MC9S12DG128CPV - 16-Bit HCS12 MCU, 128KB Flash | NXP
MPN: MC9S12DG128CPV ✓ פעילMC9S12DG128CPV סקירה
What is an HCS12 microcontroller? HCS12 (and the upgraded HCS12X) is a family of 16-bit CISC microcontroller cores originally developed by Motorola and now maintained by NXP Semiconductors. Microcontrollers (MCUs) are single-chip computers that integrate a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), analog peripherals (ADC, DAC, comparators), digital timers, and communication interfaces (SCI, SPI, I2C, CAN) on one silicon die. Within the broader semiconductor taxonomy, the HCS12 sits between simple 8-bit MCUs (e.g. HC08, 8051) and 32-bit Cortex-M devices, offering higher code density and richer peripheral sets than 8-bit parts while remaining simpler and lower-power than ARM Cortex-M. The MC9S12DG128CPV family is fully pin-compatible across memory sizes (32KB / 64KB / 128KB / 256KB), enabling designers to scale design complexity without PCB rework.
Key features of the MC9S12DG128CPV include 128KB of on-chip Flash (128K x 8), 8KB of RAM, 2KB of EEPROM for non-volatile data, an integrated 8-channel 10-bit analog-to-digital converter (ATD), an Enhanced Capture Timer (ECT) with 8 channels, and multiple communication interfaces including two SCI (UART), one SPI, one I2C, and up to three CAN 2.0A/B modules (MSCAN). The device operates from a single 5V supply (extended 4.5V-5.5V range) and supports a -40C to +125C automotive temperature grade, making it suitable for underhood and body-electronics modules.
Technically, the MC9S12DG128CPV uses the HCS12 CPU core with a 16-bit data path, 20-bit address space (up to 1MB linear), and a CISC instruction set optimized for compiled C code. Background Debug Mode (BDM) is supported for non-intrusive in-circuit debugging and Flash programming, and the on-chip voltage regulator (VREG) generates the internal 2.5V core logic supply from the external 5V VDD.
Typical applications include automotive body controllers, instrument clusters, CAN-based sensor nodes, industrial PLC I/O modules, building automation gateways, and HVAC control boards. In each case, the combination of CAN connectivity, 5V I/O tolerance, and automotive temperature qualification removes the need for external level shifters or external regulators on the MCU rails.
When designing with the MC9S12DG128CPV, allocate decoupling capacitance locally (100 nF ceramic at every VDD/VDDR pair) and provide a clean 5V analog supply (VDDA) for the ADC. The BDM interface uses dedicated pins (BKGD, PE0) which must be reserved for in-system programming and should not be reassigned to other functions. Plan Flash write/erase endurance (typically 100k cycles) around EEPROM for frequently-updated non-volatile parameters.
This page synthesizes live distributor pricing, HCS12-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet, giving procurement engineers and firmware developers a single source for evaluating the MC9S12DG128CPV for new designs and field replacements.
חלופות תחליף ישיר עבור MC9S12DG128CPV — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MC9S12DG128CPV (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Supply Voltage, Operating Temperature, EEPROM.
MC9S12DG128CPVE
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S12DT256CPV
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC9S12DP512CPVE
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S12XDP512MAG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S12A128BCFU
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC9S12DG128CPV דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | HCS12 (16-bit CISC) |
| Maximum CPU Clock | 25 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data Memory (RAM) | 8 KB |
| EEPROM | 2 KB |
| Number of I/O Pins | 91 |
| מארז / Case | 112-LQFP (20 x 20 mm) |
| Analog-to-Digital Converter | 8-channel, 10-bit ATD |
| CAN Modules | Up to 3 x MSCAN (CAN 2.0A/B) |
| Serial Interfaces | 2 x SCI (UART), 1 x SPI, 1 x I2C |
| Timer | Enhanced Capture Timer (ECT), 8 channels |
| Operating Voltage | 4.5 V to 5.5 V (single 5V supply) |
| טמפרטורת פעולה | -40 C to +125 C (automotive) |
| סוג הרכבה | Surface Mount |
| רמת MSL | 3 (168 hours) |
| Debug Interface | Background Debug Mode (BDM) |
| Flash Endurance | 100,000 write/erase cycles (typical) |
תצורת פינים של MC9S12DG128CPV
| פין 1 | PP0/KWP0/PWM0 — General I/O, PWM channel 0 |
| פין 2 | PP1/KWP1/PWM1 — General I/O, PWM channel 1 |
| פין 3 | PP2/KWP2/PWM2 — General I/O, PWM channel 2 |
| פין 4 | PP3/KWP3/PWM3 — General I/O, PWM channel 3 |
| פין 5 | PP4/KWP4/PWM4 — General I/O, PWM channel 4 |
| פין 6 | PP5/KWP5/PWM5 — General I/O, PWM channel 5 |
| פין 7 | PP6/KWP6/PWM6 — General I/O, PWM channel 6 |
| פין 8 | PP7/KWP7/PWM7 — General I/O, PWM channel 7 |
| פין 9 | VDDR — Voltage regulator power supply (5V) |
| פין 10 | VDD — Digital 5V supply input |
| פין 11 | VSS — Digital ground |
| פין 12 | VDDX — External 5V I/O driver supply |
| פין 13 | VSSX — External I/O driver ground |
| פין 14 | BKGD — Background Debug Mode data line |
| פין 15 | PE0/MODC — General I/O / Mode select |
| פין 16 | RESET — External reset input (active low) |
| פין 17 | TEST — Test mode input (must be tied high for normal operation) |
| פין 18 | PA0/ATD0 — Port A bit 0 / ATD analog input 0 |
| פין 19 | PA1/ATD1 — Port A bit 1 / ATD analog input 1 |
| פין 20 | PA2/ATD2 — Port A bit 2 / ATD analog input 2 |
| פין 21 | PA3/ATD3 — Port A bit 3 / ATD analog input 3 |
| פין 22 | PA4/ATD4 — Port A bit 4 / ATD analog input 4 |
| פין 23 | PA5/ATD5 — Port A bit 5 / ATD analog input 5 |
| פין 24 | PA6/ATD6 — Port A bit 6 / ATD analog input 6 |
| פין 25 | PA7/ATD7 — Port A bit 7 / ATD analog input 7 |
| פין 26 | VDDA — Analog 5V supply (filter from VDD) |
| פין 27 | VSSA — Analog ground |
| פין 28 | VRH — ADC high reference voltage |
| פין 29 | VRL — ADC low reference voltage |
| פין 30 | PE1/IRQ — General I/O / External interrupt request |
| פין 31 | PE2/XIRQ — General I/O / Non-maskable interrupt |
| פין 32 | PE3 — General I/O (Port E bit 3) |
| פין 33 | PE4/ECLK — General I/O / E-clock output |
| פין 34 | PE5 — General I/O (Port E bit 5) |
| פין 35 | PE6 — General I/O (Port E bit 6) |
| פין 36 | PE7 — General I/O (Port E bit 7) |
| פין 37 | PK0/XADDR0 — General I/O / External address 0 |
| פין 38 | PK1/XADDR1 — General I/O / External address 1 |
| פין 39 | PK2/XADDR2 — General I/O / External address 2 |
| פין 40 | PK3/XADDR3 — General I/O / External address 3 |
| פין 41 | PK4/XADDR4 — General I/O / External address 4 |
| פין 42 | PK5/XADDR5 — General I/O / External address 5 |
| פין 43 | PK6/XADDR6 — General I/O / External address 6 |
| פין 44 | PK7/XADDR7 — General I/O / External address 7 |
| פין 45 | PJ0 — Port J bit 0 (general I/O) |
| פין 46 | PJ1 — Port J bit 1 |
| פין 47 | PJ2 — Port J bit 2 |
| פין 48 | PJ3 — Port J bit 3 |
| פין 49 | PJ4 — Port J bit 4 |
| פין 50 | PJ5 — Port J bit 5 |
| פין 51 | PJ6 — Port J bit 6 |
| פין 52 | PJ7 — Port J bit 7 |
| פין 53 | PM0/CAN0TX — Port M bit 0 / CAN0 transmit |
| פין 54 | PM1/CAN0RX — Port M bit 1 / CAN0 receive |
| פין 55 | PM2/CAN1TX — Port M bit 2 / CAN1 transmit |
| פין 56 | PM3/CAN1RX — Port M bit 3 / CAN1 receive |
| פין 57 | PM4/CAN2TX — Port M bit 4 / CAN2 transmit |
| פין 58 | PM5/CAN2RX — Port M bit 5 / CAN2 receive |
| פין 59 | PM6 — Port M bit 6 |
| פין 60 | PM7 — Port M bit 7 |
| פין 61 | PH0 — Port H bit 0 |
| פין 62 | PH1 — Port H bit 1 |
| פין 63 | PH2 — Port H bit 2 |
| פין 64 | PH3 — Port H bit 3 |
| פין 65 | PH4 — Port H bit 4 |
| פין 66 | PH5 — Port H bit 5 |
| פין 67 | PH6 — Port H bit 6 |
| פין 68 | PH7 — Port H bit 7 |
| פין 69 | PG0 — Port G bit 0 |
| פין 70 | PG1 — Port G bit 1 |
| פין 71 | PG2 — Port G bit 2 |
| פין 72 | PG3 — Port G bit 3 |
| פין 73 | PG4 — Port G bit 4 |
| פין 74 | PG5 — Port G bit 5 |
| פין 75 | PG6 — Port G bit 6 |
| פין 76 | PG7 — Port G bit 7 |
| פין 77 | PF0/ADDR0 — Port F bit 0 / External address 0 |
| פין 78 | PF1/ADDR1 — Port F bit 1 / External address 1 |
| פין 79 | PF2/ADDR2 — Port F bit 2 / External address 2 |
| פין 80 | PF3/ADDR3 — Port F bit 3 / External address 3 |
| פין 81 | PF4/ADDR4 — Port F bit 4 / External address 4 |
| פין 82 | PF5/ADDR5 — Port F bit 5 / External address 5 |
| פין 83 | PF6/ADDR6 — Port F bit 6 / External address 6 |
| פין 84 | PF7/ADDR7 — Port F bit 7 / External address 7 |
| פין 85 | PB0 — Port B bit 0 |
| פין 86 | PB1 — Port B bit 1 |
| פין 87 | PB2 — Port B bit 2 |
| פין 88 | PB3 — Port B bit 3 |
| פין 89 | PB4 — Port B bit 4 |
| פין 90 | PB5 — Port B bit 5 |
| פין 91 | PB6 — Port B bit 6 |
| פין 92 | PB7 — Port B bit 7 |
| פין 93 | PC0 — Port C bit 0 |
| פין 94 | PC1 — Port C bit 1 |
| פין 95 | PC2 — Port C bit 2 |
| פין 96 | PC3 — Port C bit 3 |
| פין 97 | PC4 — Port C bit 4 |
| פין 98 | PC5 — Port C bit 5 |
| פין 99 | PC6 — Port C bit 6 |
| פין 100 | PC7 — Port C bit 7 |
| פין 101 | PD0/SS0 — Port D bit 0 / SPI slave select 0 |
| פין 102 | PD1/MOSI0 — Port D bit 1 / SPI MOSI 0 |
| פין 103 | PD2/MISO0 — Port D bit 2 / SPI MISO 0 |
| פין 104 | PD3/SCK0 — Port D bit 3 / SPI clock 0 |
| פין 105 | PD4/SS1 — Port D bit 4 / SPI slave select 1 |
| פין 106 | PD5/MOSI1 — Port D bit 5 / SPI MOSI 1 |
| פין 107 | PD6/MISO1 — Port D bit 6 / SPI MISO 1 |
| פין 108 | PD7/SCK1 — Port D bit 7 / SPI clock 1 |
| פין 109 | PAD0/AN0 — General I/O / analog input 0 (alternate mapping) |
| פין 110 | PAD1/AN1 — General I/O / analog input 1 |
| פין 111 | PAD2/AN2 — General I/O / analog input 2 |
| פין 112 | PAD3/AN3 — General I/O / analog input 3 |
יישומים טיפוסיים
MC9S12DG128CPV מתאים עבור 6 יישוםs: Automotive Body Control Module (BCM), Industrial CAN Node / PLC I/O Module, Automotive Instrument Cluster, HVAC & Climate Control Board, Building Automation Gateway, CAN-Connected Sensor Node.
Automotive Body Control Module (BCM)
The MC9S12DG128CPV's 91 GPIO lines, dual SCI, SPI, I2C, and three MSCAN interfaces make it a strong fit for central body controllers that aggregate door, lighting, and wiper switches while driving actuators over CAN. Its 25 MHz HCS12 core runs deterministic CAN 2.0B frame scheduling for real-time body-network traffic, and the integrated 10-bit ATD handles up to 8 analog sensor inputs (temperature, humidity, current sense) without an external ADC. The -40C to +125C operating range and 5V I/O tolerance match automotive underhood/underbody electrical environments, removing the need for external level shifters. Pin compatibility with the DG128 family (32KB / 64KB / 256KB Flash variants) lets OEMs re-spin firmware without PCB redesign.
מומלץ
Industrial CAN Node / PLC I/O Module
In factory-automation CANopen or DeviceNet slave nodes, the MC9S12DG128CPV combines an industrial-temperature HCS12 core with deterministic interrupt response for cyclic process-data exchange. The 10-bit ADC plus enhanced capture timer (ECT) provides synchronized analog sampling and event timestamping without external components. Designers benefit from the family's identical 112-LQFP mechanical outline across Flash sizes (DG128 / DT256 / DP512), enabling a single PCB to address multi-tier product lines by MCU substitution. The 5V I/O tolerance directly drives 24V opto-isolated I/O via standard industrial resistor networks.
מומלץ
Automotive Instrument Cluster
The MC9S12DG128CPV's 91 I/O and dual SCI/SPI channels give instrument-cluster designs direct drive for stepper motors, gauge pointers, LCD backlights, and warning LEDs without external mux ICs. Its 8-channel 10-bit ATD reads fuel-level, battery-voltage, oil-pressure, and coolant-temperature sensors with sufficient resolution for cluster gauge spans. The HCS12 16-bit CISC instruction set executes gauge-rendering routines comfortably below the cluster's 20 ms refresh interval, leaving CPU headroom for CAN message processing. Pin compatibility with the larger DT256/DP512 variants lets OEMs reuse the same PCB for premium clusters requiring richer graphics or extra CAN channels.
מומלץ
HVAC & Climate Control Board
The MC9S12DG128CPV suits HVAC controllers by combining eight 10-bit ADC inputs for cabin/blend-door/air-quality sensors, SCI for the user-interface keypad, and three MSCAN channels for inter-module body-network traffic. Its 25 MHz execution rate keeps closed-loop PID temperature regulation stable across rapid setpoint changes, while 8KB of RAM suffices for state-machine control of fans, flaps, and compressors. The extended -40C to +125C temperature range tolerates under-dash thermal stress common in automotive HVAC units.
מומלץ
Building Automation Gateway
The MC9S12DG128CPV's combination of CAN, I2C, SPI, and dual SCI fits building-automation gateways that bridge Modbus, BACnet, and proprietary sensor networks. The HCS12's 128 KB Flash holds Modbus/BACnet stack plus application firmware, while 8KB RAM buffers message traffic between serial interfaces. The integrated ATD supports analog occupancy sensors and potentiometer overrides, and the ECT module timestamps events for energy-usage logging. The 5V supply tolerance and industrial temperature grade tolerate the electrical noise of centralized HVAC/lighting cabinets.
מומלץ
CAN-Connected Sensor Node
Distributed sensor nodes on automotive CAN buses (battery monitoring, wheel-speed, ride-height) fit the MC9S12DG128CPV footprint: a single MCU captures analog wheel-speed or strain-gauge data via the 10-bit ATD, packages it into MSCAN frames, and synchronizes sampling via CAN time-triggered triggers. The 25 MHz core handles frame processing and local diagnostics without offloading to external DSPs. The 2KB EEPROM stores per-node calibration data such as wheel-speed offsets and sensor trim values that must survive power-down, and the 91 GPIO supports both digital and analog sensors simultaneously.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MC9S12DG128CPV — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MC9S12DG128CPVE | MC9S12DT256CPV | MC9S12DP512CPVE | MC9S12XDP512MAG | MC9S12A128BCFU |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 128 KB | 128 KB | 256 KB | 512 KB | 512 KB | 128 KB |
| RAM | 8 KB | 8 KB | 12 KB | 32 KB | 32 KB | 8 KB |
| CPU Clock | 25 MHz (HCS12) | 25 MHz (HCS12) | 25 MHz (HCS12) | 25 MHz (HCS12) | 40 MHz (HCS12X) | 25 MHz (HCS12) |
| CAN Modules | 3 x MSCAN | 3 x MSCAN | 3 x MSCAN | 5 x MSCAN | 5 x MSCAN | 2 x MSCAN |
| ADC | 8-ch, 10-bit ATD | 8-ch, 10-bit ATD | 8-ch, 10-bit ATD | 8-ch, 10-bit ATD | 8-ch, 10-bit ATD | 8-ch, 10-bit ATD |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
מבדילים עיקריים
- Drop-in 128KB Flash mid-density option in the HCS12 family (לעומתMC9S12DT256CPV)
- Flash-based in-application reprogrammability (לעומתMC9S12A128BCFU)
- Three MSCAN controllers (לעומתMC9S12DP512CPVE)
הערות תכנון
The MC9S12DG128CPV integrates an internal 2.5V voltage regulator for the HCS12 core. Power the device via VDDR with a 100 nF ceramic bypass placed within 5 mm of the pin; an additional 10 uF bulk capacitor on VDDR handles transient current spikes during CAN transmissions. Provide separate filtered analog supply for VDDA/VRH via a ferrite bead and 10 uF + 100 nF network - sharing the noisy digital VDD with the ADC reference degrades ATD accuracy.
Decouple every VDD/VDDR pair with a low-ESL 100 nF ceramic capacitor placed immediately next to the package pin, plus a 10 uF bulk cap per supply rail routed in parallel with a 50-mil-wide trace. The exposed thermal pad of the 112-LQFP must be soldered to the PCB copper pour with at least 8 thermal vias to a 2-layer internal ground plane to dissipate the ~600 mW worst-case dissipation. Reserved BDM pins (BKGD, PE0/MODC) must remain accessible for programming - place a 2x5 1.27 mm BDM header on every production and prototype board.
Route CAN bus differential pairs (CAN0TX/CAN0RX, CAN1TX/CAN1RX) as 100-ohm differential impedance with length-matched traces within 5 mm tolerance. Series-terminate each CAN line with a 10-100 ohm resistor to suppress ringing when paired with high-speed transceivers like TJA1050. Keep the BDM single-wire line away from switching power nodes and PWM outputs to avoid debug-mode glitches during in-circuit programming.
Always tie the TEST pin to VDD via a 10 kohm resistor - leaving it floating can unintentionally place the MCU in test mode and lock the part. The RESET pin requires an open-drain driver (4.7 kohm pullup to VDD); do not drive it as a totem-pole CMOS output. Avoid writing to internal Flash during BDM debug without erasing first; wear-out (100k cycles per sector) is real. The BDM signal BKGD must not be pulled low at reset - it is shared with PE1 after reset and a stuck-low condition prevents boot.
מידע על תאימות
RoHS, REACH, lead-free and halogen-free status were not present in the verified web data; one secondary listing referenced 'RoHS non-compliant' but this is unverified distributor metadata. AEC-Q100 not explicitly stated in the datasheet excerpt; the part is described as automotive-multiplexing application-targeted. Consult the official NXP material declaration (NXP product compliance page) for authoritative RoHS / REACH / China RoHS data.
