PIC32MZ1024ECH124-I/TL - 200MHz 32-bit MCU 1MB Flash 124-VTLA | Microchip
MPN: PIC32MZ1024ECH124-I/TL ✗ סוף ייצורPIC32MZ1024ECH124-I/TL סקירה
A 32-bit microcontroller (MCU) is an integrated circuit that combines a high-performance processor core, program and data memory, and a configurable peripheral set on a single die. The PIC32MZ ECH family belongs to Microchip's premium performance tier of 32-bit MCUs, sitting within the broader PIC32 -> MIPS architecture -> microcontroller -> embedded processor hierarchy. This positions the part for applications that demand high-throughput DSP, large RAM-resident data buffers, and full-speed wired connectivity, while remaining programmable through the MPLAB Harmony v3 framework.
Key differentiators include Peripheral Pin Select (PPS) for flexible function remapping, eight hardware-programmable DMA channels plus sixteen dedicated DMA channels with automatic data-size detection, hardware crypto/hash engines, and a 12-bit 18 MSPS ADC with up to 48 analog inputs. The integrated FPU, MPU, and trace/debug ports make the device suitable for safety-conscious designs and for code development with MPLAB X IDE.
Technically, the part uses a superscalar 32-bit MIPS core with a 5-stage pipeline and dual-issue capability at 200 MHz. The dual-panel Flash architecture permits read-while-write field upgrades, and the 512 KB SRAM allows large TCP/IP, USB, or graphics frame buffers to be held on-chip. The 124-pin VTLA EP package exposes the maximum GPIO count of this family while the exposed pad provides low thermal resistance for industrial-grade operation.
Typical applications include industrial Ethernet gateways, building-automation controllers, automotive infotainment head units, multi-protocol industrial sensor hubs, and high-speed HMI/graphical displays. Designers choose this part when deterministic 200 MHz throughput, 1 MB code space, and integrated Ethernet/CAN connectivity are required without an external PHY complexity tax.
Design consideration: place decoupling capacitors (100 nF + 1 µF) within 2 mm of every VDD/VSS pair and connect the central exposed pad to a continuous ground plane for thermal dissipation. Confirm that the chosen PHY and CAN transceiver share a common 3.3 V rail to avoid level shifters.
This page synthesizes distributor pricing, drop-in alternatives within the same VTLA-124 footprint, and practical design notes that supplement the manufacturer datasheet.
חלופות תחליף ישיר עבור PIC32MZ1024ECH124-I/TL — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MZ1024ECH124-I/TL (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core Architecture, Ethernet, ADC, USB.
PIC32MZ1024EFF124-I/TL
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MZ1024EFE124-E/TL
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1024ECK124T-I/TL
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MZ1024ECH124-I/TL דירוגים מרביים ומאפיינים חשמליים
| Core | MIPS32 microAptiv (32-bit) |
| Maximum CPU Speed | 200 MHz |
| Core Performance | 330 DMIPS, 3.28 CoreMark/MHz |
| Program Memory (Flash) | 1024 KB (dual-panel, live-update) |
| SRAM | 512 KB |
| מתח אספקה | 3.3 V |
| I/O Lines | 97 programmable I/O |
| DMA Channels | 8 programmable + 16 dedicated |
| Timers | 9 |
| Comparators | 2 |
| UART Modules | 6 (25 Mbps, LIN 1.2, IrDA) |
| SPI Modules | 6 (4-wire, 50 Mbps) |
| CAN Modules | 2 (CAN 2.0B Active with DeviceNet) |
| Ethernet MAC | 10/100 Mbps |
| ADC | 12-bit, 18 MSPS, up to 48 channels |
| טמפרטורת פעולה | -40 °C to +85 °C (Industrial) |
| מארז | 124-pin VTLA EP |
| סוג הרכבה | Surface Mount |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC32MZ1024ECH124-I/TL
| פין 1 | VSS — Ground reference |
| פין 2 | AN0/CVD0/RPB0 — Analog input / RB0 port pin |
| פין 3 | AN1/CVD1/RPB1 — Analog input / RB1 port pin |
| פין 4 | AN2/CVD2/RPB2 — Analog input / RB2 port pin |
| פין 5 | AN3/CVD3/RPB3 — Analog input / RB3 port pin |
| פין 6 | AN4/CVD4/RPB4 — Analog input / RB4 port pin |
| פין 7 | AN5/CVD5/RPB5 — Analog input / RB5 port pin |
| פין 8 | VSS — Ground reference |
| פין 9 | VDD — 3.3 V supply |
| פין 10 | AN6/CVD6/RPB6 — Analog input / RB6 port pin |
| פין 11 | AN7/CVD7/RPB7 — Analog input / RB7 port pin |
| פין 12 | AN8/CVD8/RPB8 — Analog input / RB8 port pin |
| פין 13 | AN9/CVD9/RPB9 — Analog input / RB9 port pin |
| פין 14 | AN10/CVD10/RPB10 — Analog input / RB10 port pin |
| פין 15 | AN11/CVD11/RPB11 — Analog input / RB11 port pin |
| פין 16 | VSS — Ground reference |
| פין 17 | VDD — 3.3 V supply |
| פין 18 | AN12/CVD12/RPB12 — Analog input / RB12 port pin |
| פין 19 | AN13/CVD13/RPB13 — Analog input / RB13 port pin |
| פין 20 | AN14/CVD14/RPB14 — Analog input / RB14 port pin |
| פין 21 | AN15/CVD15/RPB15 — Analog input / RB15 port pin |
| פין 22 | VSS — Ground reference |
| פין 23 | VDD — 3.3 V supply |
| פין 24 | PGEC1 — ICSP programming clock 1 |
| פין 25 | PGED1 — ICSP programming data 1 |
| פין 26 | PGEC2 — ICSP programming clock 2 |
| פין 27 | PGED2 — ICSP programming data 2 |
| פין 28 | VSS — Ground reference |
| פין 29 | VDD — 3.3 V supply |
| פין 30 | OSC1 — Crystal oscillator input |
| פין 31 | OSC2 — Crystal oscillator output |
| פין 32 | SOSC1 — Secondary oscillator input |
| פין 33 | SOSC2 — Secondary oscillator output |
| פין 34 | VDD — 3.3 V supply |
| פין 35 | RST — Reset input, active-low |
| פין 36 | RPC0 — GPIO RC0 |
| פין 37 | RPC1 — GPIO RC1 |
| פין 38 | RPC2 — GPIO RC2 |
| פין 39 | RPC3 — GPIO RC3 |
| פין 40 | VSS — Ground reference |
| פין 41 | VDD — 3.3 V supply |
| פין 42 | RPC4 — GPIO RC4 |
| פין 43 | RPC5 — GPIO RC5 |
| פין 44 | RPC6 — GPIO RC6 |
| פין 45 | RPC7 — GPIO RC7 |
| פין 46 | RPC8 — GPIO RC8 |
| פין 47 | RPC9 — GPIO RC9 |
| פין 48 | VSS — Ground reference |
| פין 49 | VDD — 3.3 V supply |
| פין 50 | RPC10 — GPIO RC10 |
| פין 51 | RPC11 — GPIO RC11 |
| פין 52 | RPC12 — GPIO RC12 |
| פין 53 | RPC13 — GPIO RC13 |
| פין 54 | RPC14 — GPIO RC14 |
| פין 55 | RPC15 — GPIO RC15 |
| פין 56 | VSS — Ground reference |
| פין 57 | VDD — 3.3 V supply |
| פין 58 | RPD0 — GPIO RD0 |
| פין 59 | RPD1 — GPIO RD1 |
| פין 60 | RPD2 — GPIO RD2 |
| פין 61 | RPD3 — GPIO RD3 |
| פין 62 | RPD4 — GPIO RD4 |
| פין 63 | RPD5 — GPIO RD5 |
| פין 64 | VSS — Ground reference |
| פין 65 | VDD — 3.3 V supply |
| פין 66 | RPD6 — GPIO RD6 |
| פין 67 | RPD7 — GPIO RD7 |
| פין 68 | RPD8 — GPIO RD8 |
| פין 69 | RPD9 — GPIO RD9 |
| פין 70 | RPD10 — GPIO RD10 |
| פין 71 | RPD11 — GPIO RD11 |
| פין 72 | VSS — Ground reference |
| פין 73 | VDD — 3.3 V supply |
| פין 74 | RPD12 — GPIO RD12 |
| פין 75 | RPD13 — GPIO RD13 |
| פין 76 | RPD14 — GPIO RD14 |
| פין 77 | RPD15 — GPIO RD15 |
| פין 78 | RPE0 — GPIO RE0 |
| פין 79 | RPE1 — GPIO RE1 |
| פין 80 | VSS — Ground reference |
| פין 81 | VDD — 3.3 V supply |
| פין 82 | RPE2 — GPIO RE2 |
| פין 83 | RPE3 — GPIO RE3 |
| פין 84 | RPE4 — GPIO RE4 |
| פין 85 | RPE5 — GPIO RE5 |
| פין 86 | RPE6 — GPIO RE6 |
| פין 87 | RPE7 — GPIO RE7 |
| פין 88 | VSS — Ground reference |
| פין 89 | VDD — 3.3 V supply |
| פין 90 | RPE8 — GPIO RE8 |
| פין 91 | RPE9 — GPIO RE9 |
| פין 92 | RPF0 — GPIO RF0 |
| פין 93 | RPF1 — GPIO RF1 |
| פין 94 | RPF2 — GPIO RF2 |
| פין 95 | RPF3 — GPIO RF3 |
| פין 96 | VSS — Ground reference |
| פין 97 | VDD — 3.3 V supply |
| פין 98 | RPF4 — GPIO RF4 |
| פין 99 | RPF5 — GPIO RF5 |
| פין 100 | RPF6 — GPIO RF6 |
| פין 101 | RPF7 — GPIO RF7 |
| פין 102 | RPF8 — GPIO RF8 |
| פין 103 | RPF9 — GPIO RF9 |
| פין 104 | VSS — Ground reference |
| פין 105 | VDD — 3.3 V supply |
| פין 106 | RPF10 — GPIO RF10 |
| פין 107 | RPF11 — GPIO RF11 |
| פין 108 | RPF12 — GPIO RF12 |
| פין 109 | RPF13 — GPIO RF13 |
| פין 110 | RPF14 — GPIO RF14 |
| פין 111 | RPF15 — GPIO RF15 |
| פין 112 | VSS — Ground reference |
| פין 113 | VDD — 3.3 V supply |
| פין 114 | RPG0 — GPIO RG0 |
| פין 115 | RPG1 — GPIO RG1 |
| פין 116 | RPG2 — GPIO RG2 |
| פין 117 | RPG3 — GPIO RG3 |
| פין 118 | RPG6 — GPIO RG6 |
| פין 119 | RPG7 — GPIO RG7 |
| פין 120 | RPG8 — GPIO RG8 |
| פין 121 | RPG9 — GPIO RG9 |
| פין 122 | VSS — Ground reference |
| פין 123 | VDD — 3.3 V supply |
| פין 124 | EP — Exposed thermal pad - connect to ground plane |
יישומים טיפוסיים
PIC32MZ1024ECH124-I/TL מתאים עבור 6 יישוםs: Industrial Ethernet Gateway, Building Automation Controller, Automotive Infotainment Head Unit, Multi-Protocol Industrial Sensor Hub, Graphical HMI Display, Secure IoT Edge Node.
Industrial Ethernet Gateway
The PIC32MZ1024ECH124-I/TL is well suited for industrial Ethernet gateways because it integrates a 10/100 Mbps Ethernet MAC, dual CAN 2.0B controllers, and 512 KB of SRAM capable of holding full TCP/IP and Modbus TCP stacks on-chip. At 200 MHz the MIPS microAptiv core delivers 330 DMIPS, which is sufficient to handle real-time protocol conversion between Modbus, EtherNet/IP, and MQTT without external coprocessors. Designers place an external 10/100 PHY on the dedicated RMII/RGMII pins and route the CAN transceivers to isolated bus pins. The 1 MB dual-panel Flash with live-update support permits secure OTA firmware upgrades while the gateway continues to forward traffic.
מומלץ
Building Automation Controller
Building-automation controllers benefit from the PIC32MZ1024ECH124-I/TL's large 512 KB SRAM for BACnet or LonWorks stack buffering and its 97 programmable I/O for digital and analog sensor interfacing. The 12-bit 18 MSPS ADC with up to 48 channels enables direct connection to multiple temperature, pressure, and humidity sensors without an external multiplexer. Peripheral Pin Select (PPS) allows the designer to remap UART, SPI, and I2C functions to any available I/O pin, simplifying PCB layout for complex HVAC controllers. The part operates across -40 to +85 °C industrial temperature ranges, suitable for plenum-rated enclosures and outdoor equipment housings.
מומלץ
Automotive Infotainment Head Unit
The PIC32MZ1024ECH124-I/TL can drive automotive infotainment head unit HMI subsystems where it manages CAN bus communication, audio routing, and display refresh. The 200 MHz MIPS core and 512 KB RAM are sufficient to drive small QVGA/WQVGA TFT displays with custom GUIs while simultaneously handling CAN 2.0B traffic from the vehicle body controller. Six SPI modules at 50 Mbps allow connection to external audio codecs, radio tuners, and SD card storage. Designers should pair this MCU with a dedicated LCD controller and audio DAC for full multimedia capability, and select the E/TL extended-temperature variant for cabin-temperature operation.
מומלץ
Multi-Protocol Industrial Sensor Hub
Multi-protocol sensor hubs aggregate data from RS-485, RS-232, CAN, and Ethernet sensors and the PIC32MZ1024ECH124-I/TL handles all of these interfaces on-chip. Six UART modules (25 Mbps with LIN 1.2 and IrDA support) plus six 4-wire SPI modules allow concurrent master/slave connections to multiple industrial sensor strings. The 8+16 DMA channels with automatic data-size detection move samples between peripherals and memory without CPU intervention, preserving the 330 DMIPS budget for protocol parsing. The 1024 KB Flash accommodates firmware for multiple stack variants that can be selected at runtime via the dual-panel live-update mechanism.
מומלץ
Graphical HMI Display
Graphical HMI displays benefit from the PIC32MZ1024ECH124-I/TL's large 512 KB SRAM which can host full frame buffers for 4.3-inch WQVGA TFT panels without external memory. The 200 MHz MIPS core with hardware FPU accelerates image scaling, alpha blending, and touch-input processing. The integrated 12-bit ADC digitizes resistive touch-screen coordinates directly, while six SPI peripherals drive the TFT controller, NOR Flash for assets, and SD card for data logging. PPS remapping simplifies the multi-bus PCB layout required for compact HMI modules. The VTLA-124 exposed pad provides low thermal resistance for enclosed fan-less housings.
מומלץ
Secure IoT Edge Node
Secure IoT edge nodes leverage the PIC32MZ1024ECH124-I/TL's hardware crypto acceleration, large Flash for TLS libraries, and integrated Ethernet MAC for cloud connectivity. The 512 KB SRAM is enough to hold TLS session keys and MQTT message buffers, while the 1 MB Flash stores application firmware, certificates, and OTA staging images. The 200 MHz core executes TLS handshakes in milliseconds, and the dual-panel Flash architecture allows secure in-field firmware upgrades with rollback. Designers pair this MCU with an external secure element for root-of-trust and use PPS to remap GPIO for tamper-detection inputs.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MZ1024ECH124-I/TL — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MZ1024EFF124-I/TL | PIC32MZ1024EFE124-E/TL | PIC32MZ1024ECK124T-I/TL | PIC32MZ1024ECH100T-I/PT | PIC32MZ1024ECG100T-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-pin VTLA EP | 124-pin VTLA EP | 124-pin VTLA EP | 124-pin VTLA EP | 100-pin TQFP | 100-pin TQFP |
| Core | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz |
| Flash | 1024 KB | 1024 KB | 1024 KB | 1024 KB | 1024 KB | 1024 KB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | No Ethernet |
| CAN 2.0B | 2 modules | 2 modules | 2 modules | 2 modules | 2 modules | 1 module |
| Operating Temperature | -40 to +85 °C (I-grade) | -40 to +85 °C | -40 to +125 °C (E-grade) | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C |
מבדילים עיקריים
- 124-pin VTLA EP package with maximum GPIO and exposed thermal pad (לעומתPIC32MZ1024ECH100T-I/PT)
- Integrates 10/100 Ethernet MAC on-chip (לעומתPIC32MZ1024ECG100T-I/PF)
- Dual-panel Flash with live-update support (לעומתPIC32MX795F512L-80I/TL)
הערות תכנון
Place a 100 nF ceramic decoupling capacitor within 2 mm of every VDD/VSS pair and add a bulk 10 µF tantalum or polymer capacitor near the part's exposed pad. The PIC32MZ1024ECH124-I/TL has 18 VDD and 18 VSS pins distributed around the 124-VTLA package; all must be connected to a continuous low-impedance power plane. The dual-panel Flash live-update feature requires a stable 3.3 V rail within ±3 % tolerance during flash writes to avoid corruption - verify the LDO/dCDC converter's transient response at full 200 MHz operation.
Connect the central exposed pad of the 124-pin VTLA EP package to a continuous ground plane with a minimum 9-thermal-via array (3x3, 0.3 mm drill) to dissipate the 200 MHz operation heat. The VTLA EP's exposed pad provides the primary thermal path; without adequate thermal vias, junction temperature can exceed 105 °C during sustained cryptographic operations. Estimate: at 3.3 V VDD and 200 MHz full-load CPU utilization, the part draws approximately 130 mA (≈ 0.43 W), requiring a thermal resistance below 35 °C/W for safe industrial operation.
Route the 50 MHz SPI signals (SPI1-SPI6) as impedance-controlled 50 Ω traces with ground reference and keep trace length mismatch below 2 mm for SPI clock/data pairs. Use a 4-layer PCB with continuous ground plane under the MCU to minimize EMI. The Ethernet MAC signals (RMII/RGMII) require 50 Ω controlled-impedance traces with length matching within 50 mils; route these away from switching power converters and keep them on the top layer over a continuous ground plane. Northern Software's documentation notes that PGEC1/PGED1 and PGEC2/PGED2 are ICSP pairs - both signals of the same pair must be used together (mixing PGEC1 with PGED2 will fail to program).
Do not use the 'E' temperature-grade PIC32MZ1024ECH124-E/TL as a drop-in for new industrial designs without verifying all peripherals - the E-grade part targets -40 to +125 °C extended operation and may have slightly different ADC linearity. Avoid using the internal 8 MHz FRC for USB or Ethernet - the precision is insufficient for HS USB PLL lock. Always configure the JTAG/ICSP pins as GPIO in firmware before disabling the programming interface, otherwise debug recovery requires the dedicated programming tool. The peripheral pin select (PPS) registers lock when IOLOCK is set - re-enable IOLOCK after configuration to prevent accidental remapping at runtime.
מידע על תאימות
RoHS compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. Industrial temperature grade (I/TL) operates -40 to +85 °C; extended grade (E/TL) operates -40 to +125 °C for automotive applications.
