount |
| Speed Grade | -2X (enhanced) |
מדריך תצורת פינים של EP20K300EFI672-2X 672
תצורת פינים עבור EP20K300EFI672-2X (מארזת 672). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP20K300EFI672-2X.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP20K300EFI672-2X מתאים עבור 6 יישוםs: Telecommunications Line Cards, High-Speed Data Acquisition, ASIC/ASSP Prototyping, Custom DSP Coprocessor, Industrial Motor Control, Legacy Industrial Controller Sustaining.
Telecommunications Line Cards
The EP20K300EFI672-2X fits telecommunications line cards because its 300,000 system gates and 408 user I/Os provide ample logic and pin resources for UTOPIA / POS-PHY interfaces, ATM segmentation-and-reassembly engines, and HDLC controllers. The -2X speed grade and 350 MHz internal performance support 155 Mbps to 622 Mbps SONET/SDH framers without external co-processors. Industrial temperature rating enables deployment in outdoor cabinets and central-office equipment. Embedded System Blocks (ESBs) deliver 147 kbit of on-chip memory for cell buffering, reducing external SRAM requirements and BOM cost in dense line-card designs.
מומלץ
High-Speed Data Acquisition
The EP20K300EFI672-2X is well-suited to multi-channel data acquisition front-ends where 11,520 logic elements implement parallel DSP filter chains, FIFO buffers, and trigger logic. With 408 I/Os the device can interface directly to multiple 14-16 bit ADCs operating at 100+ MSPS using LVDS or parallel CMOS protocols. The 147 kbit embedded memory pools as distributed dual-port RAM for cross-channel correlation. Industrial -40 to +85 C temperature rating allows deployment in factory-floor test instruments and military/aerospace data recorders where commercial FPGAs cannot operate reliably.
מומלץ
ASIC/ASSP Prototyping
Engineers use the EP20K300EFI672-2X as a pre-silicon prototyping vehicle for ASIC and ASSP designs in the 250K-350K gate range. The 11,520 logic elements and 147 kbit embedded memory map cleanly to typical ASIC architectures, while 408 I/Os emulate wide on-chip bus structures. Quartus II synthesis with the APEX 20KE library lets design teams validate RTL before tape-out, dramatically reducing respin risk. Industrial temperature support enables automotive and industrial customers to prototype in the same thermal envelope as their final silicon.
מומלץ
Custom DSP Coprocessor
The EP20K300EFI672-2X serves as a glue-logic DSP coprocessor for fixed-point FFT, FIR, and correlator kernels in radar, sonar, and software-defined radio. Its 350 MHz internal performance sustains 32-bit parallel multiply-accumulate at rates sufficient for 50 MHz baseband processing. The 147 kbit embedded memory provides coefficient storage and overlap-save buffers, eliminating external memory accesses on critical inner loops. Combined with 408 I/Os, the device can bus-attach to external DSPs like the TMS320C6xxx or SHARC family as a hardware accelerator.
מומלץ
Industrial Motor Control
The EP20K300EFI672-2X is appropriate for high-end industrial motor drives where the FPGA implements field-oriented control (FOC) state machines, SVPWM generators, and encoder interfaces. Its 408 I/Os accept multi-axis encoder feedback (incremental, SSI, EnDat) and drive IGBT gate-driver optocouplers in parallel. The industrial -40 to +85 C temperature rating withstands drive-cabinet environments where ambient temperatures routinely exceed 60 C. The 350 MHz performance enables torque-loop calculation under 1 µs for high-bandwidth servo applications.
מומלץ
Legacy Industrial Controller Sustaining
The EP20K300EFI672-2X continues to serve in long-lifecycle industrial controllers (PLC, SCADA RTU, CNC) where installed bases exceed 15 years and field replacement requires identical form, fit, and function. Its 300K-gate capacity and 408 I/Os match the logic footprint of established control platforms, allowing direct board swap during field repair. Industrial temperature rating and APEX 20KE MultiCore architecture remain compatible with legacy Quartus II design files. Engineers maintaining these systems should procure last-time-buy inventory while authorized supply remains available.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP20K300EFI672-2X — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP20K300EFI672-2N | EP20K300EFC672-2X | EP20K300EFC672-2N | EP20K300EFC672-2 | EP20K300EFC672-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| System Gates | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 |
| Logic Elements | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 | 11,520 |
| Embedded Memory | 147,456 bits | 147,456 bits | 147,456 bits | 147,456 bits | 147,456 bits | 147,456 bits |
| User I/Os | 408 | 408 | 408 | 408 | 408 | 408 |
| Operating Temperature | -40 to +85 C (industrial) | -40 to +85 C (industrial) | 0 to +85 C (commercial) | 0 to +85 C (commercial) | 0 to +85 C (commercial) | 0 to +85 C (commercial) |
| Speed Grade | -2X (enhanced) | -2X (enhanced) | -2X (enhanced) | -2X (enhanced) | -2 (standard) | -1 (slowest) |
מבדילים עיקריים
- Industrial temperature range (-40 to +85 C) with identical die to commercial variant (לעומתEP20K300EFC672-2X)
- Enhanced -2X speed grade (highest in APEX 20KE family) (לעומתEP20K300EFC672-2)
- SnPb (tin-lead) ball finish available for legacy assembly processes (לעומתEP20K300EFI672-2N)
הערות תכנון
Estimated: the 672-ball FineLine BGA package dissipates up to approximately 4-5 W at full utilization (estimated based on APEX 20KE family typical power of 50 µA/MHz quiescent plus switching). With the 27x27 mm package body and no exposed metal top, design adequate forced-air cooling or attach a small heatsink via thermal epoxy to the package top for continuous full-gate utilization. Always verify against the APEX 20KE datasheet thermal resistance table and derate per application note AN 74.
The 672-ball FineLine BGA uses a 1.27 mm ball pitch with a 27x27 array minus depopulated center rows. PCB design requires 4-6 layer stackup with microvia or via-in-pad technology for clean signal breakout. All signal layers beneath the BGA must be reference planes (VCC or GND) for proper impedance control and power delivery; non-functional inner pads are required per IPC-7351 for BGA ball retention. Recommend ENIG or ENEPIG surface finish and 0.20-0.25 mm NSMD pads for reliable assembly.
Estimated: configure-mode pinstrapping (MSEL0-3) must match the desired configuration scheme (PS, AS, JTAG) at power-up; incorrect strapping prevents configuration. The EPC2 or EPC16 configuration device must be sized appropriately for the 300K-gate bitstream (typically 4-6 Mbit). Decouple each VCCINT (1.8 V) and VCCIO bank with 0.1 µF ceramic capacitors placed as close as possible to the package - estimate at least 8-12 capacitors per supply rail based on APEX 20KE decoupling guidelines.
The APEX 20KE supports LVTTL, LVCMOS, PCI, SSTL, and LVDS I/O standards depending on bank configuration. For high-speed LVDS interfaces above 200 Mbps, route differential pairs with 100 Ω differential impedance and maintain length matching within 0.13 mm. Reference per-bank VCCIO pins must each be decoupled individually; mixing I/O standards within a bank without proper VCCIO selection is a common source of configuration failure and signal-integrity issues per the APEX 20KE handbook.
מידע על תאימות
EP20K300EFI672-2X uses SnPb (tin-lead) ball finish per the -2X (non-N) ordering code, indicating non-RoHS terminal finish. For RoHS-compliant designs choose the EP20K300EFI672-2N (lead-free) variant. Compliance status not explicitly stated in verified distributor data.