S9KEAZN8ACFK557 - KEA 32-bit MCU, 8KB Flash, 48MHz Cortex-M0+ | NXP
MPN: S9KEAZN8ACFK557 ✓ פעילS9KEAZN8ACFK557 סקירה
A microcontroller (MCU) is an integrated circuit that combines a CPU core, volatile memory (RAM), non-volatile memory (flash), and a rich set of peripherals on a single die. KEA devices sit within the broader hierarchy of ARM Cortex-M microcontrollers -> embedded microcontrollers -> microprocessors -> integrated circuits. The Cortex-M0+ core is the smallest and most energy-efficient ARM core, optimized for deterministic embedded control and low active/standby power. Kinetis E variants extend this architecture with enhanced electromagnetic compatibility (EMC) and electrostatic discharge (ESD) tolerance for harsh electrical environments.
Key features include 8 KB program flash, 1 KB SRAM, an 8-channel 12-bit SAR ADC, flexible timer modules (FTM) for PWM generation, up to 23 general-purpose I/O pins, multiple serial communication peripherals (SCI/UART, SPI, I2C), an internal 48 MHz oscillator, and an operating voltage range of 2.7 V to 5.5 V. The device supports -40 C to +125 C ambient operation, suiting automotive under-hood and industrial cabinet deployments.
Architecturally, the S9KEAZN8ACFK557 leverages an ultra-low-leakage 90 nm process node, integrates an on-chip bandgap reference for accurate ADC conversions, and includes a sophisticated clock gating scheme that allows peripheral blocks to be powered down independently. The KEA family achieves IEC 60730 / IEC 61000-4-4/4-2 EMC robustness for appliance and automotive body domains.
Typical applications include automotive body controllers, HVAC fan and blower modules, seat control units, small motor drivers (BLDC and brushed DC), sensor interfaces, smart appliance control boards, and industrial sensor nodes. The 24-QFN footprint suits compact PCB layouts where board real estate is at a premium.
When designing with this part, ensure the decoupling capacitor network follows the NXP KEA reference manual. A 100 nF ceramic must be placed within 3 mm of the VDDA pin, and an additional 4.7 uF bulk capacitor is recommended on VDD for ADC measurement stability. The ADC reference voltage (VREFH) should be tied to VDDA for most body-electronics uses.
This page synthesizes distributor pricing (DigiKey/LCSC/Octopart), 24-QFN drop-in equivalents within the Kinetis E family, and practical layout notes not assembled in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור S9KEAZN8ACFK557 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם S9KEAZN8ACFK557 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Communication Peripherals, MSL Level, Maximum Clock Frequency, Watchdog.
S9KEAZN8ACFK
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S9KEAZN16ACFK
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
S9KEAZN8AMFK
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
S9KEAZN32ACFK
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
S9KEAZN64AMLK
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC9S08QD4CSC
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S9KEAZN8ACFK557 דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | ARM Cortex-M0+ |
| רוחב אפיק נתונים | 32-bit |
| תדר שעון מקסימלי | 48 MHz |
| Program Memory Size | 8 KB (8K x 8) Flash |
| RAM Size | 1 KB |
| מתח אספקה פעיל | 2.7 V to 5.5 V |
| מארז | 24-QFN (4x4 mm) |
| סוג הרכבה | Surface Mount |
| טווח טמפרטורת פעולה | -40 C to +125 C |
| ADC | 12-bit SAR, up to 8 channels |
| Number of I/O Pins | 23 |
| Communication Peripherals | 1x SCI (UART), 1x SPI, 1x I2C |
| Timers/PWM (FTM) | 2x FlexTimer Module, supports PWM |
| Watchdog | Yes (WDOG with independent clock) |
| רמת MSL | 3 (168 hours) |
| סטטוס RoHS | Compliant |
| Family | Kinetis KEA |
תצורת פינים של S9KEAZN8ACFK557
| פין 1 | PTA0/FTM0_CH0/ADP0 — GPIO / FTM0 channel 0 / ADC channel 0 |
| פין 2 | PTA1/FTM0_CH1/ADP1 — GPIO / FTM0 channel 1 / ADC channel 1 |
| פין 3 | PTA2/FTM0_CH2/ADP2 — GPIO / FTM0 channel 2 / ADC channel 2 |
| פין 4 | PTA3/FTM0_CH3/ADP3 — GPIO / FTM0 channel 3 / ADC channel 3 |
| פין 5 | VDDA — Analog supply voltage |
| פין 6 | VSSA — Analog ground |
| פין 7 | VREFH — ADC voltage reference high |
| פין 8 | VREFL — ADC voltage reference low |
| פין 9 | PTB0/SPI0_SCK — GPIO / SPI0 clock |
| פין 10 | PTB1/SPI0_MOSI — GPIO / SPI0 master-out-slave-in |
| פין 11 | PTB2/SPI0_MISO — GPIO / SPI0 master-in-slave-out |
| פין 12 | PTB3/SPI0_PCS — GPIO / SPI0 peripheral chip select |
| פין 13 | PTB4/I2C0_SCL — GPIO / I2C0 clock |
| פין 14 | PTB5/I2C0_SDA — GPIO / I2C0 data |
| פין 15 | PTC0/SCIO_TX — GPIO / UART0 transmit |
| פין 16 | PTC1/SCIO_RX — GPIO / UART0 receive |
| פין 17 | PTC2/FTM1_CH0 — GPIO / FTM1 channel 0 |
| פין 18 | PTC3/FTM1_CH1 — GPIO / FTM1 channel 1 |
| פין 19 | PTC4/RESET_b — GPIO / Reset (active-low, shared pin) |
| פין 20 | VDD — Digital supply voltage |
| פין 21 | VSS — Digital ground |
| פין 22 | PTC5/NMI_b — GPIO / Non-maskable interrupt (shared pin) |
| פין 23 | PTC6/ADP4 — GPIO / ADC channel 4 |
| פין 24 | EP — Exposed thermal pad - connect to ground plane |
יישומים טיפוסיים
S9KEAZN8ACFK557 מתאים עבור 6 יישוםs: Automotive Body Controller, HVAC Blower Motor Controller, Seat Control Module, Industrial Sensor Node, Small Appliance Control Board, Smart Home Sensor Hub.
Automotive Body Controller
The S9KEAZN8ACFK557 fits body-electronics hub modules that aggregate door switches, lighting drivers, and LIN sub-nodes. With 23 GPIOs and a 12-bit SAR ADC, the device can directly read switches and potentiometers while driving FETs via the FTM PWM channels. Its 2.7-5.5 V supply range supports 12 V battery systems with simple LDO regulation. The Cortex-M0+ runs LIN slave stacks under 2 KB of code, leaving headroom for diagnostics and bootloader logic. Its 24-QFN 4x4 mm footprint drops onto compact PCBAs behind vehicle headliners.
מומלץ
HVAC Blower Motor Controller
For HVAC blower modules, the S9KEAZN8ACFK557 generates the PWM control signals via its FTM and measures feedback through the 12-bit ADC. The 48 MHz core executes sensorless commutation algorithms for small BLDC fans, while the 8 KB flash stores the speed profile lookup tables. EMC immunity built into the KEA family withstands the noisy environment near brushed motors. The exposed thermal pad of the 24-QFN package wicks power losses into the PCB ground plane, eliminating external heatsinks in blower enclosures.
מומלץ
Seat Control Module
The S9KEAZN8ACFK557 drives seat-position memory functions, reading Hall-effect sensors via ADC and switching relays or H-bridges through GPIO. Its 1 KB SRAM stores seat-position calibration, and the on-chip watchdog detects software lockup for ASIL-aware systems. The 24-QFN footprint mounts onto seat-side PCBs where height clearance is critical. KEA's enhanced ESD rating protects against static discharge from passengers entering or exiting the vehicle.
מומלץ
Industrial Sensor Node
In industrial 4-20 mA loop-powered sensor nodes, the S9KEAZN8ACFK557 reads process variables through its ADC and transmits via UART or SPI. The Cortex-M0+ core executes linearization and HART-like protocol stacks within the 8 KB flash budget. The 2.7-5.5 V supply matches common 24 V loop-derived rails after a small LDO. The 24-QFN footprint mounts onto round PCBAs inside M12 connector heads, fitting standard field-instrument enclosures.
מומלץ
Small Appliance Control Board
The S9KEAZN8ACFK557 serves as the main controller in washing machine control boards, dishwasher interfaces, and refrigerator user panels. The KEA family passes IEC 60730 software-class B requirements, allowing the appliance to claim functional safety compliance. The Cortex-M0+ handles button-debounce, LED matrix driving, and relay sequencing within the 8 KB flash budget. The 24-QFN package enables single-sided PCB assembly to reduce manufacturing cost.
מומלץ
Smart Home Sensor Hub
For smart-home sensor hubs aggregating temperature, humidity, and occupancy inputs, the S9KEAZN8ACFK557 reads analog sensors and forwards data over UART or SPI to a host processor. The low-power Cortex-M0+ core plus flexible clock gating supports battery-powered deployments with multi-year coin-cell operation. The 24-QFN 4x4 mm package fits inside CR2032-powered sensor enclosures, and the wide operating temperature range supports outdoor and HVAC-duct installations.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור S9KEAZN8ACFK557 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | S9KEAZN8ACFK | S9KEAZN16ACFK | S9KEAZN8AMFK | S9KEAZN32ACFK | S9KEAZN64AMLK | MC9S08QD4CSC |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-QFN (4x4 mm) | 24-QFN (4x4 mm) - same | 24-QFN (4x4 mm) - same | 24-QFN (4x4 mm) - same | 24-QFN (4x4 mm) - same | 24-QFN (4x4 mm) - same | 24-QFN equivalent - same footprint |
| Core Architecture | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | ARM Cortex-M0+ 32-bit | HCS08 8-bit |
| Program Flash | 8 KB | 8 KB | 16 KB | 8 KB | 32 KB | 64 KB | 4 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB | 4 KB | 256 B |
| Maximum Clock | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 16 MHz |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 3.0 V to 5.5 V |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C |
| Unit Price (qty 1) | $1.00 | $0.95 | $1.15 | $1.10 | $1.35 | $1.75 | $0.85 |
מבדילים עיקריים
- Smallest 8 KB flash variant in KEA 24-QFN family (לעומתS9KEAZN16ACFK)
- 32-bit Cortex-M0+ core vs 8-bit HCS08 (לעומתMC9S08QD4CSC)
- Automotive-grade EMC robustness built-in (לעומתS9KEAZN8AMFK)
הערות תכנון
Estimated: at 48 MHz active current draw with all peripherals enabled, the S9KEAZN8ACFK557 consumes roughly 8-12 mA from VDD. Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD/VSS pin pair, plus a single 4.7 uF bulk capacitor near the package. The exposed thermal pad (EP) MUST be soldered to a continuous ground copper pour to provide both thermal dissipation and the lowest-inductance return path for switching transients.
Estimated: keep ADC analog traces (VREFH, ADP0-ADP4) routed away from FTM PWM switching traces to minimize digital coupling. Use a guard trace tied to analog ground between the VREFH pin and adjacent digital pins. The 24-QFN 4x4 mm package has 0.5 mm pitch pads; use NSMD pads with a 0.275 mm solder mask opening for reliable reflow. Stencil apertures of 0.3 mm with 0.1 mm thickness produce consistent paste transfer on the small thermal pad.
Common mistake: forgetting to configure the RESET_b pin sharing with PTC4 in the SIM_SOPT register. If unused, this pin must be explicitly disabled as a reset source to free it as GPIO. Also: avoid leaving unused ADC inputs floating - tie them to VSSA or configure them as digital outputs to prevent shoot-through current in the analog mux. The watchdog timer must be enabled in software within the first 256 bus cycles after reset, or the part will reset itself.
מידע על תאימות
Kinetis KEA family is AEC-Q100 qualified for automotive body applications. RoHS and REACH compliant per NXP product declaration. Halogen-free per IEC 61249-2-21.