S912XET256BCAGR - 16-Bit 50MHz 256KB MCU | NXP
MPN: S912XET256BCAGR ✓ פעילS912XET256BCAGR סקירה
A microcontroller is a semiconductor device that integrates a processor core, program memory, data memory, peripherals, and interface circuitry into one component. The S12X family belongs to the HCS12 16-bit embedded-control hierarchy, combining higher processing performance than traditional 8-bit controllers with dedicated resources for automotive networking, timing, analog, communication, and safety-oriented control functions.
The verified source data identifies an S12X core, 50 MHz operating frequency, 256 KB flash organized as 256K x 8, and a 144-pin QFP package. Its automotive-qualified temperature range is -40°C to +85°C. These specifications make the device appropriate for body electronics, powertrain-adjacent controls, gateways, instrumentation, actuator management, and other systems requiring deterministic embedded processing.
The 50 MHz core provides the computational headroom needed for protocol handling, control-loop execution, diagnostics, and supervisory tasks. The 256 KB flash capacity allows larger embedded programs than small 8-bit controllers while retaining a conventional embedded-control software model. The 144-pin package provides access to a broad peripheral complement and allows simultaneous connection of sensors, actuators, communication transceivers, and power-management circuitry.
Typical applications include automotive body-control modules, transmission or powertrain interface controllers, motor-control supervisory circuits, instrument-cluster electronics, gateway modules, diagnostic equipment, and industrial automation controllers. In these systems, the MCU can execute periodic control algorithms while handling CAN-class network traffic, diagnostic services, input capture, timers, and external sensor signals.
Designers should preserve the exact 144-LQFP footprint, pin assignments, electrical limits, clock configuration, power requirements, and automotive qualification constraints from the manufacturer documentation. Decoupling, clock stability, signal integrity, thermal management, and production-programming provisions should be validated against the applicable NXP datasheet and reference design before layout release.
This product page consolidates verified distributor specifications, sourcing information, application guidance, and design notes for engineers evaluating the S912XET256BCAGR. It does not substitute for the complete NXP datasheet, errata, reference manual, or device-specific qualification documentation.
חלופות תחליף ישיר עבור S912XET256BCAGR — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם S912XET256BCAGR (אותו גורם צורה וטביעת רגל) — שונים ב Package, Pin Count, Mounting Type, Core Architecture, Debug Interface.
S912XDT256F1VAA
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S912XEG384J3VAL
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
S912XES384J2CAL
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S912XEG384AVAGR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S912XES384J3VAL
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S912XET256BCAGR דירוגים מרביים ומאפיינים חשמליים
| Product Type | 16-bit HCS12X microcontroller |
| Processor Core | S12X |
| Maximum CPU Frequency | 50 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| מארז | 144-LQFP, 20 x 20 mm |
| מספר פינים | 144 pins |
| סוג הרכבה | Surface mount |
| טמפרטורת פעולה | -40°C to +85°C |
| Qualification | Automotive qualified |
| Product Category | Microcontrollers - MCU |
| Manufacturer | NXP Semiconductors |
| סטטוס מחזור חיים | Active |
| Reference Price | $12.1089 per unit as of 2026-10-21 |
| Reported Inventory | 4,800 pieces from Heisener as of 2026-10-21 |
מדריך תצורת פינים של S912XET256BCAGR 144-lqfp, 20 x 20 mm
תצורת פינים עבור S912XET256BCAGR (מארזת 144-lqfp, 20 x 20 mm). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור S912XET256BCAGR.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
S912XET256BCAGR מתאים עבור 6 יישוםs: Automotive Body-Control Modules, Vehicle Network Gateways, Motor and Actuator Supervisory Control, Instrumentation and Diagnostic Electronics, Industrial Automation Controllers, Embedded IoT and Edge Control.
Automotive Body-Control Modules
The S912XET256BCAGR is a strong candidate for body-control modules because it combines a 16-bit S12X core, 50 MHz performance, 256 KB flash, automotive qualification, and a 144-pin package. The 144-pin LQFP provides ample connection density for switch inputs, sensor interfaces, driver outputs, communication transceivers, and diagnostic circuitry. In a distributed vehicle architecture, the MCU can execute periodic control tasks while coordinating lighting, locks, power-window logic, remote functions, and network diagnostics. Its -40°C to +85°C specified range supports vehicle environments, while the larger package increases PCB routing and assembly complexity compared with a low-pin-count controller.
מומלץ
Vehicle Network Gateways
Use the S912XET256BCAGR in a vehicle gateway or interface controller when several vehicle networks and discrete signals must be coordinated. The 50 MHz S12X core provides deterministic execution for protocol servicing, message filtering, diagnostics, and supervisory logic, while 256 KB flash supports firmware and configuration data. The 144-LQFP package can expose multiple communication, interrupt, timer, and general-purpose I/O resources on one controller. Compared with a small communication-only MCU, this device offers more compute and pin density, but the design must carefully budget bus levels, termination, protection, clocking, and software isolation.
מומלץ
Motor and Actuator Supervisory Control
The S912XET256BCAGR can serve as the supervisory controller for an automotive actuator or motor-control subsystem. Its 16-bit architecture and 50 MHz frequency are suitable for coordinating pulse timing, sensor acquisition, control-state logic, fault detection, and communication with a dedicated power-stage driver. The 256 KB flash capacity allows more elaborate control and diagnostic firmware than a minimal 8-bit controller, and the 144-pin package simplifies access to external drivers, sensors, and protection components. The controller should not replace a dedicated power device; it manages control sequencing and protection coordination while the actuator driver handles the high-current switching.
מומלץ
Instrumentation and Diagnostic Electronics
The S912XET256BCAGR is suitable for instrumentation modules that combine sensor conditioning, signal processing, display or vehicle-network reporting, and self-diagnostics. Its 50 MHz core supports faster control-loop updates and protocol handling than many small general-purpose MCUs, while 256 KB flash provides room for calibration tables, diagnostics, and application firmware. The high-pin-count package makes it practical to connect multiple input channels, communication transceivers, and output signals. Engineers should verify ADC, timer, serial-interface, and electrical specifications in the full NXP documentation before assigning any specific measurement chain.
מומלץ
Industrial Automation Controllers
Although the verified information identifies S912XET256BCAGR as automotive qualified, its 16-bit S12X core, 50 MHz frequency, and 256 KB flash also fit industrial automation controllers that require deterministic embedded control. It can be evaluated for machinery interfaces, distributed I/O modules, pump or valve controllers, and test fixtures. The 144-LQFP package offers more external connections than a minimal controller, supporting sensors, relays, communication transceivers, and status indicators. Industrial adoption still requires checking the full electrical limits, environmental ratings, functional-safety expectations, and long-term supply conditions.
מומלץ
Embedded IoT and Edge Control
The S912XET256BCAGR can be evaluated for connected industrial edge-control nodes that require local real-time decisions rather than only network connectivity. Its 50 MHz S12X core can handle sensor polling, state-machine logic, local filtering, actuator commands, and communication tasks, while 256 KB flash supports more capable firmware than a very small microcontroller. The 144-pin package offers flexibility for digital interfaces and external transceivers. A practical design must define the power architecture, communications stack, watchdog behavior, secure update strategy, and environmental requirements; the verified snippets do not establish a specific wireless interface.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור S912XET256BCAGR — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | S912XDT256F1VAA | S912XEG384J3VAL | S912XES384J2CAL | S912XEG384AVAGR | S912XES384J3VAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| CPU Core | 16-bit S12X | S12-family controller; exact core detail unavailable | S12-family controller; exact core detail unavailable | S12-family controller; exact core detail unavailable | S12-family controller; exact core detail unavailable | S12-family controller; exact core detail unavailable |
| Flash Memory | 256 KB | 256 KB family indication; verified target comparison unavailable | 384 KB family indication; verified target comparison unavailable | 384 KB family indication; verified target comparison unavailable | 384 KB family indication; verified target comparison unavailable | 384 KB family indication; verified target comparison unavailable |
מבדילים עיקריים
- Confirmed 50 MHz 16-bit S12X performance (לעומתS912XDT256F1VAA)
- Confirmed 256 KB flash capacity (לעומתS912XEG384J3VAL)
- Automotive-qualified operating envelope (לעומתS912XDT256F1VAA)
- High-pin-count integration (לעומתMC9S12DJ256MFUE)
הערות תכנון
Do not select the supply rails or decoupling values until the complete NXP electrical-characteristics table is available. The verified snippets confirm a 50 MHz automotive-qualified S12X MCU but do not state supply voltage, absolute maximum ratings, or operating current. In an implementation, place required bulk and high-frequency decoupling capacitors at the device power pins, keep return paths short, and verify startup, reset, and power-sequencing behavior against the datasheet.
Use a PCB land pattern specifically qualified for the 144-LQFP 20 x 20 mm package and validate it against the current NXP package drawing. Keep clock, reset, and sensitive analog or communication routes away from noisy switching-node routes, and provide adequate via access around the device. The high pin count increases routing congestion, so complete escape routing and fanout checks before placing the part on a multilayer board.
Thermal design must begin with the actual processor current, supply voltage, ambient temperature, and PCB copper area. The verified sources do not provide power dissipation or junction-temperature data, so no numerical thermal claim is made here. Measure or calculate the worst-case operating condition, maintain the manufacturer’s recommended layout and exposed-land requirements where applicable, and validate temperature rise in the assembled system rather than relying on the 50 MHz clock rating alone.
A matching package name does not prove a drop-in replacement. Before substituting any S912-family candidate, compare the complete pinout, alternate functions, memory map, clock and reset behavior, supply levels, timers, communication peripherals, programming model, qualification, and firmware support. S912XDT256F1VAA and the 384-device candidates in the comparison are review leads, not automatically qualified replacements.
Treat the clock input, reset circuitry, programming signals, and communication interfaces as separate high-integrity nets during layout. Follow the official reference schematic and recommended external-component values once retrieved from NXP documentation. Keep test points accessible, provide programming and debug access, and verify that the chosen LQFP assembly process supports the package pitch, solder paste pattern, reflow profile, and inspection requirements.
מידע על תאימות
Verified distributor and manufacturer search data identifies the target as automotive qualified, but the supplied evidence does not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status.