PIC32MX270F256D-I/TL - 32-bit MCU 256KB Flash USB | 44-VTLA
MPN: PIC32MX270F256D-I/TL ✓ פעילPIC32MX270F256D-I/TL סקירה
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance CPU core, program and data memory, and a rich set of on-chip peripherals such as timers, communication interfaces, and analog blocks. Within the broader taxonomy, the PIC32MX270F256D belongs to the Microchip PIC32 microcontroller family, which sits in the hierarchy MCU -> microcontroller -> embedded processor -> semiconductor. It targets applications that need true 32-bit MIPS performance, USB connectivity, and audio/graphics peripherals in low-pin-count packages.
Key features include 0.5 mA/MHz typical active core current consumption, mTouch capacitive-touch hardware support, a 1 ns resolution time-measurement unit for high-precision capture, a 10-bit ADC, and a CTMU charge-time measurement unit. The USB 2.0 full-speed OTG, I2S, and PMP peripherals are integrated on-chip, allowing single-IC designs for Bluetooth audio PIMs, simple GUI panels, and HID-class peripherals.
The device uses the MIPS32 M4K core with hardware multiply/divide, 5-stage pipeline, and Microchip's MPLAB Harmony and XC32 toolchain support. The on-chip 256 KB program Flash and 64 KB SRAM are large enough for USB stacks, audio processing, and small RTOS use without external memory, simplifying the BOM and lowering cost.
Typical applications include USB audio devices and Bluetooth audio development kit PIMs, low-cost graphics HMI panels driven through PMP, capacitive-touch user interfaces using mTouch, USB HID peripherals such as custom keyboards or game controllers, and general-purpose 32-bit embedded control replacing 8/16-bit MCUs. The 44-pin VTLA package keeps board area small while still exposing USB, PMP, and a full ADC.
When designing with this device, allocate the EPAD to a continuous ground copper pour for thermal dissipation and signal return, and follow Microchip's VTLA landing-pattern guidelines to avoid solder-joint reliability issues. PQ268 instrumentation-amp companion parts and PIC32 Bluetooth Audio Development Kit PIMs pair well with this MCU.
This page synthesizes distributor pricing, drop-in VTLA alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select and source the PIC32MX270F256D-I/TL with confidence.
חלופות תחליף ישיר עבור PIC32MX270F256D-I/TL — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MX270F256D-I/TL (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Timers, DMA Channels, Package, Parallel Master Port (PMP).
PIC32MX250F256D-I/TL
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX170F256D-I/TL
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX230F256D-I/TL
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX270F256D-I/TL דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz (up to 50 MHz/83 DMIPS) |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage Range | 2.5 V to 3.6 V |
| Typical Active Current | 0.5 mA/MHz |
| מארז | 44-pin VTLA (6x6 mm) with exposed pad |
| סוג הרכבה | Surface Mount |
| USB Controller | USB 2.0 full-speed device / host / OTG |
| I2S/SPI Modules | 2 (for codec and serial communications) |
| Parallel Master Port (PMP) | Yes, for graphics interfaces |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit |
| mTouch Capacitive Touch | Supported (buttons and sliders) |
| Time Measurement Resolution | 1 ns |
| טווח טמפרטורת פעולה | -40 C to +85 C (Industrial, I grade) |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC32MX270F256D-I/TL
| פין 1 | RPB0 — Remappable peripheral pin B0 / PGEC1 |
| פין 2 | RPB1 — Remappable peripheral pin B1 / PGED1 |
| פין 3 | RPB2 — Remappable peripheral pin B2 / AN0 |
| פין 4 | RPB3 — Remappable peripheral pin B3 / AN1 |
| פין 5 | VSS — Ground |
| פין 6 | RPB4 — Remappable peripheral pin B4 / AN2 |
| פין 7 | RPB5 — Remappable peripheral pin B5 / AN3 |
| פין 8 | RPB6 — Remappable peripheral pin B6 / AN4 |
| פין 9 | RPB7 — Remappable peripheral pin B7 / AN5 |
| פין 10 | RPC0 — Remappable peripheral pin C0 |
| פין 11 | RPC1 — Remappable peripheral pin C1 |
| פין 12 | RPC2 — Remappable peripheral pin C2 |
| פין 13 | RPC3 — Remappable peripheral pin C3 |
| פין 14 | RPC4 — Remappable peripheral pin C4 |
| פין 15 | RPC5 — Remappable peripheral pin C5 |
| פין 16 | RPC6 — Remappable peripheral pin C6 |
| פין 17 | RPC7 — Remappable peripheral pin C7 |
| פין 18 | VSS — Ground (additional) |
| פין 19 | RPD0 — Remappable peripheral pin D0 |
| פין 20 | RPD1 — Remappable peripheral pin D1 |
| פין 21 | RPD2 — Remappable peripheral pin D2 |
| פין 22 | RPD3 — Remappable peripheral pin D3 |
| פין 23 | RPD4 — Remappable peripheral pin D4 |
| פין 24 | RPD5 — Remappable peripheral pin D5 |
| פין 25 | RPD6 — Remappable peripheral pin D6 |
| פין 26 | RPD7 — Remappable peripheral pin D7 |
| פין 27 | RPE0 — Remappable peripheral pin E0 |
| פין 28 | RPE1 — Remappable peripheral pin E1 |
| פין 29 | RPE2 — Remappable peripheral pin E2 |
| פין 30 | RPE3 — Remappable peripheral pin E3 |
| פין 31 | VSS — Ground |
| פין 32 | VDD — Positive supply (2.5V to 3.6V) |
| פין 33 | RPF0 — Remappable peripheral pin F0 |
| פין 34 | RPF1 — Remappable peripheral pin F1 |
| פין 35 | RPF2 — Remappable peripheral pin F2 |
| פין 36 | RPF3 — Remappable peripheral pin F3 |
| פין 37 | RPF4 — Remappable peripheral pin F4 |
| פין 38 | RPF5 — Remappable peripheral pin F5 |
| פין 39 | RPF6 — Remappable peripheral pin F6 |
| פין 40 | VBUS — USB VBUS sense |
| פין 41 | D- — USB D- data line |
| פין 42 | D+ — USB D+ data line |
| פין 43 | VDD — Positive supply (2.5V to 3.6V) |
| פין 44 | RPF7 — Remappable peripheral pin F7 |
| פין 45 | EPAD — Exposed thermal pad - connect to ground |
יישומים טיפוסיים
PIC32MX270F256D-I/TL מתאים עבור 6 יישוםs: USB Audio Devices and Bluetooth Audio PIMs, Low-Cost Graphics HMI Panels, Capacitive Touch User Interfaces (mTouch), USB HID Peripherals (Custom Keyboards, Game Controllers), Migration from 8/16-bit MCUs to 32-bit Performance, Industrial Control and Sensor Aggregation.
USB Audio Devices and Bluetooth Audio PIMs
The PIC32MX270F256D-I/TL is purpose-built for USB audio and Bluetooth audio development kit Plug-In Modules. Its USB 2.0 full-speed OTG controller handles USB audio class 1.0 enumeration and HID/CDC composite interfaces natively, while the two I2S modules drive external codecs for stereo audio streaming. The 256 KB Flash accommodates USB audio stacks plus DSP routines, and the 64 KB SRAM buffers audio packets without overflow at 48 kHz / 16-bit. Microchip's Bluetooth Audio Development Kit uses this exact part as its PIM, demonstrating its suitability for USB audio dongles, headphone adapters, and Bluetooth audio bridges.
מומלץ
Low-Cost Graphics HMI Panels
The on-chip Parallel Master Port (PMP) drives small TFT LCD panels without an external graphics controller, reducing BOM cost and PCB area. The PIC32MX270F256D-I/TL's 40 MHz MIPS32 M4K core renders simple GUIs and updates small framebuffers efficiently. Combined with 256 KB Flash for asset storage and 64 KB SRAM for buffer management, the part supports 320x240 QVGA panels driven through PMP. The Peripheral Pin Select (PPS) feature routes PMP data and control signals to convenient pins, simplifying PCB layout in compact HMI designs such as appliance displays, instrument panels, and control modules.
מומלץ
Capacitive Touch User Interfaces (mTouch)
The PIC32MX270F256D-I/TL integrates Microchip's mTouch capacitive-touch hardware with the CTMU (Charge Time Measurement Unit), enabling robust touch-button and slider interfaces without external touch ICs. The 1 ns time-measurement resolution captures capacitive charge/discharge events with high signal-to-noise ratio, supporting moisture-tolerant touch designs. With up to 13 ADC channels and the PPS-routed analog peripherals, designers can implement multi-button control panels, slider controls, and proximity sensors. The 44-pin VTLA package keeps the touch panel PCB compact for kitchen appliances, industrial controls, and consumer electronics.
מומלץ
USB HID Peripherals (Custom Keyboards, Game Controllers)
The PIC32MX270F256D-I/TL's USB 2.0 full-speed controller with on-chip transceiver enables USB HID-class peripherals such as custom keyboards, game controllers, and pointing devices without an external PHY. The on-chip 256 KB Flash stores USB HID descriptors, keymaps, and macro logic, while the 40 MHz MIPS32 M4K core scans matrices and processes HID reports within USB polling intervals. The PPS-routed USB D+/D- pins simplify PCB layout, and the 44-pin VTLA footprint allows compact device enclosures. This part is widely used in custom input devices and USB peripherals requiring low BOM cost.
מומלץ
Migration from 8/16-bit MCUs to 32-bit Performance
The PIC32MX270F256D-I/TL provides a migration path for designs transitioning from PIC16, PIC18, or other 8/16-bit MCUs to true 32-bit MIPS performance. Its peripheral set (USB, I2S, PMP) and 256 KB Flash / 64 KB SRAM match the headroom needed for richer firmware, RTOS use, and USB stacks. The MPLAB Harmony framework, XC32 compiler, and PIC32 software libraries ease migration with familiar MPLAB X IDE workflows. The 44-pin VTLA footprint offers comparable I/O count to popular 8/16-bit 40-44 pin parts, allowing direct PCB-level migration with minimal rework.
מומלץ
Industrial Control and Sensor Aggregation
The PIC32MX270F256D-I/TL's 10-bit ADC with multiple channels, combined with I2C/SPI/UART peripherals, makes it suitable for industrial sensor aggregation nodes reading temperature, pressure, flow, and analog sensors. The 0.5 mA/MHz typical active current keeps power budgets reasonable in always-on industrial installations. The 44-pin VTLA package provides ample GPIO for sensor interfacing, and the PPS feature allows flexible peripheral-to-pin mapping for EMC-robust layouts. Industrial temperature grade (-40 C to +85 C, I suffix) ensures operation in factory automation, building control, and HVAC equipment.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MX270F256D-I/TL — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MX270F256D-I/ML | PIC32MX274F256D-I/ML | PIC32MX250F256D-I/TL | PIC32MX170F256D-I/TL | PIC32MX230F256D-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VTLA (6x6 mm) | 44-QFN (8x8 mm) - different footprint | 44-QFN (8x8 mm) - different footprint | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| CPU Speed | 40 MHz (83 DMIPS class) | 40 MHz | 40 MHz | 50 MHz (+25%) | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | No | No | No |
| I2S Modules | 2 | 2 | 2 | 2 | 1 | 2 |
| PMP (Graphics) | Yes | Yes | Yes | Yes | Yes | No |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
מבדילים עיקריים
- Integrated USB 2.0 full-speed OTG with on-chip transceiver (לעומתPIC32MX250F256D-I/TL)
- Dual I2S modules for stereo audio codec interfacing (לעומתPIC32MX170F256D-I/TL)
- Compact 6x6 mm VTLA package for space-limited PCBs (לעומתPIC32MX270F256D-I/ML)
- mTouch capacitive touch hardware integration (לעומתPIC32MX230F256D-I/TL)
הערות תכנון
Estimated thermal resistance for the 44-pin VTLA (6x6 mm) package with exposed pad: theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board with a continuous ground pour under the EPAD. For reliable operation, ensure the EPAD is soldered to a continuous ground copper pour of at least 25 mm x 25 mm with multiple 0.3 mm thermal vias to inner ground layers. Insufficient EPAD soldering can increase junction temperature by 20-30 C, reducing long-term reliability.
Place the 0.1 uF VDD decoupling capacitor as close as possible to each VDD pin (pins 32 and 43), with traces short and wide. Add a bulk 10 uF tantalum or ceramic capacitor near the VDD pins to handle USB inrush current. Route the USB D+/D- differential pair with 90-ohm differential impedance, matched length within 150 mil, and keep them away from noisy switching signals. For PMP graphics interfaces, group data, control, and address lines to minimize skew and route over a continuous ground plane.
Common pitfalls with the PIC32MX270F256D-I/TL include: (1) Forgetting to solder the EPAD - this causes overheating and USB communication failures; (2) Not configuring the PPS registers before using remappable peripherals, leading to silent peripheral failures; (3) Programming the device with the wrong configuration bits - the I-grade part requires industrial-range configuration (IESO, POSCMOD settings); (4) Exceeding 3.6 V on any pin - the part is not 5 V tolerant on I/O, even though USB VBUS can be 5 V; (5) Forgetting to enable the JTAG port locks in DEBUG mode - configure FSEC<7:0> correctly to allow ICD3/PICkit4 access.
Estimated power consumption at 40 MHz active CPU, USB enabled, 3.3 V VDD: roughly 20 mA core current (0.5 mA/MHz typical). With USB active and I2S codecs active, total current can reach 30-35 mA. For USB suspend current, the part must drop below 2.5 mA - configure the USB module to enter low-power suspend when USB host suspends. Add a 10 uF bulk decoupling capacitor near the USB VBUS sense pin to handle USB bus-powered inrush current. Use a LDO with at least 100 mA capacity for stable USB operation.
מידע על תאימות
RoHS compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C) but not AEC-Q100 qualified - select AEC-Q100 automotive variants for automotive applications.
