EP20K600CF672C8N - 600K-Gate FPGA, 508 I/O | Intel | APEX 20K
MPN: EP20K600CF672C8N ✓ פעילEP20K600CF672C8N סקירה
An FPGA, or field-programmable gate array, is an integrated circuit whose logic and interconnect resources are configured after manufacturing. FPGA technology sits within the broader programmable-logic hierarchy, alongside complex programmable logic devices, simple programmable logic devices, and fixed-function application-specific integrated circuits. The APEX 20K architecture combines programmable logic, embedded system capability, and configurable I/O, allowing engineers to implement parallel processing, interface adaptation, and digital control without fabricating a custom silicon device.
Key specifications include 24,320 logic cells, 2,432 macros, 508 I/O, 672 package terminals, and 600K nominal gate capacity. The 1.8 V core supply supports lower-voltage integration, while 508 user I/O provide extensive connectivity for memory buses, processors, peripheral interfaces, and custom backplanes. The 45 x 45 mm FC-FBGA package supports a large pin count but demands controlled assembly, power integrity, signal-integrity, and thermal design.
The device is manufactured using a 0.15 µm all-layer copper-metal fabrication process and belongs to the APEX 20KC family. Its 301.21 MHz listed frequency supports clocked digital designs, but achievable system frequency depends on routing, logic utilization, I/O timing, configuration, power distribution, and PCB implementation. A 672-ball interface also makes signal escape and simultaneous switching noise important board-level constraints.
Typical applications include communications infrastructure, industrial automation, test and measurement, image or video processing, and legacy computing-platform replacement. The density and 508-I/O count are useful where multiple interface blocks, datapaths, and control functions must coexist. Engineers may also use the FPGA as a protocol bridge, hardware accelerator, or reconfigurable controller. For long-life systems, sourcing risk and configuration compatibility should be evaluated before production release.
Power planning must account for the 1.8 V supply, clocking rate, I/O activity, logic occupancy, and the thermal path through the FC-FBGA package. Use the manufacturer design guidelines for power estimation, decoupling, ball escape, and signal integrity. Engineering samples should complete timing, configuration, thermal, and board-level validation before substitution or redesign.
This page consolidates the verified package, density, supply, I/O, temperature, and alternative data, and clearly separates exact-source facts from parameters that still require datasheet or platform-level confirmation.
חלופות תחליף ישיר עבור EP20K600CF672C8N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP20K600CF672C8N (אותו גורם צורה וטביעת רגל) — שונים ב Operating Temperature, Process Technology, Package, RoHS Status, Speed Grade.
EP20K600CF672C8
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K600CF672C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K600CF672C7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K600CF672C6
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K600CF672-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K600CF672C8N דירוגים מרביים ומאפיינים חשמליים
| Device Type | SPLD |
| Product Type | FPGA / programmable logic device |
| Family | APEX 20KC |
| Nominal Gate Capacity | 600K gates |
| Logic Elements or Cells | 24,320 |
| Macros | 2,432 |
| User I/O Count | 508 |
| Package Terminals | 652 pins |
| מארז | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | 672-pin FC-FBGA |
| מתח אספקה | 1.8 V |
| Listed Frequency | 301.21 MHz |
| Propagation Delay | 1.48 ns |
| Fabrication Process | 0.15 µm |
| טמפרטורת פעולה | 0°C to 85°C |
| Interconnect Metal | All-layer copper metal |
| I/O Configuration | 508 user I/O |
| סוג הרכבה | Surface mount |
| סטטוס RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
מדריך תצורת פינים של EP20K600CF672C8N 672-pin fc-fbga
תצורת פינים עבור EP20K600CF672C8N (מארזת 672-pin fc-fbga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP20K600CF672C8N.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP20K600CF672C8N מתאים עבור 6 יישוםs: Industrial Automation Controllers, Communications Infrastructure, Test and Measurement Equipment, Video and Image Processing, Legacy Computing Platform Replacement, High-Speed Data Acquisition.
Industrial Automation Controllers
The EP20K600CF672C8N is a strong candidate for industrial automation controllers that need substantial programmable logic and broad external connectivity. Its 24,320 logic cells, 2,432 macros, and 508 user I/O can support motor-control sequencing, sensor aggregation, deterministic logic, and multiple industrial communication interfaces on one device. The 1.8 V supply supports integration with low-voltage digital systems, while the 0.15 µm process reflects the APEX 20KC generation. The 0°C to 85°C listed operating range is appropriate for many controlled commercial and industrial environments, but enclosure temperature and duty cycle must be evaluated. Use local clock generation, output timing constraints, and interface-specific I/O planning; actual performance depends on the configured design, routing, and board power integrity rather than the headline 301.21 MHz value alone.
מומלץ
Communications Infrastructure
The EP20K600CF672C8N can serve in communications infrastructure where parallel datapaths, protocol adaptation, and high I/O fan-out are required. The 508 user I/O and 24,320 logic cells allow a design to combine framing, buffering, traffic management, and control functions without a custom ASIC. Its 672-pin FC-FBGA package provides the terminal count needed for multiple buses, but also creates board-level signal-escape and simultaneous-switching concerns. Engineers should control clock and data skew, provide controlled impedance, and validate I/O-bank limits using the manufacturer datasheet. The listed 301.21 MHz frequency is useful for orientation, not a guarantee of a particular interface rate. System throughput depends on place-and-route results, memory topology, I/O standards, and timing constraints.
מומלץ
Test and Measurement Equipment
For test and measurement equipment, the EP20K600CF672C8N offers enough programmable resources to implement acquisition sequencing, signal conditioning control, timing generation, data formatting, and instrument interfaces. The 2,432 macros and 508 I/O are valuable when the design must connect to multiple converters, sensors, control ports, and communication links. The 1.8 V supply should be planned alongside all interface power domains, with careful bank-by-bank voltage verification. The 0°C to 85°C range supports many laboratory and factory environments, while thermal testing remains important in high-utilization designs. Use synchronized clocks, bounded routing delays, and deterministic I/O timing in the device constraints. Confirm exact configuration, JTAG, and clock-pin requirements from the official package documentation before layout.
מומלץ
Video and Image Processing
The EP20K600CF672C8N can support video and image-processing functions that require parallel pixel handling, line buffering, synchronization, and control. Its 24,320 logic cells and 2,432 macros provide a large programmable fabric for datapaths, while 508 user I/O help connect image sensors, frame buffers, display controllers, and host processors. The 301.21 MHz listed frequency provides a design reference, but pixel throughput will depend on internal resources, memory architecture, clock domains, and PCB timing. The 45 x 45 mm 672-pin FC-FBGA package requires careful fan-out and power distribution. Plan separate clock domains, constrain high-speed interfaces, and verify whether the selected I/O standards meet the voltage and edge-rate requirements of the application.
מומלץ
Legacy Computing Platform Replacement
The EP20K600CF672C8N is relevant to legacy computing-platform replacement when a system needs to preserve parallel buses, custom protocols, or specialized timing behavior. Its 600K-gate class and 24,320 logic cells can support glue logic, bus adaptation, interrupt aggregation, and peripheral emulation. The 508 I/O count is especially important for connecting older processors, memory devices, and control peripherals. Because the device is an FPGA, a replacement program should treat configuration generation, pin assignment, and timing closure as part of the product definition. The available ordering-code candidates are not confirmed drop-ins, so existing PCB and firmware must be mapped to the selected device. Check configuration compatibility, supported I/O standards, clock constraints, and thermal performance before approving a production conversion.
מומלץ
High-Speed Data Acquisition
The EP20K600CF672C8N can be used in high-speed data-acquisition systems that combine parallel capture, buffering, format conversion, and host transfer. Its 24,320 logic cells and 508 I/O provide flexibility for multiple converters and control interfaces, while the 2,432 macros support complex control and datapath implementation. The listed 301.21 MHz frequency helps establish the device class, but actual acquisition performance depends on clock quality, I/O timing, internal utilization, and external memory. The 1.8 V supply requires low-noise power conversion and proper decoupling across the 672-pin package. Validate input thresholds, output drive, clock distribution, and thermal limits from the manufacturer datasheet, then simulate and measure timing with the production configuration.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP20K600CF672C8N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP20K600CF672C8 | EP20K600CF672C7N | EP20K600CF672C7 | EP20K600CF672C6 | EP20K600CF672-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA |
מבדילים עיקריים
- High logic density for interface-heavy designs (לעומתEP20K600CB652C9)
- Large BGA package for high terminal count (לעומתEP20K600CB652C9)
- Commercial-temperature operation (לעומתEP20K600CF672C7N)
הערות תכנון
Begin power planning from the verified 1.8 V supply and the system utilization target. Core current, I/O current, startup surge, and allowed rail tolerance are not provided, so obtain those values from the manufacturer datasheet. Estimate total current by separating core, clock, and I/O loads, then size the regulator for transient margin. Place bulk capacitance near the power entry and distribute local ceramic decoupling across the 672-pin FC-FBGA. Verify power-up sequencing and configuration behavior before connecting sensitive peripherals.
The 45 x 45 mm, 1.27 mm-pitch FC-FBGA requires an escape strategy based on the official ball map, not the abbreviated package descriptions alone. Route clock, configuration, and high-speed differential or source-synchronous groups first, and maintain continuous reference planes where the stack-up allows. Confirm whether balls are power, ground, I/O, clock, configuration, or no-connect before symbol creation. Use controlled impedance, minimize via transitions, and check simultaneous-switching noise on heavily loaded outputs.
Treat 301.21 MHz as a device-class frequency listing rather than a guaranteed system-clock rate. Constrain the generated FPGA design with actual clock, I/O, and external-device timing requirements. Measure clock jitter, skew, duty-cycle distortion, and output edge rates on prototypes. For wide buses, use suitable termination and return-path continuity, and keep clock distribution away from noisy I/O regions. Validate timing with the production configuration and selected speed grade.
The supplied data does not provide junction-to-ambient thermal resistance or current values, so thermal analysis cannot be completed from the available numbers. Use estimated power after synthesis, including clock toggling, memory or I/O activity, and output load, and compare the result with the package thermal data. Provide a solid ground and power-plane thermal path under the BGA, use appropriate copper spreading, and test the highest-utilization configuration at worst-case ambient temperature. The 0°C to 85°C range is an operating limit, not a substitute for thermal design.
מידע על תאימות
The verified web data does not provide compliance statements. No RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status is assumed.
