XC5VLX30-2FF676C - 30,720-Cell Virtex-5 LX FPGA | AMD
MPN： XC5VLX30-2FF676C ✗ 停產XC5VLX30-2FF676C 概覽
A field-programmable gate array is a programmable semiconductor in which the logic fabric, interconnect, and specialized blocks are configured after manufacture. FPGAs are widely used for rapid prototyping, communications infrastructure, industrial control, test equipment, signal processing, and embedded systems where hardware revisions are needed without changing the printed circuit board. The Virtex-5 LX platform extends this FPGA hierarchy into the Virtex family, FPGA family, programmable logic device class, and semiconductor category.
The XC5VLX30-2FF676C provides 30,720 logic cells and 400 I/O in a compact 676-ball FCBGA package. The -2 speed designation identifies the device speed grade, while the package suffix identifies the mechanical package and ball pattern. Its 65 nm CMOS implementation supports high-density designs with programmable logic, block RAM, and DSP-based arithmetic. The 676-ball package provides a large I/O complement for external memory, high-speed interfaces, clocks, data buses, and control signals.
Typical applications include communications and networking equipment, industrial automation, instrumentation, defense-related electronics, video processing, and high-speed test systems. The large I/O count is particularly useful when a design combines parallel data paths, external memory interfaces, high-speed serial links, and control logic. The device can support designs requiring deterministic real-time behavior, parallel processing, or custom protocol handling that would be cumbersome with fixed-function logic.
PCB implementation requires careful attention to the 676-ball FCBGA land pattern, power and ground distribution, decoupling, via placement, and high-speed routing. Keep the power and ground planes continuous, place decoupling capacitors near the relevant supply pins, and follow the manufacturer’s package and pinout documentation for ball assignments. Confirm the selected memory interface, clocking scheme, configuration method, and I/O standards against the complete device documentation before finalizing the layout.
直接替換替代品，適用於 XC5VLX30-2FF676C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC5VLX30-2FF676C （相同外形與佔位） — 差異在於 Device Type, Logic Cells, Package Type, Speed Grade, Lead-Free Status.
XC5VLX30-1FF676C
✅ 直接替換聯絡詢價
查看資料表 →XC5VLX30-2FFG676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC5VLX50-1FF676C
✅ 直接替換聯絡詢價
查看資料表 →XC5VLX50-2FF676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC5VLX20-2FF676C
✅ 直接替換📋 參考替代品（不在目錄中）
XC5VLX30-2FF676C 最大額定值與電氣特性
| Device Type | Virtex-5 LX field-programmable gate array |
| Logic Cells | 30,720 cells |
| Number of I/O | 400 I/O |
| 封裝 | 676-BBGA FCBGA |
| Number of Terminals | 676 terminals |
| Package Type | BGA |
| Process Technology | 65 nm CMOS |
| 供應電壓 | 1 V |
| Speed Grade | -2 |
| FPGA Architecture | Second-generation ASMBL column-based architecture |
| Programmable Logic Blocks | 2,400 CLBs |
| Maximum Frequency | 1,098 MHz |
| Package Dimensions | 27 x 27 mm |
| 安裝方式 | Surface mount |
| Lead-Free Status | Contains lead |
| RoHS 狀態 | RoHS non-compliant |
XC5VLX30-2FF676C 27 x 27 mm 腳位配置指南
XC5VLX30-2FF676C（27 x 27 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC5VLX30-2FF676C.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC5VLX30-2FF676C 適用於 6 應用s: Communications and Network Equipment, Industrial Automation and Control, High-Speed Instrumentation, Video and Image Processing, Embedded Signal Processing, Aerospace and Defense Control Systems.
Communications and Network Equipment
The XC5VLX30-2FF676C fits communications equipment requiring programmable parallel logic, multiple external interfaces, and high-speed data handling. Its 30,720 logic cells and 400 I/O provide capacity for packet processing, protocol conversion, clocking, and control functions within one FPGA. Place the device in a 676-ball FCBGA layout with continuous power planes and carefully routed high-speed links. The -2 speed grade supports timing margin in demanding parallel paths, while the large I/O count simplifies connections to transceivers, memory, and network processors.
推薦
Industrial Automation and Control
The XC5VLX30-2FF676C is suitable for industrial controllers combining deterministic control logic, data acquisition, communication gateways, and machine-safety monitoring. The 400 I/O can support digital and differential interfaces, while the 30,720-cell fabric can implement multiple control paths and protocol engines. Use the manufacturer’s I/O standards and package data to confirm voltage compatibility. For industrial deployment, verify the device temperature grade, lifecycle status, and long-term supply plan before releasing the production design.
推薦
High-Speed Instrumentation
The XC5VLX30-2FF676C can implement acquisition pipelines, timing control, trigger logic, and data formatting in advanced test and measurement equipment. Its 2,400 CLBs and 1,098 MHz maximum frequency provide a substantial timing and logic budget for parallel instrumentation channels. The 676-ball FCBGA package supports dense connection to converters, memories, and clock sources, but it also demands careful decoupling, via-in-pad or via-array planning, and controlled BGA assembly. Validate signal integrity and timing against the complete implementation constraints.
推薦
Video and Image Processing
The XC5VLX30-2FF676C supports parallel pixel pipelines, frame synchronization, color processing, memory arbitration, and custom compression functions. Its 30,720 logic cells provide meaningful parallel throughput, while 400 I/O allow direct connection to video interfaces and external frame-buffer memory. A multi-rail design should use the device’s specified supply architecture and place local bypass capacitance close to the relevant balls. Because this is a large BGA FPGA, signal integrity, power-integrity analysis, thermal management, and careful memory-interface routing are essential.
推薦
Embedded Signal Processing
The XC5VLX30-2FF676C can implement fixed-point, digital filtering, correlation, modulation, and real-time data-reduction functions in programmable embedded systems. The -2 grade offers additional timing margin over slower -1 options, while the large logic fabric supports parallel datapaths and multiple processing stages. Use dedicated block RAM and DSP resources where available instead of implementing storage or arithmetic in general logic. Resource allocation, clock-domain boundaries, and timing closure should be checked before the design is released for hardware.
推薦
Aerospace and Defense Control Systems
The XC5VLX30-2FF676C can support programmable control, telemetry, interface translation, and monitoring functions in aerospace, defense, and rugged embedded equipment. The 30,720 logic cells and 400 I/O are useful for combining real-time control logic with redundant communication paths. Because the device temperature grade and qualification status are not established by the available device listing, engineers must verify the exact ordering information, environmental requirements, and qualification documentation. Board design should also include appropriate power integrity, thermal analysis, and controlled BGA assembly.
推薦
推薦產品摘要
工程參考資料，適用於 XC5VLX30-2FF676C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC5VLX30-1FF676C | XC5VLX30-2FFG676C | XC5VLX50-1FF676C | XC5VLX50-2FF676C | XC5VLX20-2FF676C |
|---|---|---|---|---|---|---|
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Speed Grade | -2 | -1 | -2 | -1 | -2 | -2 |
主要差異化特點
- Directly preserves the XC5VLX30 logic density (對比XC5VLX30-1FF676C)
- Matches the -2 speed grade while increasing available fabric (對比XC5VLX50-2FF676C)
- Offers a higher performance tier than the -1 alternatives (對比XC5VLX50-1FF676C)
- Provides greater logic density than the XC5VLX20 option (對比XC5VLX20-2FF676C)
設計說明
The 676-ball FCBGA requires a continuous reference-plane strategy and careful escape routing from the FPGA balls to the PCB interior. Use the manufacturer package drawing to define land patterns and keep high-speed routes away from split plane boundaries. Place decoupling capacitors directly adjacent to the relevant supply balls, use short ground returns, and follow the recommended via structures for the assembly process.
Treat the 1 V core rail and any auxiliary I/O rails as a coordinated power system. Check device current limits and sequencing requirements in the complete manufacturer documentation before selecting regulators and ferrite components. Place local bypass capacitance near the device, preserve low-impedance plane connections, and validate voltage droop and transient behavior across the full clock and load range.
Route clocks and high-speed interfaces with controlled impedance and short return paths. Keep configuration signals, reset, and programming interfaces away from aggressive switching nodes, and reserve clean escape lanes for all dedicated pins. Because the package has 676 terminals, use the manufacturer pin-description table to identify supply, ground, no-connect, configuration, clock, and user I/O balls before routing.
Do not substitute a different speed grade or logic-density option without checking timing and resource utilization. XC5VLX30-1FF676C preserves density but reduces speed grade; XC5VLX50 options increase available fabric; XC5VLX20 reduces it. Also verify the FF676 and FFG676 package drawings rather than assuming that similar suffixes identify an identical land pattern.
合規資訊
The available device listing identifies the part as RoHS non-compliant and containing lead. Other compliance attributes are not established by the available information.
