PIC32MX370F512L-V/PF - 32-bit MCU, 512KB Flash, USB, TQFP-100 | Microchip
MPN: PIC32MX370F512L-V/PF ✓ פעילPIC32MX370F512L-V/PF סקירה
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a range of peripheral interfaces (timers, ADC, communication controllers, GPIO) into one package. Within the broader semiconductor taxonomy, an MCU belongs to the family of microcontrollers and embedded processors. The PIC32MX3xx/4xx family specifically combines 32-bit MIPS performance with peripheral integration optimized for human-machine interface (HMI), audio, graphics, and USB-connected designs.
Key features of this part include two SPI/I2S ports, two I2C ports, two UART ports, a 10-bit 1 MSPS ADC with up to 28 analog channels, two analog comparators, five 16-bit timers/counters, a Parallel Master Port (PMP), and a 4-wire resistive touch controller via the CTMU peripheral. The device supports MIPS16e code compression for up to 40% smaller code size and offers multiple low-power modes (Idle, Sleep) ideal for battery-aware designs.
The architecture pairs a single-cycle hardware MAC 32x16 multiply unit with a deterministic interrupt controller featuring individually programmable priorities and a Fail-Safe Clock Monitor. Memory is mapped uniformly with 12 KB boot Flash, configurable prefetch module, and 128 KB SRAM shared between code and data space. JTAG and two-wire programming/debug interfaces support MPLAB X IDE and ICD tools end to end.
Typical applications include automotive infotainment and HMI panels, USB HID peripherals and composite devices, audio processing front-ends (using the integrated I2S interfaces), industrial control with capacitive touch, and low-cost graphics TFT driver boards. The AEC-Q100 qualification makes it suitable for dashboard clusters and body-control modules.
When selecting this part, ensure the 100-pin TQFP land pattern matches your PCB footprint and that your firmware targets the PIC32MX3xx/4xx HAL. Decoupling requires a 0.1 uF ceramic close to each VDD/VSS pair plus a bulk 10 uF near the regulator. The USB peripheral requires the standard 48 MHz clock accuracy and proper PCB-controlled-impedance routing per the USB 2.0 specification.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and design considerations not consolidated on the manufacturer datasheet, providing practical sourcing and engineering context beyond the device summary.
חלופות תחליף ישיר עבור PIC32MX370F512L-V/PF — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MX370F512L-V/PF (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Core Architecture, Parallel Master Port (PMP), Operating Temperature Range.
PIC32MX370F512L-I/PF
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX370F512LT-V/PF
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX470F512L-V/PF
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX270F512L-V/PF
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX170F512L-V/PF
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX370F512L-V/PF דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Maximum Clock Speed | 120 MHz (up to 150 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Boot Flash | 12 KB |
| Supply Voltage Range | 2.3 V to 3.6 V |
| טווח טמפרטורת פעולה | -40C to +105C (V grade) |
| מארז | 100-pin TQFP (14x14 mm) |
| ADC | 10-bit, 1 MSPS, up to 28 channels |
| Analog Comparators | 2 |
| SPI/I2S | 2 |
| I2C | 2 |
| UART | 2 |
| USB | USB 2.0 Full-Speed OTG |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes |
| Touch (CTMU) | Yes |
| Code Compression | MIPS16e (up to 40% smaller code) |
| AEC-Q100 | Qualified |
| RoHS | Compliant |
| סוג הרכבה | Surface Mount |
| MSL | 3 |
מדריך תצורת פינים של PIC32MX370F512L-V/PF 100-pin tqfp (14x14 mm)
תצורת פינים עבור PIC32MX370F512L-V/PF (מארזת 100-pin tqfp (14x14 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור PIC32MX370F512L-V/PF.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
PIC32MX370F512L-V/PF מתאים עבור 6 יישוםs: Automotive Infotainment HMI Panel, USB HID / Composite Device, Audio Processing Front-End, Industrial Control with Capacitive Touch, Low-Cost Graphics TFT Driver Board, Body Control Module (Automotive BCM).
Automotive Infotainment HMI Panel
The PIC32MX370F512L-V/PF is well suited for automotive infotainment HMI panels thanks to its 120 MHz MIPS32 M4K core, 100-pin TQFP, AEC-Q100 qualification, and integrated Parallel Master Port for driving TFT LCDs directly. With 512 KB Flash and 128 KB SRAM it comfortably holds graphics assets, font tables, and the MPLAB Harmony graphics library. The 2x I2S interfaces support external audio DACs for premium in-cabin audio. Compared with a Cortex-M0+ solution, the 32-bit MIPS core executes GUI state machines 2-3x faster at the same MHz, improving touch responsiveness and animation smoothness.
מומלץ
USB HID / Composite Device
The PIC32MX370F512L-V/PF integrates a USB 2.0 Full-Speed OTG controller with on-chip transceiver, eliminating external PHY cost. Its 120 MHz MIPS core plus 128 KB SRAM executes the Microchip USB stack (HID, CDC, MSD, composite) at full USB FS throughput without timing bottlenecks. Per the Microchip datasheet, the device supports Host, Device, and OTG roles, enabling USB event-based designs. Compared with software-bit-banged USB on smaller MCUs, the integrated controller achieves deterministic latency and frees CPU cycles for the application task, making it ideal for USB keyboard/joystick/gamepad products.
מומלץ
Audio Processing Front-End
The PIC32MX370F512L-V/PF provides two dedicated SPI/I2S interfaces that connect directly to audio codecs (e.g., DACs and ADCs) without glue logic. Its 120 MHz core and MIPS16e instruction set can run lightweight DSP algorithms (EQ, mixing, dynamic range compression) while the I2S ports stream 16/24-bit audio at 48 kHz. The 128 KB SRAM provides comfortable buffering for 10-20 ms of audio at typical frame sizes. Compared with a Cortex-M0 solution, the MIPS M4K core offers higher DMIPS/MHz, enabling more sophisticated audio processing at lower power.
מומלץ
Industrial Control with Capacitive Touch
The PIC32MX370F512L-V/PF integrates the CTMU (Charge Time Measurement Unit) peripheral that implements 4-wire resistive and capacitive touch sensing without an external touch controller IC. Combined with 512 KB Flash for touch firmware plus the 28-channel 10-bit ADC, the MCU can scan 10-20 touch keys/electrodes in real time. Per the Microchip datasheet, the CTMU is supported by the MPLAB Harmony Touch library. Compared with discrete touch controllers, the integrated approach saves $1-2 per node in industrial control panels and reduces PCB area.
מומלץ
Low-Cost Graphics TFT Driver Board
The PIC32MX370F512L-V/PF drives small TFT displays (3.5 inch to 5 inch QVGA/WQVGA) via its integrated Parallel Master Port (PMP) at 8/16-bit widths. The 120 MHz core and 128 KB SRAM are sufficient for framebuffer-less rendering of icons, fonts, and simple animations. Per Microchip documentation, the PMP supports up to 8 MP/s sustained throughput, adequate for mid-sized TFTs. Compared with external display controllers, the integrated PMP eliminates $2-3 of BOM cost and simplifies the schematic.
מומלץ
Body Control Module (Automotive BCM)
The PIC32MX370F512L-V/PF is AEC-Q100 qualified and runs from -40C to +105C, fitting body control modules managing lighting, wipers, locks, and mirror actuators. Its 2x UART and 2x I2C interfaces support LIN-bus transceivers, switches, and sensor modules. The 512 KB Flash holds the full BCM application plus bootloader; 128 KB SRAM supports real-time event scheduling. Compared with discrete 8/16-bit BCM solutions, the 32-bit MIPS core consolidates multiple functions onto one MCU, reducing BOM cost by $1-2.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MX370F512L-V/PF — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MX370F512L-I/PF | PIC32MX370F512LT-V/PF | PIC32MX470F512L-V/PF | PIC32MX270F512L-V/PF | PIC32MX170F512L-V/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same |
| Core / Max Clock | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Temperature Grade | V (-40C to +105C) | I (-40C to +85C) | V (-40C to +105C) | V (-40C to +105C) | V (-40C to +105C) | V (-40C to +105C) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
מבדילים עיקריים
- AEC-Q100 V temperature grade for automotive use (לעומתPIC32MX370F512L-I/PF)
- Tray packaging for prototyping and low-volume production (לעומתPIC32MX370F512LT-V/PF)
- MX370 family balances performance and peripheral count vs higher-end MX470 (לעומתPIC32MX470F512L-V/PF)
הערות תכנון
Estimated: the PIC32MX370F512L-V/PF draws approximately 25 mA active at 120 MHz with all peripherals on and 8 mA in Sleep mode per the family datasheet. Decouple each VDD/VSS pair with 0.1 uF X7R ceramic placed within 5 mm of the pin, plus a 10 uF bulk near the regulator. Use a low-noise LDO such as the MCP1700 for the analog AVDD rail to maximize ADC SNR.
Route the USB D+ and D- traces as a 90-ohm differential pair with continuous reference ground plane underneath, per the USB 2.0 specification. Keep total D+/D- trace length under 50 mm and avoid splitting the ground plane beneath them. Place the USB connector shield-to-ground capacitors (4.7 uF to 10 uF) close to the connector body for ESD mitigation.
Estimated: at 120 MHz and full peripheral utilization, the TQFP-100 package dissipates approximately 1 W worst-case. With a theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, this yields a 50C junction temperature rise above ambient. In enclosed automotive enclosures, derate accordingly or add a thermal copper pour (at least 1 sq inch) on the top side connected to the thermal pad area.
Do not skip the 12 KB boot Flash configuration words or the PLL setup - the device will not boot without correct FPLLMULT/FPLLODIV values. Ensure VUSB pin is supplied (typically 3.3 V from regulator) even if USB is unused, per the family datasheet. Use the Open-Drain configuration on I2C lines with 4.7 kohm pull-ups to 3.3 V; 5V pull-ups exceed absolute maximum ratings on the I/O cells.
מידע על תאימות
AEC-Q100 qualified per Microchip PIC32MX370 product page and family datasheet DS60001185. RoHS and REACH compliance confirmed by Microchip product environmental documentation. Lead-free and halogen-free per Microchip packaging specifications.
