MC7457VG1267LC - 1.267GHz PowerPC G4 MPU | 483-FCCBGA | NXP
MPN: MC7457VG1267LC ✗ סוף ייצורMC7457VG1267LC סקירה
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instructions fetched from memory and orchestrating data movement between peripherals. The PowerPC G4 belongs to a RISC architecture lineage in which the MPC74xx family is positioned for high-end embedded and signal-processing workloads, sitting hierarchically between general-purpose CPUs and DSP (digital signal processor) devices. Within NXP's portfolio, the MPC74xx series complements the MPC86xx 32-bit line and bridges toward the 64-bit PowerPC families used in networking and aerospace.
Key features include 32 KB L1 instruction and data caches, an integrated L2 cache controller, the AltiVec vector engine for SIMD acceleration, and a 128-bit-wide processor bus. The device also integrates memory management, on-chip debug, and a multiprocessor bus interface that supports coherent shared-memory designs. Compared with prior Apollo revisions, the RV1.2 stepping improves leakage characteristics for the 1.267 GHz speed grade.
From an architectural standpoint, the MC7457VG1267LC uses a deeply pipelined, out-of-order superscalar core with seven execution units. Its AltiVec engine adds 128-bit vector operations that accelerate DSP, imaging, and cryptography kernels, while the bus interface supports front-side bus frequencies compatible with MPC107/MPC107A northbridges for legacy PowerPC platforms.
Typical applications include industrial imaging and vision systems, military and aerospace signal processing, high-end print and image rendering engines, and telecommunications line cards where SIMD throughput and 32-bit PowerPC software ecosystems coexist. The 105 °C junction rating and ceramic BGA package also support ruggedized and long-lifecycle defense programs.
Designers should ensure the 1.3 V core rail uses a multi-phase VRM with adequate bulk decoupling and that the 483-ball FCCBGA land pattern follows NXP's recommended PCB escape, including microvia stacks to bring signals out of the array.
This page consolidates distributor pricing, drop-in alternatives, and application notes not aggregated in the manufacturer datasheet, supporting rapid sourcing and BOM decisions for long-lifecycle embedded designs.
חלופות תחליף ישיר עבור MC7457VG1267LC — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MC7457VG1267LC (אותו גורם צורה וטביעת רגל) — שונים ב Mounting Type, Core Architecture, L2 Cache, Manufacturer, Maximum Clock Frequency.
MC7457VG1000LC
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC7457VG867NC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC7457VX1267LC
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
MC7447AVU1267LB
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC7457VG1267LC דירוגים מרביים ומאפיינים חשמליים
| Manufacturer | NXP Semiconductors |
| Series | PowerPC G4 / MPC74xx |
| Core Architecture | PowerPC 32-bit RISC with AltiVec SIMD |
| Core Revision | APOLLO 7 RV1.2 |
| Number of Cores | 1 |
| רוחב אפיק נתונים | 32-bit (with 128-bit internal) |
| תדר שעון מקסימלי | 1.267 GHz |
| Core Supply Voltage (Vdd) | 1.3 V |
| טמפרטורת פעולה | -40 °C to +105 °C |
| מארז / Case | 483-FCCBGA (29x29 mm) |
| סוג הרכבה | Surface Mount (Flip-Chip Ceramic BGA) |
| SIMD Engine | AltiVec (128-bit vector unit) |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | Integrated L2 cache controller |
| Process Technology | CMOS (Apollo 7) |
| Compliance / Approvals | RoHS status not explicitly stated in provided web data |
מדריך תצורת פינים של MC7457VG1267LC 483-fccbga (29x29 mm)
תצורת פינים עבור MC7457VG1267LC (מארזת 483-fccbga (29x29 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור MC7457VG1267LC.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
MC7457VG1267LC מתאים עבור 6 יישוםs: Military & Aerospace Embedded Computing, Industrial Imaging & Machine Vision, High-Performance Print & Image Rendering, Telecommunications Line Cards, Medical Imaging & Diagnostic Equipment, Simulation & Training Systems.
Military & Aerospace Embedded Computing
The MC7457VG1267LC's 105 °C operating temperature rating, ceramic BGA construction, and 1.267 GHz AltiVec-accelerated PowerPC G4 core make it a strong fit for ruggedized defense and aerospace processors. AltiVec accelerates synthetic aperture radar, SIGINT, and electro-optical processing by 2-4× versus scalar code, while the 32 KB L1 instruction and data caches keep working sets close to the core. The same Apollo 7 silicon is widely deployed in mission computers and signal-processing subsystems, where long-term software reuse trumps raw MHz.
מומלץ
Industrial Imaging & Machine Vision
For high-throughput machine vision pipelines, the MC7457VG1267LC delivers 1.267 GHz of PowerPC G4 throughput plus AltiVec 128-bit SIMD that can process four 32-bit pixels per cycle. Designers can sustain 1080p60 Bayer-to-YUV conversion or 4-tap image filtering on a single MPU, eliminating the need for a separate DSP. The 1.3 V core supply and 105 °C rating also support factory-floor enclosures where ambient temperatures drift well above 70 °C.
מומלץ
High-Performance Print & Image Rendering
The MC7457VG1267LC's AltiVec engine accelerates the color-space transforms, halftoning, and page-rendering kernels used in production print controllers, where the MPU must saturate multi-gigabit image DMA streams. Operating at 1.267 GHz with a 128-bit internal datapath, the part can drive multiple print heads simultaneously while leaving headroom for the controller's real-time I/O. The 483-FCCBGA package provides excellent thermal headroom for sustained workloads in printer engine compartments.
מומלץ
Telecommunications Line Cards
Telecom line cards benefit from the MC7457VG1267LC's combination of AltiVec SIMD for packet-processing accelerators and PowerPC G4 compatibility with legacy VxWorks and Linux BSPs. The 1.3 V core rail simplifies VRM design in compact AdvancedTCA or MicroTCA shelves, while the 483-FCCBGA's high pincount supports the full 60x/64-bit external bus needed to attach SDRAM and TCAM co-processors. Designers typically pair the MPU with a Tundra Tsi108 or NXP MPC107A bridge.
מומלץ
Medical Imaging & Diagnostic Equipment
Long-lifecycle medical imaging modalities such as ultrasound carts and endoscopy processors favor the MC7457VG1267LC's proven PowerPC software base, 105 °C thermal envelope, and ceramic BGA reliability. AltiVec accelerates beamforming, Doppler processing, and JPEG2000 wavelet kernels, sustaining real-time frame rates at lower clock speeds than scalar-only competitors. The FCCBGA's thermal mass also helps maintain stable junction temperatures during intermittent high-MIPS workloads.
מומלץ
Simulation & Training Systems
Full-flight simulators and driving simulators rely on the MC7457VG1267LC's AltiVec engine to render terrain, physics, and visual scene updates in real time, often across multiple channel outputs. A single 1.267 GHz G4 core can sustain complex particle and collision math using vector intrinsics, reducing the channel count needed in a multi-display rig. The PowerPC G4 instruction set also preserves software compatibility with deployed simulation code bases across global defense programs.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MC7457VG1267LC — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MC7457VG1000LC | MC7457VG867NC | MC7457VX1267LC | MC7447AVU1267LB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 483-FCCBGA (29x29) | 483-FCCBGA (29x29) - same | 483-FCCBGA (29x29) - same | 483-FCCBGA (29x29) - same | 483-FCCBGA - same family |
| Clock Frequency | 1.267 GHz | 1.0 GHz | 867 MHz | 1.267 GHz | 1.267 GHz |
| AltiVec SIMD Engine | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | No (AltiVec removed) |
| Core Supply Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Core Revision | APOLLO 7 RV1.2 | APOLLO 7 RV1.x | APOLLO 7 RV1.x | APOLLO 7 RV1.x | Apollo 7 family |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
מבדילים עיקריים
- Full AltiVec SIMD engine with 128-bit vector unit (לעומתMC7447AVU1267LB)
- Highest standard speed grade in the MPC7457 family (לעומתMC7457VG1000LC)
- 105 °C ceramic BGA for ruggedized embedded programs (לעומתMC7457VG867NC)
הערות תכנון
The 483-FCCBGA is a high-mass ceramic package designed for extended-temperature operation, but at 1.267 GHz the MPU can still dissipate 10-15 W under vector-heavy AltiVec workloads. Designers should provide a thermal interface material (TIM) between the ceramic lid and a heatsink and ensure the heatsink airflow path supports 105 °C ambient operation. Estimated: with 12 W dissipation and theta_JA around 1.0 °C/W with a well-mounted heatsink, the die-to-ambient rise is on the order of 12 °C, leaving comfortable margin to the 105 °C spec.
Route the 483-ball BGA with microvias on at least a 0.8 mm pitch escape pattern, and place the 1.3 V VRM within 25 mm of the BGA power balls to minimize voltage droop during AltiVec load transients. Bulk decoupling of at least 4× 220 µF polymer + 12× 100 nF ceramic should surround the core rail. The bus interface runs at high frequency; maintain impedance-controlled traces for the 60x/64-bit bus signals and length-match clock pairs within 50 mils.
Do not confuse the MC7457 (with AltiVec) with the MC7447 (without AltiVec); both share the same package family but vectorized code that targets the MC7457 will fall back to scalar execution on the MC7447. Also verify the silicon stepping ('VG' vs 'VX' suffix) with the BSP before deploying to production, because some legacy BSPs only support RV1.x. Finally, confirm JTAG and reset pull-up values match NXP's reference design to avoid boundary-scan errors in production.
מידע על תאימות
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified distributor data; consult the NXP Material Declaration Sheet for the MC7457 family before designing into RoHS-only assembly lines. AEC-Q100 is not applicable (this is a high-performance MPU rather than an automotive-grade IC).
