XC5VLX30-2FF676C - 30,720-Cell Virtex-5 LX FPGA | AMD
MPN: XC5VLX30-2FF676C ✗ סוף ייצורXC5VLX30-2FF676C סקירה
A field-programmable gate array is a programmable semiconductor in which the logic fabric, interconnect, and specialized blocks are configured after manufacture. FPGAs are widely used for rapid prototyping, communications infrastructure, industrial control, test equipment, signal processing, and embedded systems where hardware revisions are needed without changing the printed circuit board. The Virtex-5 LX platform extends this FPGA hierarchy into the Virtex family, FPGA family, programmable logic device class, and semiconductor category.
The XC5VLX30-2FF676C provides 30,720 logic cells and 400 I/O in a compact 676-ball FCBGA package. The -2 speed designation identifies the device speed grade, while the package suffix identifies the mechanical package and ball pattern. Its 65 nm CMOS implementation supports high-density designs with programmable logic, block RAM, and DSP-based arithmetic. The 676-ball package provides a large I/O complement for external memory, high-speed interfaces, clocks, data buses, and control signals.
Typical applications include communications and networking equipment, industrial automation, instrumentation, defense-related electronics, video processing, and high-speed test systems. The large I/O count is particularly useful when a design combines parallel data paths, external memory interfaces, high-speed serial links, and control logic. The device can support designs requiring deterministic real-time behavior, parallel processing, or custom protocol handling that would be cumbersome with fixed-function logic.
PCB implementation requires careful attention to the 676-ball FCBGA land pattern, power and ground distribution, decoupling, via placement, and high-speed routing. Keep the power and ground planes continuous, place decoupling capacitors near the relevant supply pins, and follow the manufacturer’s package and pinout documentation for ball assignments. Confirm the selected memory interface, clocking scheme, configuration method, and I/O standards against the complete device documentation before finalizing the layout.
חלופות תחליף ישיר עבור XC5VLX30-2FF676C — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC5VLX30-2FF676C (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Logic Cells, Package Type, Speed Grade, Lead-Free Status.
XC5VLX30-1FF676C
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC5VLX30-2FFG676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC5VLX50-1FF676C
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC5VLX50-2FF676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC5VLX20-2FF676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC5VLX30-2FF676C דירוגים מרביים ומאפיינים חשמליים
| Device Type | Virtex-5 LX field-programmable gate array |
| Logic Cells | 30,720 cells |
| Number of I/O | 400 I/O |
| מארז | 676-BBGA FCBGA |
| Number of Terminals | 676 terminals |
| Package Type | BGA |
| Process Technology | 65 nm CMOS |
| מתח אספקה | 1 V |
| Speed Grade | -2 |
| FPGA Architecture | Second-generation ASMBL column-based architecture |
| Programmable Logic Blocks | 2,400 CLBs |
| Maximum Frequency | 1,098 MHz |
| Package Dimensions | 27 x 27 mm |
| סגנון הרכבה | Surface mount |
| Lead-Free Status | Contains lead |
| סטטוס RoHS | RoHS non-compliant |
מדריך תצורת פינים של XC5VLX30-2FF676C 27 x 27 mm
תצורת פינים עבור XC5VLX30-2FF676C (מארזת 27 x 27 mm). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC5VLX30-2FF676C.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC5VLX30-2FF676C מתאים עבור 6 יישוםs: Communications and Network Equipment, Industrial Automation and Control, High-Speed Instrumentation, Video and Image Processing, Embedded Signal Processing, Aerospace and Defense Control Systems.
Communications and Network Equipment
The XC5VLX30-2FF676C fits communications equipment requiring programmable parallel logic, multiple external interfaces, and high-speed data handling. Its 30,720 logic cells and 400 I/O provide capacity for packet processing, protocol conversion, clocking, and control functions within one FPGA. Place the device in a 676-ball FCBGA layout with continuous power planes and carefully routed high-speed links. The -2 speed grade supports timing margin in demanding parallel paths, while the large I/O count simplifies connections to transceivers, memory, and network processors.
מומלץ
Industrial Automation and Control
The XC5VLX30-2FF676C is suitable for industrial controllers combining deterministic control logic, data acquisition, communication gateways, and machine-safety monitoring. The 400 I/O can support digital and differential interfaces, while the 30,720-cell fabric can implement multiple control paths and protocol engines. Use the manufacturer’s I/O standards and package data to confirm voltage compatibility. For industrial deployment, verify the device temperature grade, lifecycle status, and long-term supply plan before releasing the production design.
מומלץ
High-Speed Instrumentation
The XC5VLX30-2FF676C can implement acquisition pipelines, timing control, trigger logic, and data formatting in advanced test and measurement equipment. Its 2,400 CLBs and 1,098 MHz maximum frequency provide a substantial timing and logic budget for parallel instrumentation channels. The 676-ball FCBGA package supports dense connection to converters, memories, and clock sources, but it also demands careful decoupling, via-in-pad or via-array planning, and controlled BGA assembly. Validate signal integrity and timing against the complete implementation constraints.
מומלץ
Video and Image Processing
The XC5VLX30-2FF676C supports parallel pixel pipelines, frame synchronization, color processing, memory arbitration, and custom compression functions. Its 30,720 logic cells provide meaningful parallel throughput, while 400 I/O allow direct connection to video interfaces and external frame-buffer memory. A multi-rail design should use the device’s specified supply architecture and place local bypass capacitance close to the relevant balls. Because this is a large BGA FPGA, signal integrity, power-integrity analysis, thermal management, and careful memory-interface routing are essential.
מומלץ
Embedded Signal Processing
The XC5VLX30-2FF676C can implement fixed-point, digital filtering, correlation, modulation, and real-time data-reduction functions in programmable embedded systems. The -2 grade offers additional timing margin over slower -1 options, while the large logic fabric supports parallel datapaths and multiple processing stages. Use dedicated block RAM and DSP resources where available instead of implementing storage or arithmetic in general logic. Resource allocation, clock-domain boundaries, and timing closure should be checked before the design is released for hardware.
מומלץ
Aerospace and Defense Control Systems
The XC5VLX30-2FF676C can support programmable control, telemetry, interface translation, and monitoring functions in aerospace, defense, and rugged embedded equipment. The 30,720 logic cells and 400 I/O are useful for combining real-time control logic with redundant communication paths. Because the device temperature grade and qualification status are not established by the available device listing, engineers must verify the exact ordering information, environmental requirements, and qualification documentation. Board design should also include appropriate power integrity, thermal analysis, and controlled BGA assembly.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC5VLX30-2FF676C — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC5VLX30-1FF676C | XC5VLX30-2FFG676C | XC5VLX50-1FF676C | XC5VLX50-2FF676C | XC5VLX20-2FF676C |
|---|---|---|---|---|---|---|
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Speed Grade | -2 | -1 | -2 | -1 | -2 | -2 |
מבדילים עיקריים
- Directly preserves the XC5VLX30 logic density (לעומתXC5VLX30-1FF676C)
- Matches the -2 speed grade while increasing available fabric (לעומתXC5VLX50-2FF676C)
- Offers a higher performance tier than the -1 alternatives (לעומתXC5VLX50-1FF676C)
- Provides greater logic density than the XC5VLX20 option (לעומתXC5VLX20-2FF676C)
הערות תכנון
The 676-ball FCBGA requires a continuous reference-plane strategy and careful escape routing from the FPGA balls to the PCB interior. Use the manufacturer package drawing to define land patterns and keep high-speed routes away from split plane boundaries. Place decoupling capacitors directly adjacent to the relevant supply balls, use short ground returns, and follow the recommended via structures for the assembly process.
Treat the 1 V core rail and any auxiliary I/O rails as a coordinated power system. Check device current limits and sequencing requirements in the complete manufacturer documentation before selecting regulators and ferrite components. Place local bypass capacitance near the device, preserve low-impedance plane connections, and validate voltage droop and transient behavior across the full clock and load range.
Route clocks and high-speed interfaces with controlled impedance and short return paths. Keep configuration signals, reset, and programming interfaces away from aggressive switching nodes, and reserve clean escape lanes for all dedicated pins. Because the package has 676 terminals, use the manufacturer pin-description table to identify supply, ground, no-connect, configuration, clock, and user I/O balls before routing.
Do not substitute a different speed grade or logic-density option without checking timing and resource utilization. XC5VLX30-1FF676C preserves density but reduces speed grade; XC5VLX50 options increase available fabric; XC5VLX20 reduces it. Also verify the FF676 and FFG676 package drawings rather than assuming that similar suffixes identify an identical land pattern.
מידע על תאימות
The available device listing identifies the part as RoHS non-compliant and containing lead. Other compliance attributes are not established by the available information.
