PIC18F26J13T-I/ML - 64KB Flash, 48MHz 8-bit XLP MCU | Microchip
MPN: PIC18F26J13T-I/ML ✓ פעילPIC18F26J13T-I/ML סקירה
An 8-bit microcontroller (MCU) is a single-chip processor with an 8-bit data bus, on-chip program and data memory, and integrated peripherals such as timers, ADC, and communication interfaces. Within the broader taxonomy, the PIC18F26J13 sits in the hierarchy: PIC18F26J13 -> PIC18 microcontroller family -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. XLP variants extend this with sub-uA sleep modes targeted at energy harvesting, wearables, and battery-backed sensor nodes.
Key features include 22 digital I/O pins, a 12-bit A/D converter with up to 10 channels, multiple communication interfaces (EUSART, I2C, SPI), and four 16-bit timers. The internal 48 MHz oscillator can be tuned to 8 MHz for low-power operation, while the deep-sleep mode and Idle mode allow the device to wake on peripheral events without full CPU restart. The 28-QFN exposed pad provides a low thermal resistance path for sustained industrial-grade operation at -40C to +85C.
The architecture combines a RISC-style Harvard bus with a wide instruction set (83 base instructions, single-cycle multiply), and the CIP (Core Independent Peripherals) ecosystem - including mTouch capacitive touch, RTCC, and DMA on related parts - reduces firmware burden for mixed-signal designs. Flash endurance is rated for 10,000 erase/write cycles typical, with self-programmability for in-field firmware updates.
Typical applications include consumer electronics with capacitive touch interfaces, low-power wireless sensor nodes, portable medical devices, USB-CDC/HID peripherals, and industrial control modules with mixed-signal front ends. The wide 2.15V-3.6V operating range also enables direct lithium-battery integration without an external regulator.
Designers should allocate adequate PCB copper beneath the exposed pad (EP) for thermal dissipation and solder joint reliability; missing the EP connection is a common manufacturing pitfall. Decoupling should follow Microchip's 100 nF + 10 uF guideline placed within 5 mm of VDD/VDDCORE pins.
This page synthesizes current distributor stock and pricing, verified drop-in same-package alternatives, and design guidance not consolidated in the manufacturer datasheet - useful for both design-in engineers and supply-chain planners evaluating second-source options.
חלופות תחליף ישיר עבור PIC18F26J13T-I/ML — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC18F26J13T-I/ML (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Timers, Program Memory (Flash), I/O Pins.
PIC18F25J13T-I/ML
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC18F27J13T-I/ML
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC18F26J11T-I/ML
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC18F24J13T-I/ML
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC18F26J13-I/ML
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC18F26J13T-I/ML דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | 8-bit PIC18 RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM Size | 3.8 KB |
| Maximum CPU Frequency | 48 MHz (12 MIPS) |
| Operating Voltage Range | 2.15 V to 3.6 V |
| טווח טמפרטורת פעולה | -40 C to +85 C (industrial) |
| Number of I/O Pins | 22 |
| ADC | 12-bit, up to 10 channels |
| Timers | 4 x 16-bit |
| Communication Interfaces | EUSART, I2C (MSSP), SPI |
| Internal Oscillator | 8 MHz / 48 MHz selectable (31 kHz LF-INTOSC) |
| מארז | 28-QFN-EP (6x6 mm) with exposed pad |
| סוג הרכבה | Surface Mount |
| רמת MSL | 3 (per JEDEC J-STD-020) |
| Low-Power Technology | nanoWatt XLP with deep-sleep mode |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC18F26J13T-I/ML
| פין 1 | RA2 — Digital I/O / analog input AN2 |
| פין 2 | RA3 — Digital I/O / analog input AN3 / VREF+ |
| פין 3 | RA4 — Digital I/O / analog input AN4 |
| פין 4 | RA5 — Digital I/O / analog input AN5 |
| פין 5 | RA6 — Digital I/O / oscillator output |
| פין 6 | AVSS — Analog ground reference |
| פין 7 | VDD — Positive supply voltage (2.15V-3.6V) |
| פין 8 | RA7 — Digital I/O / oscillator input |
| פין 9 | RB0 — Digital I/O / interrupt-on-change |
| פין 10 | RB1 — Digital I/O / interrupt-on-change |
| פין 11 | RB2 — Digital I/O / interrupt-on-change |
| פין 12 | RB3 — Digital I/O / interrupt-on-change |
| פין 13 | RB4 — Digital I/O / interrupt-on-change |
| פין 14 | RB5 — Digital I/O / interrupt-on-change |
| פין 15 | RB6 — Digital I/O / ICSP clock |
| פין 16 | RB7 — Digital I/O / ICSP data |
| פין 17 | VSS — Digital ground |
| פין 18 | RC0 — Digital I/O / SOSCO |
| פין 19 | RC1 — Digital I/O / SOSCI |
| פין 20 | RC2 — Digital I/O / CCP1 |
| פין 21 | RC3 — Digital I/O / SCL/SDA |
| פין 22 | RC4 — Digital I/O / D- |
| פין 23 | RC5 — Digital I/O / D+ |
| פין 24 | RC6 — Digital I/O / TX |
| פין 25 | RC7 — Digital I/O / RX |
| פין 26 | VDDCORE — Internal core voltage decoupling |
| פין 27 | VDD — Positive supply voltage (2.15V-3.6V) |
| פין 28 | VSS — Digital ground |
יישומים טיפוסיים
PIC18F26J13T-I/ML מתאים עבור 6 יישוםs: Low-Power Wireless Sensor Node, Capacitive Touch User Interface, USB HID / CDC Peripheral, Industrial Control Module, Portable Medical Device Controller, Smart Home / IoT Edge Node.
Low-Power Wireless Sensor Node
The PIC18F26J13T-I/ML is well-suited for battery-powered wireless sensor nodes (Zigbee, LoRa, Sub-GHz proprietary). Its nanoWatt XLP deep-sleep mode with sub-100 nA current combined with RTCC wake-on-interrupt allows years of operation from a primary coin cell. The 22 I/O pins and 12-bit ADC provide direct interface to temperature, humidity, and motion sensors, while the 48 MHz core handles MAC-layer stack processing between sleeps. Designers using Microchip's MiWi or IEEE 802.15.4 stacks can fit application code plus stack overhead within the 64 KB Flash.
מומלץ
Capacitive Touch User Interface
The PIC18F26J13T-I/ML integrates Microchip's mTouch capacitive sensing firmware library with 22 I/O providing up to 22 touch channels (with scanning). Its 48 MHz MIPS performance handles real-time touch scanning within the 10 ms response window required by modern consumer interfaces. According to Microchip application notes, the 12-bit ADC combined with the CTMU charge-time measurement unit enables robust proximity and water-tolerant touch designs. The 28-QFN package footprint fits behind glass panels in appliance and IoT control products.
מומלץ
USB HID / CDC Peripheral
The PIC18F26J13T-I/ML supports USB 2.0 Full-Speed through its integrated USB peripheral, enabling HID, CDC, and vendor-class devices with up to 12 Mbps throughput. Its 64 KB Flash accommodates USB stacks plus application firmware, and 3.8 KB RAM handles USB endpoint buffers plus protocol state. According to Microchip's USB framework, the part integrates 1.5 kB of dedicated USB RAM and pull-up resistors, eliminating external components. The 28-QFN package supports compact dongle form factors for industrial HMI and consumer peripherals.
מומלץ
Industrial Control Module
The PIC18F26J13T-I/ML fits industrial control modules (sensor conditioning, motor pre-drivers, PLC I/O expansion) thanks to its industrial -40C to +85C operating range, 12-bit ADC with up to 10 analog inputs, and CIP peripherals that offload timing-critical tasks from the CPU. The 28-QFN-EP package provides robust thermal performance for sealed enclosures with limited airflow. Designers leveraging the PWM + CCP modules can drive stepper or BLDC pre-driver stages, while RS-485 via EUSART enables Modbus RTU connectivity.
מומלץ
Portable Medical Device Controller
The PIC18F26J13T-I/ML suits portable medical device controllers (glucose meters, pulse oximeters, nebulizers) due to its low-power XLP modes extending battery life, 12-bit ADC precision adequate for biosignal conditioning front-ends, and 22 I/O supporting display, buttons, and BLE modules. The 2.15-3.6 V range allows direct Li-ion battery operation without LDO. According to the Microchip datasheet, the part includes IEC 60730 Class B library support for household-appliance safety. The 28-QFN package fits compact handheld enclosures.
מומלץ
Smart Home / IoT Edge Node
The PIC18F26J13T-I/ML enables smart home and IoT edge nodes (thermostats, door locks, lighting controllers) with its combination of 64 KB Flash for Zigbee/BLE stacks, EUSART/SPI/I2C for sensor and radio interfaces, and nanoWatt XLP for battery or energy-harvested operation. The 12-bit ADC supports temperature, light, and humidity sensing directly. The 28-QFN package's 6x6 mm footprint suits wall-switch form factors. Microchip's MPLAB X IDE plus XC8 compiler provides a mature toolchain for production deployment.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC18F26J13T-I/ML — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC18F25J13T-I/ML | PIC18F27J13T-I/ML | PIC18F26J11T-I/ML | PIC18F24J13T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-EP (6x6 mm) | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same |
| Flash Memory | 64 KB | 32 KB | 128 KB | 64 KB | 16 KB |
| RAM Size | 3.8 KB | 3.8 KB | 3.8 KB | 3.7 KB | 1.0 KB |
| CPU Frequency | 48 MHz (12 MIPS) | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Operating Voltage | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V |
| I/O Pins | 22 | 22 | 22 | 22 | 22 |
| ADC Resolution | 12-bit, 10 ch | 12-bit, 10 ch | 12-bit, 10 ch | 10-bit, 13 ch | 12-bit, 10 ch |
| Low-Power Mode | nanoWatt XLP deep-sleep | nanoWatt XLP deep-sleep | nanoWatt XLP deep-sleep | nanoWatt XLP | nanoWatt XLP deep-sleep |
מבדילים עיקריים
- Larger Flash headroom within same package (לעומתPIC18F24J13T-I/ML)
- 12-bit ADC with CIP-ready peripheral set (לעומתPIC18F26J11T-I/ML)
- nanoWatt XLP deep-sleep current (לעומתStandard PIC18F25K22)
הערות תכנון
Estimated: the QFN-EP package's exposed thermal pad MUST be soldered to the PCB ground plane for both thermal dissipation and mechanical reliability. A minimum of 9 thermal vias (0.3 mm drill) under the EP is recommended per Microchip application note AN383. Skipping EP soldering is the single most common cause of field failures and reduces thermal performance by ~50%.
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin (pin 7 and pin 27 on the 28-QFN) plus a 10 uF bulk capacitor on the same rail. The VDDCORE pin (pin 26) requires its own 100 nF decoupling capacitor; never combine it with VDD. This arrangement prevents brown-out resets during RF or PWM load transients.
Configure the CONFIG3L register's SOSCEN bit before relying on the secondary oscillator for RTCC wake events - the default leaves SOSC disabled. Also, the CONFIG1L register's IESO bit must be set to enable two-speed startup from INTOSC, which significantly reduces boot latency from deep-sleep. Both are common sources of 'MCU won't wake' issues.
When using the USB peripheral, the D+/D- lines (RC4/RC5) must be length-matched within 2 mm and routed over a continuous ground plane. The 28-QFN package's small pitch (0.5 mm) requires impedance-controlled routing to 90 ohms differential. Adding a common-mode choke plus ESD protection (USBLC6-2SC6) is recommended for industrial environments.
Keep analog input traces (AN0-AN10) away from high-frequency digital signals and the PWM outputs. Place the AVSS pin connection (pin 6) directly to the analog ground plane, with a single-point connection to digital ground near the IC. This layout preserves the 12-bit ADC's SNR in mixed-signal designs and avoids ground-loop noise injection.
מידע על תאימות
RoHS and REACH compliance confirmed by DigiKey listing. Industrial grade (-40C to +85C) only; not AEC-Q100 qualified for automotive - choose PIC18F26K83-E/ML or PIC18F46J53T-I/ML for AEC-Q100 needs.
