MC7457VG1267LC - 1.267GHz PowerPC G4 MPU | 483-FCCBGA | NXP
부품 번호: MC7457VG1267LC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $195 | $195.00 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162 | $16,200.00 |
| 250 | $153.75 | $38,437.50 |
| 500 | $146.25 | $73,125.00 |
MC7457VG1267LC 개요
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instructions fetched from memory and orchestrating data movement between peripherals. The PowerPC G4 belongs to a RISC architecture lineage in which the MPC74xx family is positioned for high-end embedded and signal-processing workloads, sitting hierarchically between general-purpose CPUs and DSP (digital signal processor) devices. Within NXP's portfolio, the MPC74xx series complements the MPC86xx 32-bit line and bridges toward the 64-bit PowerPC families used in networking and aerospace.
Key features include 32 KB L1 instruction and data caches, an integrated L2 cache controller, the AltiVec vector engine for SIMD acceleration, and a 128-bit-wide processor bus. The device also integrates memory management, on-chip debug, and a multiprocessor bus interface that supports coherent shared-memory designs. Compared with prior Apollo revisions, the RV1.2 stepping improves leakage characteristics for the 1.267 GHz speed grade.
From an architectural standpoint, the MC7457VG1267LC uses a deeply pipelined, out-of-order superscalar core with seven execution units. Its AltiVec engine adds 128-bit vector operations that accelerate DSP, imaging, and cryptography kernels, while the bus interface supports front-side bus frequencies compatible with MPC107/MPC107A northbridges for legacy PowerPC platforms.
Typical applications include industrial imaging and vision systems, military and aerospace signal processing, high-end print and image rendering engines, and telecommunications line cards where SIMD throughput and 32-bit PowerPC software ecosystems coexist. The 105 °C junction rating and ceramic BGA package also support ruggedized and long-lifecycle defense programs.
Designers should ensure the 1.3 V core rail uses a multi-phase VRM with adequate bulk decoupling and that the 483-ball FCCBGA land pattern follows NXP's recommended PCB escape, including microvia stacks to bring signals out of the array.
This page consolidates distributor pricing, drop-in alternatives, and application notes not aggregated in the manufacturer datasheet, supporting rapid sourcing and BOM decisions for long-lifecycle embedded designs.
드롭인 대체품: MC7457VG1267LC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC7457VG1267LC (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture, L2 Cache, Manufacturer, Maximum Clock Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC7457VG1000LC
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →MC7457VG867NC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC7457VX1267LC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC7447AVU1267LB
✅ 드롭인✓ 재고 있음
$68.5 / 개
데이터시트 보기 →MC7457VG1267LC 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | PowerPC G4 / MPC74xx |
| Core Architecture | PowerPC 32-bit RISC with AltiVec SIMD |
| Core Revision | APOLLO 7 RV1.2 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit (with 128-bit internal) |
| 최대 클록 주파수 | 1.267 GHz |
| Core Supply Voltage (Vdd) | 1.3 V |
| 동작 온도 | -40 °C to +105 °C |
| 패키지 / 케이스 | 483-FCCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (Flip-Chip Ceramic BGA) |
| SIMD Engine | AltiVec (128-bit vector unit) |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | Integrated L2 cache controller |
| Process Technology | CMOS (Apollo 7) |
| Compliance / Approvals | RoHS status not explicitly stated in provided web data |
MC7457VG1267LC 483-fccbga (29x29 mm) 핀 구성 가이드
MC7457VG1267LC(483-fccbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC7457VG1267LC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC7457VG1267LC 적합 용도: 6 애플리케이션s: Military & Aerospace Embedded Computing, Industrial Imaging & Machine Vision, High-Performance Print & Image Rendering, Telecommunications Line Cards, Medical Imaging & Diagnostic Equipment, Simulation & Training Systems.
Military & Aerospace Embedded Computing
The MC7457VG1267LC's 105 °C operating temperature rating, ceramic BGA construction, and 1.267 GHz AltiVec-accelerated PowerPC G4 core make it a strong fit for ruggedized defense and aerospace processors. AltiVec accelerates synthetic aperture radar, SIGINT, and electro-optical processing by 2-4× versus scalar code, while the 32 KB L1 instruction and data caches keep working sets close to the core. The same Apollo 7 silicon is widely deployed in mission computers and signal-processing subsystems, where long-term software reuse trumps raw MHz.
추천
Industrial Imaging & Machine Vision
For high-throughput machine vision pipelines, the MC7457VG1267LC delivers 1.267 GHz of PowerPC G4 throughput plus AltiVec 128-bit SIMD that can process four 32-bit pixels per cycle. Designers can sustain 1080p60 Bayer-to-YUV conversion or 4-tap image filtering on a single MPU, eliminating the need for a separate DSP. The 1.3 V core supply and 105 °C rating also support factory-floor enclosures where ambient temperatures drift well above 70 °C.
추천
High-Performance Print & Image Rendering
The MC7457VG1267LC's AltiVec engine accelerates the color-space transforms, halftoning, and page-rendering kernels used in production print controllers, where the MPU must saturate multi-gigabit image DMA streams. Operating at 1.267 GHz with a 128-bit internal datapath, the part can drive multiple print heads simultaneously while leaving headroom for the controller's real-time I/O. The 483-FCCBGA package provides excellent thermal headroom for sustained workloads in printer engine compartments.
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Telecommunications Line Cards
Telecom line cards benefit from the MC7457VG1267LC's combination of AltiVec SIMD for packet-processing accelerators and PowerPC G4 compatibility with legacy VxWorks and Linux BSPs. The 1.3 V core rail simplifies VRM design in compact AdvancedTCA or MicroTCA shelves, while the 483-FCCBGA's high pincount supports the full 60x/64-bit external bus needed to attach SDRAM and TCAM co-processors. Designers typically pair the MPU with a Tundra Tsi108 or NXP MPC107A bridge.
추천
Medical Imaging & Diagnostic Equipment
Long-lifecycle medical imaging modalities such as ultrasound carts and endoscopy processors favor the MC7457VG1267LC's proven PowerPC software base, 105 °C thermal envelope, and ceramic BGA reliability. AltiVec accelerates beamforming, Doppler processing, and JPEG2000 wavelet kernels, sustaining real-time frame rates at lower clock speeds than scalar-only competitors. The FCCBGA's thermal mass also helps maintain stable junction temperatures during intermittent high-MIPS workloads.
추천
Simulation & Training Systems
Full-flight simulators and driving simulators rely on the MC7457VG1267LC's AltiVec engine to render terrain, physics, and visual scene updates in real time, often across multiple channel outputs. A single 1.267 GHz G4 core can sustain complex particle and collision math using vector intrinsics, reducing the channel count needed in a multi-display rig. The PowerPC G4 instruction set also preserves software compatibility with deployed simulation code bases across global defense programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC7457VG1267LC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC7457VG1000LC | MC7457VG867NC | MC7457VX1267LC | MC7447AVU1267LB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 483-FCCBGA (29x29) | 483-FCCBGA (29x29) - same | 483-FCCBGA (29x29) - same | 483-FCCBGA (29x29) - same | 483-FCCBGA - same family |
| Clock Frequency | 1.267 GHz | 1.0 GHz | 867 MHz | 1.267 GHz | 1.267 GHz |
| AltiVec SIMD Engine | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | No (AltiVec removed) |
| Core Supply Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Core Revision | APOLLO 7 RV1.2 | APOLLO 7 RV1.x | APOLLO 7 RV1.x | APOLLO 7 RV1.x | Apollo 7 family |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Full AltiVec SIMD engine with 128-bit vector unit (vs MC7447AVU1267LB)
- Highest standard speed grade in the MPC7457 family (vs MC7457VG1000LC)
- 105 °C ceramic BGA for ruggedized embedded programs (vs MC7457VG867NC)
설계 노트
The 483-FCCBGA is a high-mass ceramic package designed for extended-temperature operation, but at 1.267 GHz the MPU can still dissipate 10-15 W under vector-heavy AltiVec workloads. Designers should provide a thermal interface material (TIM) between the ceramic lid and a heatsink and ensure the heatsink airflow path supports 105 °C ambient operation. Estimated: with 12 W dissipation and theta_JA around 1.0 °C/W with a well-mounted heatsink, the die-to-ambient rise is on the order of 12 °C, leaving comfortable margin to the 105 °C spec.
Route the 483-ball BGA with microvias on at least a 0.8 mm pitch escape pattern, and place the 1.3 V VRM within 25 mm of the BGA power balls to minimize voltage droop during AltiVec load transients. Bulk decoupling of at least 4× 220 µF polymer + 12× 100 nF ceramic should surround the core rail. The bus interface runs at high frequency; maintain impedance-controlled traces for the 60x/64-bit bus signals and length-match clock pairs within 50 mils.
Do not confuse the MC7457 (with AltiVec) with the MC7447 (without AltiVec); both share the same package family but vectorized code that targets the MC7457 will fall back to scalar execution on the MC7447. Also verify the silicon stepping ('VG' vs 'VX' suffix) with the BSP before deploying to production, because some legacy BSPs only support RV1.x. Finally, confirm JTAG and reset pull-up values match NXP's reference design to avoid boundary-scan errors in production.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified distributor data; consult the NXP Material Declaration Sheet for the MC7457 family before designing into RoHS-only assembly lines. AEC-Q100 is not applicable (this is a high-performance MPU rather than an automotive-grade IC).
