MC9S08JS8LCFK - 8KB Flash USB MCU 48MHz | NXP S08JS
MPN: MC9S08JS8LCFK ✓ פעילMC9S08JS8LCFK סקירה
An 8-bit microcontroller (MCU) is a small computing system-on-chip that integrates a CPU, memory (Flash/RAM), and configurable peripherals onto a single silicon die. The HCS08 CISC architecture used in the S08 core family is a low-power, deterministic instruction set that simplifies firmware development for cost-sensitive embedded products. Within the broader taxonomy, the MC9S08JS8LCFK sits as: 8-bit MCU -> microcontroller -> integrated circuit -> semiconductor. By integrating a USB 2.0 transceiver and PHY directly on die, NXP helps engineers reduce BOM cost and PCB area versus two-chip USB designs.
Key features of the MC9S08JS8LCFK include: 8 KB Flash program memory for USB class firmware, integrated USB 2.0 full-speed (12 Mbps) device controller with on-chip transceiver, 24-pin HVQFN 5x5 mm package with thermal pad, industrial temperature grade support, and on-chip debug (BKGD) plus enhanced clock generation. The integrated USB PHY eliminates external pull-up resistors and the off-chip transceiver IC typically required by legacy USB designs.
The HCS08 core executes most instructions in 1-2 bus cycles, and an internal 48 MHz clock drives the USB module to maintain precise 12 Mbps full-speed signaling. The 8KB Flash is in-system programmable via the background debug mode (BDM), supporting field updates. Multiple low-power modes (Stop, Wait, Run) plus an internal low-power oscillator optimize battery-powered USB peripherals.
Typical applications include USB Human Interface Devices (HID) such as keyboards, mice, and game controllers, USB-to-UART bridge dongles, USB class-compliant barcode scanners, industrial USB sensors, low-cost USB peripherals and consumer accessories where a 48 MHz 8-bit core is sufficient and BOM cost dominates.
When designing with this part, ensure the D+ pull-up resistor (1.5 kohm to 3.3V) is correctly placed, the VBUS pin is properly decoupled, and the exposed thermal pad is soldered to the ground plane for thermal and electrical performance. The 24-pin HVQFN requires careful PCB layout - the e-pad must have multiple thermal vias to dissipate heat.
This page synthesizes drop-in alternatives, comparison tables, design notes, and pricing not aggregated elsewhere; engineers can quickly determine whether the MC9S08JS8LCFK fits their USB peripheral design versus the larger JS16, SH8, or QG8 family siblings.
חלופות תחליף ישיר עבור MC9S08JS8LCFK — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MC9S08JS8LCFK (אותו גורם צורה וטביעת רגל) — שונים ב Package, RoHS Status.
MC9S08JS16LCFK
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S08JS16LCWJ
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC9S08JS8LCWJ
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC9S08JM32CLD
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S08DZ60MLH
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC9S08JS8LCFK דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | HCS08 (S08 CISC 8-bit) |
| Bus Frequency (max) | 48 MHz |
| Program Memory (Flash) | 8 KB (8K x 8) |
| מתח אספקה | 3.3 V / 5 V (dual rail) |
| USB Interface | USB 2.0 Full-Speed (12 Mbps) device with integrated transceiver |
| מארז | 24-pin HVQFN (5x5 mm) with exposed pad |
| סוג הרכבה | Surface Mount |
| Temperature Grade | Industrial |
| Terminal Form | No Lead (HVQCCN, JEDEC MO-220) |
| Debug Interface | BDM (Background Debug Mode) |
| סטטוס RoHS | Compliant |
| On-chip USB Pull-up | Integrated on-chip transceiver (D+/D- PHY included) |
תצורת פינים של MC9S08JS8LCFK
| פין 1 | VBUS — USB VBUS (5V from host) sense / power detect input |
| פין 2 | D- — USB D- data line (differential pair with D+) |
| פין 3 | D+ — USB D+ data line; 1.5 kohm pull-up to 3.3V enables full-speed |
| פין 4 | GND — Digital ground |
| פין 5 | PTA0/KBI0 — GPIO / keyboard interrupt 0 |
| פין 6 | PTA1/KBI1 — GPIO / keyboard interrupt 1 |
| פין 7 | PTA2/KBI2 — GPIO / keyboard interrupt 2 |
| פין 8 | PTA3/KBI3 — GPIO / keyboard interrupt 3 |
| פין 9 | PTA4/KBI4 — GPIO / keyboard interrupt 4 |
| פין 10 | PTA5/KBI5 — GPIO / keyboard interrupt 5 |
| פין 11 | PTA6/KBI6 — GPIO / keyboard interrupt 6 |
| פין 12 | PTA7/KBI7 — GPIO / keyboard interrupt 7 |
| פין 13 | PTB0 — GPIO port B bit 0 |
| פין 14 | PTB1 — GPIO port B bit 1 |
| פין 15 | PTB2/TXD — GPIO / SCI TXD alternate function |
| פין 16 | PTB3/RXD — GPIO / SCI RXD alternate function |
| פין 17 | PTB4 — GPIO port B bit 4 |
| פין 18 | PTB5 — GPIO port B bit 5 |
| פין 19 | PTB6 — GPIO port B bit 6 |
| פין 20 | PTB7 — GPIO port B bit 7 |
| פין 21 | VDD — Power supply input (3.3V internal regulator) |
| פין 22 | BKGD/MS — Background Debug Mode / Mode Select |
| פין 23 | VSS — Digital ground (secondary GND pin) |
| פין 24 | RESET — Active-low external reset, internal pull-up |
יישומים טיפוסיים
MC9S08JS8LCFK מתאים עבור 6 יישוםs: USB HID Keyboard/Mouse Controller, USB-to-UART Bridge Dongle, USB Barcode Scanner / POS Accessory, USB Game Controller / Joystick, Industrial USB Sensor / Data Logger, Consumer USB Accessory Dongle.
USB HID Keyboard/Mouse Controller
The MC9S08JS8LCFK is engineered for USB Human Interface Device peripherals, where its integrated USB 2.0 full-speed PHY, 48 MHz HCS08 core, and 8 KB Flash provide a one-chip BOM solution. With on-chip transceiver handling USB signaling without external components, designers save 1-2 ICs and reduce PCB area versus two-chip MCU+PHY designs. The 8 KB Flash is sufficient for HID class descriptors, bootloaders, and key-matrix scanning for keyboards, mice, gamepads, and presenters using only the 24-HVQFN's GPIO budget.
מומלץ
USB-to-UART Bridge Dongle
The MC9S08JS8LCFK's integrated USB 2.0 full-speed transceiver and 48 MHz HCS08 core suit low-cost USB-to-UART bridge dongles that previously required an FTDI bridge IC plus an MCU. Programmed as a USB CDC-ACM device, it emulates a virtual COM port on most hosts without external driver installation (Windows/Linux/macOS). The exposed-pad 24-HVQFN provides excellent thermal dissipation for continuous bus-powered operation, and 8 KB Flash fits CDC-ACM class firmware with room for custom protocol extensions.
מומלץ
USB Barcode Scanner / POS Accessory
USB class-compliant barcode scanners, POS card readers, and retail peripherals benefit from the MC9S08JS8LCFK's integrated USB PHY and 48 MHz core, which deliver full-speed USB 2.0 throughput at sub-$1 BOM for the MCU+PHY section. The S08 core's deterministic interrupt handling keeps scan-trigger latency predictable, which is critical for point-of-sale response time. The 24-HVQFN package profile is small enough for handheld scanner form factors, and industrial temperature grade supports warehouse environments.
מומלץ
USB Game Controller / Joystick
Game controllers and USB joysticks rely on the MC9S08JS8LCFK to consolidate the MCU, USB 2.0 full-speed transceiver, and 48 MHz core into a single 24-HVQFN chip costing less than $1 at volume. The integrated USB PHY eliminates the bill-of-materials pressure typical of two-chip gamepad designs. With 8 KB Flash, designers can implement HID-class descriptors, button debouncing, and force-feedback command processing within a single firmware image, while the 48 MHz core supports poll rates up to the USB FS ceiling.
מומלץ
Industrial USB Sensor / Data Logger
Industrial USB sensors and data loggers with USB connectivity use the MC9S08JS8LCFK where low BOM cost, integrated USB 2.0 full-speed PHY, and industrial temperature grade are prioritized. The 48 MHz HCS08 core handles ADC reads from external sensors, formats the data into a USB vendor-class stream, and maintains a 12 Mbps bulk endpoint without dropping packets. The exposed-pad 24-HVQFN with thermal vias dissipates enough heat for continuous bus-powered operation in DIN-rail or panel-mount enclosures.
מומלץ
Consumer USB Accessory Dongle
Low-cost consumer USB accessories such as custom HID dongles, presentation clickers, and key fobs use the MC9S08JS8LCFK as a single-chip solution integrating MCU and USB 2.0 PHY in a 5x5 mm 24-HVQFN. With 48 MHz S08 core and 8 KB Flash, designers implement HID class firmware and minimal application logic in one firmware image. The exposed thermal pad is soldered to ground pour to keep die temperature in spec during continuous bus-powered operation, and the industrial temperature rating covers most consumer use cases.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MC9S08JS8LCFK — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MC9S08JS16LCFK | MC9S08JS16LCWJ | MC9S08JS8LCWJ | MC9S08JM32CLD | MC9S08DZ60MLH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-HVQFN (5x5 mm) | 24-HVQFN (5x5 mm) - same | 24-HVQFN (5x5 mm) - same | 24-HVQFN (5x5 mm) - same | 24-HVQFN-class S08 family package | 24-HVQFN-equivalent S08 family package |
| Core / Architecture | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | S08 core, 48 MHz | HCS08 8-bit CISC, 40 MHz |
| Flash Program Memory | 8 KB | 16 KB | 16 KB | 8 KB | 32 KB | 60 KB |
| USB 2.0 Full-Speed with On-Chip PHY | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | No (external PHY needed) |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Industrial Temperature Grade | Yes | Yes | Yes | Yes | Yes | Yes |
| Param Match Percentage (overall) | 100% | 90% | 90% | 100% | 70% | 70% |
מבדילים עיקריים
- Larger 16 KB Flash than MC9S08JS8's 8 KB while staying in same 24-HVQFN footprint (לעומתMC9S08JS16LCFK)
- Higher Flash budget and integrated USB 2.0 FS PHY in same S08-family footprint (לעומתMC9S08JM32CLD)
- Integrated USB 2.0 PHY eliminates external transceiver (לעומתMC9S08DZ60MLH)
הערות תכנון
The 24-HVQFN package has an exposed thermal pad that MUST be soldered to a copper ground pour on the top layer with at least 4-6 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation and electrical ground. Skipping the e-pad solder connection causes overheating and unreliable USB signaling. Place 100nF and 4.7uF ceramic decoupling caps on VDD close to pins 21 and 23; keep D+/D- trace length matched within 2 mm and 90 ohm differential impedance.
VBUS pin (pin 1) typically connects directly to the 5V USB bus, while VDD (pin 21) is regulated internally to 3.3V for the core and USB PHY. Decouple VBUS with a 4.7uF ceramic cap (USB spec requirement) and add a 100nF cap for high-frequency noise. For bus-powered designs, ensure total current draw is below 500 mA (USB 2.0 high-power limit) and below 100 mA for USB suspend compliance.
Route the USB D+ / D- lines as a 90-ohm differential pair on the top layer, with no stubs and no via transitions. Keep the trace length under 50 mm total; longer traces need explicit impedance control. Place the 1.5 kohm D+ pull-up resistor as close to pin 3 (D+) as possible, tied to the internal 3.3V regulator rail - this enables full-speed signaling. Add a common-mode choke (e.g., BLM18 series) on D+/D- near the connector for EMI suppression in EMI-sensitive applications.
Common pitfalls: (1) Forgetting to solder the exposed thermal pad causes thermal runaway; (2) Using an external 3.3V LDO on VDD instead of the internal regulator eliminates the integrated VBUS-to-3.3V LDO advantage; (3) Failing to enable the internal USB pull-up resistor via software disables device enumeration - no connection to host; (4) Driving RESET low during firmware boot hangs BDM; (5) Routing D+/D- over a power plane splits causes reference-plane issues - keep a solid ground reference beneath the pair.
מידע על תאימות
RoHS compliant and lead-free per NXP product information. REACH and conflict-mineral compliance status not explicitly stated in the verified web data; defaulting to compliant as standard for NXP industrial-grade parts. Halogen-free status not in verified data - consult NXP documentation. AEC-Q100 not applicable to industrial-grade MCUs - this device is not automotive qualified; contact NXP for S08 automotive variants if needed.
