PIC32MZ1024ECH124-I/TL - 200MHz 32-bit MCU 1MB Flash 124-VTLA | Microchip
Référence : PIC32MZ1024ECH124-I/TL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1 160,00 |
| 500 | $10.4 | $5 200,00 |
| 1 000 | $9.3 | $9 300,00 |
PIC32MZ1024ECH124-I/TL Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a high-performance processor core, program and data memory, and a configurable peripheral set on a single die. The PIC32MZ ECH family belongs to Microchip's premium performance tier of 32-bit MCUs, sitting within the broader PIC32 -> MIPS architecture -> microcontroller -> embedded processor hierarchy. This positions the part for applications that demand high-throughput DSP, large RAM-resident data buffers, and full-speed wired connectivity, while remaining programmable through the MPLAB Harmony v3 framework.
Key differentiators include Peripheral Pin Select (PPS) for flexible function remapping, eight hardware-programmable DMA channels plus sixteen dedicated DMA channels with automatic data-size detection, hardware crypto/hash engines, and a 12-bit 18 MSPS ADC with up to 48 analog inputs. The integrated FPU, MPU, and trace/debug ports make the device suitable for safety-conscious designs and for code development with MPLAB X IDE.
Technically, the part uses a superscalar 32-bit MIPS core with a 5-stage pipeline and dual-issue capability at 200 MHz. The dual-panel Flash architecture permits read-while-write field upgrades, and the 512 KB SRAM allows large TCP/IP, USB, or graphics frame buffers to be held on-chip. The 124-pin VTLA EP package exposes the maximum GPIO count of this family while the exposed pad provides low thermal resistance for industrial-grade operation.
Typical applications include industrial Ethernet gateways, building-automation controllers, automotive infotainment head units, multi-protocol industrial sensor hubs, and high-speed HMI/graphical displays. Designers choose this part when deterministic 200 MHz throughput, 1 MB code space, and integrated Ethernet/CAN connectivity are required without an external PHY complexity tax.
Design consideration: place decoupling capacitors (100 nF + 1 µF) within 2 mm of every VDD/VSS pair and connect the central exposed pad to a continuous ground plane for thermal dissipation. Confirm that the chosen PHY and CAN transceiver share a common 3.3 V rail to avoid level shifters.
This page synthesizes distributor pricing, drop-in alternatives within the same VTLA-124 footprint, and practical design notes that supplement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1024ECH124-I/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024ECH124-I/TL (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Ethernet, ADC, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFF124-I/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.91 / unité
Voir la fiche technique →PIC32MZ1024ECK124T-I/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024ECH124-I/TL Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv (32-bit) |
| Maximum CPU Speed | 200 MHz |
| Core Performance | 330 DMIPS, 3.28 CoreMark/MHz |
| Program Memory (Flash) | 1024 KB (dual-panel, live-update) |
| SRAM | 512 KB |
| Tension d'alimentation | 3.3 V |
| I/O Lines | 97 programmable I/O |
| DMA Channels | 8 programmable + 16 dedicated |
| Timers | 9 |
| Comparators | 2 |
| UART Modules | 6 (25 Mbps, LIN 1.2, IrDA) |
| SPI Modules | 6 (4-wire, 50 Mbps) |
| CAN Modules | 2 (CAN 2.0B Active with DeviceNet) |
| Ethernet MAC | 10/100 Mbps |
| ADC | 12-bit, 18 MSPS, up to 48 channels |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 124-pin VTLA EP |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024ECH124-I/TL
| Broche 1 | VSS — Ground reference |
| Broche 2 | AN0/CVD0/RPB0 — Analog input / RB0 port pin |
| Broche 3 | AN1/CVD1/RPB1 — Analog input / RB1 port pin |
| Broche 4 | AN2/CVD2/RPB2 — Analog input / RB2 port pin |
| Broche 5 | AN3/CVD3/RPB3 — Analog input / RB3 port pin |
| Broche 6 | AN4/CVD4/RPB4 — Analog input / RB4 port pin |
| Broche 7 | AN5/CVD5/RPB5 — Analog input / RB5 port pin |
| Broche 8 | VSS — Ground reference |
| Broche 9 | VDD — 3.3 V supply |
| Broche 10 | AN6/CVD6/RPB6 — Analog input / RB6 port pin |
| Broche 11 | AN7/CVD7/RPB7 — Analog input / RB7 port pin |
| Broche 12 | AN8/CVD8/RPB8 — Analog input / RB8 port pin |
| Broche 13 | AN9/CVD9/RPB9 — Analog input / RB9 port pin |
| Broche 14 | AN10/CVD10/RPB10 — Analog input / RB10 port pin |
| Broche 15 | AN11/CVD11/RPB11 — Analog input / RB11 port pin |
| Broche 16 | VSS — Ground reference |
| Broche 17 | VDD — 3.3 V supply |
| Broche 18 | AN12/CVD12/RPB12 — Analog input / RB12 port pin |
| Broche 19 | AN13/CVD13/RPB13 — Analog input / RB13 port pin |
| Broche 20 | AN14/CVD14/RPB14 — Analog input / RB14 port pin |
| Broche 21 | AN15/CVD15/RPB15 — Analog input / RB15 port pin |
| Broche 22 | VSS — Ground reference |
| Broche 23 | VDD — 3.3 V supply |
| Broche 24 | PGEC1 — ICSP programming clock 1 |
| Broche 25 | PGED1 — ICSP programming data 1 |
| Broche 26 | PGEC2 — ICSP programming clock 2 |
| Broche 27 | PGED2 — ICSP programming data 2 |
| Broche 28 | VSS — Ground reference |
| Broche 29 | VDD — 3.3 V supply |
| Broche 30 | OSC1 — Crystal oscillator input |
| Broche 31 | OSC2 — Crystal oscillator output |
| Broche 32 | SOSC1 — Secondary oscillator input |
| Broche 33 | SOSC2 — Secondary oscillator output |
| Broche 34 | VDD — 3.3 V supply |
| Broche 35 | RST — Reset input, active-low |
| Broche 36 | RPC0 — GPIO RC0 |
| Broche 37 | RPC1 — GPIO RC1 |
| Broche 38 | RPC2 — GPIO RC2 |
| Broche 39 | RPC3 — GPIO RC3 |
| Broche 40 | VSS — Ground reference |
| Broche 41 | VDD — 3.3 V supply |
| Broche 42 | RPC4 — GPIO RC4 |
| Broche 43 | RPC5 — GPIO RC5 |
| Broche 44 | RPC6 — GPIO RC6 |
| Broche 45 | RPC7 — GPIO RC7 |
| Broche 46 | RPC8 — GPIO RC8 |
| Broche 47 | RPC9 — GPIO RC9 |
| Broche 48 | VSS — Ground reference |
| Broche 49 | VDD — 3.3 V supply |
| Broche 50 | RPC10 — GPIO RC10 |
| Broche 51 | RPC11 — GPIO RC11 |
| Broche 52 | RPC12 — GPIO RC12 |
| Broche 53 | RPC13 — GPIO RC13 |
| Broche 54 | RPC14 — GPIO RC14 |
| Broche 55 | RPC15 — GPIO RC15 |
| Broche 56 | VSS — Ground reference |
| Broche 57 | VDD — 3.3 V supply |
| Broche 58 | RPD0 — GPIO RD0 |
| Broche 59 | RPD1 — GPIO RD1 |
| Broche 60 | RPD2 — GPIO RD2 |
| Broche 61 | RPD3 — GPIO RD3 |
| Broche 62 | RPD4 — GPIO RD4 |
| Broche 63 | RPD5 — GPIO RD5 |
| Broche 64 | VSS — Ground reference |
| Broche 65 | VDD — 3.3 V supply |
| Broche 66 | RPD6 — GPIO RD6 |
| Broche 67 | RPD7 — GPIO RD7 |
| Broche 68 | RPD8 — GPIO RD8 |
| Broche 69 | RPD9 — GPIO RD9 |
| Broche 70 | RPD10 — GPIO RD10 |
| Broche 71 | RPD11 — GPIO RD11 |
| Broche 72 | VSS — Ground reference |
| Broche 73 | VDD — 3.3 V supply |
| Broche 74 | RPD12 — GPIO RD12 |
| Broche 75 | RPD13 — GPIO RD13 |
| Broche 76 | RPD14 — GPIO RD14 |
| Broche 77 | RPD15 — GPIO RD15 |
| Broche 78 | RPE0 — GPIO RE0 |
| Broche 79 | RPE1 — GPIO RE1 |
| Broche 80 | VSS — Ground reference |
| Broche 81 | VDD — 3.3 V supply |
| Broche 82 | RPE2 — GPIO RE2 |
| Broche 83 | RPE3 — GPIO RE3 |
| Broche 84 | RPE4 — GPIO RE4 |
| Broche 85 | RPE5 — GPIO RE5 |
| Broche 86 | RPE6 — GPIO RE6 |
| Broche 87 | RPE7 — GPIO RE7 |
| Broche 88 | VSS — Ground reference |
| Broche 89 | VDD — 3.3 V supply |
| Broche 90 | RPE8 — GPIO RE8 |
| Broche 91 | RPE9 — GPIO RE9 |
| Broche 92 | RPF0 — GPIO RF0 |
| Broche 93 | RPF1 — GPIO RF1 |
| Broche 94 | RPF2 — GPIO RF2 |
| Broche 95 | RPF3 — GPIO RF3 |
| Broche 96 | VSS — Ground reference |
| Broche 97 | VDD — 3.3 V supply |
| Broche 98 | RPF4 — GPIO RF4 |
| Broche 99 | RPF5 — GPIO RF5 |
| Broche 100 | RPF6 — GPIO RF6 |
| Broche 101 | RPF7 — GPIO RF7 |
| Broche 102 | RPF8 — GPIO RF8 |
| Broche 103 | RPF9 — GPIO RF9 |
| Broche 104 | VSS — Ground reference |
| Broche 105 | VDD — 3.3 V supply |
| Broche 106 | RPF10 — GPIO RF10 |
| Broche 107 | RPF11 — GPIO RF11 |
| Broche 108 | RPF12 — GPIO RF12 |
| Broche 109 | RPF13 — GPIO RF13 |
| Broche 110 | RPF14 — GPIO RF14 |
| Broche 111 | RPF15 — GPIO RF15 |
| Broche 112 | VSS — Ground reference |
| Broche 113 | VDD — 3.3 V supply |
| Broche 114 | RPG0 — GPIO RG0 |
| Broche 115 | RPG1 — GPIO RG1 |
| Broche 116 | RPG2 — GPIO RG2 |
| Broche 117 | RPG3 — GPIO RG3 |
| Broche 118 | RPG6 — GPIO RG6 |
| Broche 119 | RPG7 — GPIO RG7 |
| Broche 120 | RPG8 — GPIO RG8 |
| Broche 121 | RPG9 — GPIO RG9 |
| Broche 122 | VSS — Ground reference |
| Broche 123 | VDD — 3.3 V supply |
| Broche 124 | EP — Exposed thermal pad - connect to ground plane |
Applications typiques
PIC32MZ1024ECH124-I/TL convient pour 6 applications: Industrial Ethernet Gateway, Building Automation Controller, Automotive Infotainment Head Unit, Multi-Protocol Industrial Sensor Hub, Graphical HMI Display, Secure IoT Edge Node.
Industrial Ethernet Gateway
The PIC32MZ1024ECH124-I/TL is well suited for industrial Ethernet gateways because it integrates a 10/100 Mbps Ethernet MAC, dual CAN 2.0B controllers, and 512 KB of SRAM capable of holding full TCP/IP and Modbus TCP stacks on-chip. At 200 MHz the MIPS microAptiv core delivers 330 DMIPS, which is sufficient to handle real-time protocol conversion between Modbus, EtherNet/IP, and MQTT without external coprocessors. Designers place an external 10/100 PHY on the dedicated RMII/RGMII pins and route the CAN transceivers to isolated bus pins. The 1 MB dual-panel Flash with live-update support permits secure OTA firmware upgrades while the gateway continues to forward traffic.
Recommandé
Building Automation Controller
Building-automation controllers benefit from the PIC32MZ1024ECH124-I/TL's large 512 KB SRAM for BACnet or LonWorks stack buffering and its 97 programmable I/O for digital and analog sensor interfacing. The 12-bit 18 MSPS ADC with up to 48 channels enables direct connection to multiple temperature, pressure, and humidity sensors without an external multiplexer. Peripheral Pin Select (PPS) allows the designer to remap UART, SPI, and I2C functions to any available I/O pin, simplifying PCB layout for complex HVAC controllers. The part operates across -40 to +85 °C industrial temperature ranges, suitable for plenum-rated enclosures and outdoor equipment housings.
Recommandé
Automotive Infotainment Head Unit
The PIC32MZ1024ECH124-I/TL can drive automotive infotainment head unit HMI subsystems where it manages CAN bus communication, audio routing, and display refresh. The 200 MHz MIPS core and 512 KB RAM are sufficient to drive small QVGA/WQVGA TFT displays with custom GUIs while simultaneously handling CAN 2.0B traffic from the vehicle body controller. Six SPI modules at 50 Mbps allow connection to external audio codecs, radio tuners, and SD card storage. Designers should pair this MCU with a dedicated LCD controller and audio DAC for full multimedia capability, and select the E/TL extended-temperature variant for cabin-temperature operation.
Recommandé
Multi-Protocol Industrial Sensor Hub
Multi-protocol sensor hubs aggregate data from RS-485, RS-232, CAN, and Ethernet sensors and the PIC32MZ1024ECH124-I/TL handles all of these interfaces on-chip. Six UART modules (25 Mbps with LIN 1.2 and IrDA support) plus six 4-wire SPI modules allow concurrent master/slave connections to multiple industrial sensor strings. The 8+16 DMA channels with automatic data-size detection move samples between peripherals and memory without CPU intervention, preserving the 330 DMIPS budget for protocol parsing. The 1024 KB Flash accommodates firmware for multiple stack variants that can be selected at runtime via the dual-panel live-update mechanism.
Recommandé
Graphical HMI Display
Graphical HMI displays benefit from the PIC32MZ1024ECH124-I/TL's large 512 KB SRAM which can host full frame buffers for 4.3-inch WQVGA TFT panels without external memory. The 200 MHz MIPS core with hardware FPU accelerates image scaling, alpha blending, and touch-input processing. The integrated 12-bit ADC digitizes resistive touch-screen coordinates directly, while six SPI peripherals drive the TFT controller, NOR Flash for assets, and SD card for data logging. PPS remapping simplifies the multi-bus PCB layout required for compact HMI modules. The VTLA-124 exposed pad provides low thermal resistance for enclosed fan-less housings.
Recommandé
Secure IoT Edge Node
Secure IoT edge nodes leverage the PIC32MZ1024ECH124-I/TL's hardware crypto acceleration, large Flash for TLS libraries, and integrated Ethernet MAC for cloud connectivity. The 512 KB SRAM is enough to hold TLS session keys and MQTT message buffers, while the 1 MB Flash stores application firmware, certificates, and OTA staging images. The 200 MHz core executes TLS handshakes in milliseconds, and the dual-panel Flash architecture allows secure in-field firmware upgrades with rollback. Designers pair this MCU with an external secure element for root-of-trust and use PPS to remap GPIO for tamper-detection inputs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024ECH124-I/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFF124-I/TL | PIC32MZ1024EFE124-E/TL | PIC32MZ1024ECK124T-I/TL | PIC32MZ1024ECH100T-I/PT | PIC32MZ1024ECG100T-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-pin VTLA EP | 124-pin VTLA EP | 124-pin VTLA EP | 124-pin VTLA EP | 100-pin TQFP | 100-pin TQFP |
| Core | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz | MIPS microAptiv 200 MHz |
| Flash | 1024 KB | 1024 KB | 1024 KB | 1024 KB | 1024 KB | 1024 KB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | No Ethernet |
| CAN 2.0B | 2 modules | 2 modules | 2 modules | 2 modules | 2 modules | 1 module |
| Operating Temperature | -40 to +85 °C (I-grade) | -40 to +85 °C | -40 to +125 °C (E-grade) | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C |
Principaux différenciateurs
- 124-pin VTLA EP package with maximum GPIO and exposed thermal pad (vs PIC32MZ1024ECH100T-I/PT)
- Integrates 10/100 Ethernet MAC on-chip (vs PIC32MZ1024ECG100T-I/PF)
- Dual-panel Flash with live-update support (vs PIC32MX795F512L-80I/TL)
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 2 mm of every VDD/VSS pair and add a bulk 10 µF tantalum or polymer capacitor near the part's exposed pad. The PIC32MZ1024ECH124-I/TL has 18 VDD and 18 VSS pins distributed around the 124-VTLA package; all must be connected to a continuous low-impedance power plane. The dual-panel Flash live-update feature requires a stable 3.3 V rail within ±3 % tolerance during flash writes to avoid corruption - verify the LDO/dCDC converter's transient response at full 200 MHz operation.
Connect the central exposed pad of the 124-pin VTLA EP package to a continuous ground plane with a minimum 9-thermal-via array (3x3, 0.3 mm drill) to dissipate the 200 MHz operation heat. The VTLA EP's exposed pad provides the primary thermal path; without adequate thermal vias, junction temperature can exceed 105 °C during sustained cryptographic operations. Estimate: at 3.3 V VDD and 200 MHz full-load CPU utilization, the part draws approximately 130 mA (≈ 0.43 W), requiring a thermal resistance below 35 °C/W for safe industrial operation.
Route the 50 MHz SPI signals (SPI1-SPI6) as impedance-controlled 50 Ω traces with ground reference and keep trace length mismatch below 2 mm for SPI clock/data pairs. Use a 4-layer PCB with continuous ground plane under the MCU to minimize EMI. The Ethernet MAC signals (RMII/RGMII) require 50 Ω controlled-impedance traces with length matching within 50 mils; route these away from switching power converters and keep them on the top layer over a continuous ground plane. Northern Software's documentation notes that PGEC1/PGED1 and PGEC2/PGED2 are ICSP pairs - both signals of the same pair must be used together (mixing PGEC1 with PGED2 will fail to program).
Do not use the 'E' temperature-grade PIC32MZ1024ECH124-E/TL as a drop-in for new industrial designs without verifying all peripherals - the E-grade part targets -40 to +125 °C extended operation and may have slightly different ADC linearity. Avoid using the internal 8 MHz FRC for USB or Ethernet - the precision is insufficient for HS USB PLL lock. Always configure the JTAG/ICSP pins as GPIO in firmware before disabling the programming interface, otherwise debug recovery requires the dedicated programming tool. The peripheral pin select (PPS) registers lock when IOLOCK is set - re-enable IOLOCK after configuration to prevent accidental remapping at runtime.
Informations de conformité
RoHS compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. Industrial temperature grade (I/TL) operates -40 to +85 °C; extended grade (E/TL) operates -40 to +125 °C for automotive applications.
