XC6SLX25T-3FG484I - 24,051-Cell Spartan-6 LXT FPGA | AMD
MPN: XC6SLX25T-3FG484I ✓ פעילXC6SLX25T-3FG484I סקירה
An FPGA is a programmable semiconductor in which configurable logic blocks, memory, and I/O resources are interconnected by programmable routing. A field-programmable gate array therefore sits within the broader semiconductor hierarchy, but unlike a fixed-function application-specific integrated circuit, its behavior can be changed by loading a bitstream after manufacturing. The Spartan-6 LXT family is positioned for cost-sensitive designs requiring moderate logic density, embedded memory, and high-speed serial connectivity.
The XC6SLX25T-3FG484I provides 24,051 logic cells, 958,464 bits of distributed memory, and 250 I/O in the ordering identified by the product listing. Its 500 MHz internal frequency supports clocked digital logic, interface bridging, control processing, and signal-generation systems. The -3 designation selects the highest-performance Spartan-6 LX speed option listed in the product documentation, making this device useful when timing margin is more important than minimizing unit cost.
The device combines programmable logic, dedicated block RAM, digital signal processing resources, programmable I/O standards, and serial transceivers in one package. Its 1.2 V core operation and 500 MHz internal clock support modern FPGA timing architectures, while the 250 available I/O allow external memory, data converters, communications links, and control peripherals to be connected without adding a separate programmable device.
Typical applications include industrial control, instrumentation, test and measurement, embedded video, communications infrastructure, and high-speed interface aggregation. The Spartan-6 LXT architecture is especially appropriate when moderate logic capacity must coexist with high-speed serial links and enough parallel I/O for external control or data-acquisition circuitry.
The most important design consideration is package and pinout verification. Published listings identify the physical package as a 15 x 15 mm, 0.80 mm-pitch lead-free FBGA, while one specification source reports 324 pins despite naming the 484-BBGA configuration. Use the official AMD Spartan-6 package pinout file before assigning power, ground, configuration, clock, and user I/O connections.
This product summary consolidates the ordering information, resource quantities, package characteristics, available drop-in candidates, and PCB implementation considerations needed to evaluate the XC6SLX25T-3FG484I before beginning a hardware design.
חלופות תחליף ישיר עבור XC6SLX25T-3FG484I — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC6SLX25T-3FG484I (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Speed Grade.
XC6SLX25T-3FGG484I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX25T-3FG484C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX25T-2FGG484C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX25T-2FGG484I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX25T-3FG484I דירוגים מרביים ומאפיינים חשמליים
| Device Type | FPGA |
| FPGA Family | Spartan-6 LXT |
| Logic Cells | 24,051 cells |
| I/O Count | 250 I/O |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.2 V |
| Distributed Memory | 958,464 bits |
| Speed Grade | -3 |
| Temperature Grade | Industrial, 0 to 85 °C |
| Package Type | Lead-free FBGA, MO-275 / CSBGA-324 |
| Package Body Size | 15 x 15 mm |
| Package Pitch | 0.80 mm |
| Reported Pin Count | 324 pins |
| סוג הרכבה | Surface mount |
| סטטוס RoHS | Lead-free package |
מדריך תצורת פינים של XC6SLX25T-3FG484I 0.80 mm
תצורת פינים עבור XC6SLX25T-3FG484I (מארזת 0.80 mm). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC6SLX25T-3FG484I.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC6SLX25T-3FG484I מתאים עבור 6 יישוםs: Industrial Control and Automation, Data Acquisition and Instrumentation, High-Speed Interface Aggregation, Communications and Network Equipment, Test and Measurement Systems, Embedded Video and Image Processing.
Industrial Control and Automation
The XC6SLX25T-3FG484I fits industrial controllers that combine sequential logic, communication interfaces, and discrete I/O. Its 24,051 logic cells provide capacity for control sequencing, state machines, alarm logic, and data transformation, while 250 I/O support sensors, actuators, relay interfaces, and industrial communications. The listed 0 to 85 °C operating range is appropriate for controlled equipment enclosures. The -3 speed grade gives designers additional timing margin when clocked control paths operate near the FPGA performance limit.
מומלץ
Data Acquisition and Instrumentation
For measurement and instrumentation equipment, the XC6SLX25T-3FG484I can implement acquisition control, filtering, digital calibration, and data packaging in one programmable device. Its 958,464 bits of distributed memory provide on-chip resources for buffering, while 250 I/O can connect converters, clocks, memory, and communication transceivers. The 500 MHz internal frequency supports pipelined digital processing, and the -3 grade can help preserve timing margin in multi-stage filtering or protocol-conversion paths.
מומלץ
High-Speed Interface Aggregation
The Spartan-6 LXT XC6SLX25T-3FG484I is appropriate for systems that aggregate multiple data paths, bridge protocols, or serialize parallel data. Its programmable logic and 250 I/O can manage control channels, status signaling, and lower-rate interfaces alongside the LXT family's high-speed connectivity capabilities. The 500 MHz internal frequency supports demanding parallel-to-serial and clock-domain-conversion functions, while the -3 speed grade favors designs requiring stronger timing performance than the -2 option.
מומלץ
Communications and Network Equipment
Network-access and communications-control equipment can use the XC6SLX25T-3FG484I for packet processing, traffic control, status monitoring, and peripheral interfacing. The 24,051 logic cells support parallel packet handling and protocol state machines, while 958,464 bits of distributed memory assist with buffering and temporary data organization. Its 250 I/O leave ample connections for network transceivers, management interfaces, LEDs, and reset or fan-control signals in a cost-sensitive embedded architecture.
מומלץ
Test and Measurement Systems
In automated test equipment, the XC6SLX25T-3FG484I can implement pattern generation, timing control, data capture, and instrument-bus interfacing. The 500 MHz internal frequency supports fast digital test sequences, and the large parallel I/O count can connect converters, memories, and external instruments. Industrial-temperature operation from 0 °C to 85 °C suits production-floor equipment. The -3 speed grade is useful when stimulus timing, acquisition pipelines, or interface round-trip latency constrain the design schedule.
מומלץ
Embedded Video and Image Processing
The XC6SLX25T-3FG484I can support embedded image pipelines, pixel transport, timing generation, and interface control when a design does not require a larger video processor. Its 24,051 logic cells handle control and fixed-function pixel operations, while 958,464 bits of distributed memory can support line or tile buffering strategies. The 250 I/O provide parallel connections to image sensors, displays, and memory. The -3 speed grade offers additional timing margin for multi-stage pixel-processing paths.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC6SLX25T-3FG484I — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC6SLX25T-3FGG484I | XC6SLX25T-3FG484C | XC6SLX25T-2FGG484C | XC6SLX25T-2FGG484I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 15 x 15 mm lead-free 484 FBGA | 15 x 15 mm lead-free 484 FBGA | 15 x 15 mm lead-free 484 FBGA | 15 x 15 mm lead-free 484 FBGA | 15 x 15 mm lead-free 484 FBGA |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Temperature Suffix | I | I | C | C | I |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| I/O Count | 250 I/O | 250 I/O | 250 I/O | 250 I/O | 250 I/O |
מבדילים עיקריים
- Highest listed Spartan-6 LX speed grade (לעומתXC6SLX25T-2FGG484I)
- Industrial-temperature ordering option (לעומתXC6SLX25T-3FG484C)
- Substantial programmable resources for parallel control (לעומתXC6SLX45T-3FGG484I)
הערות תכנון
Treat the XC6SLX25T-3FG484I as a fine-pitch, 15 x 15 mm FBGA device with a 0.80 mm ball pitch. Follow the exact land pattern and mask or paste apertures from the official AMD Spartan-6 package file rather than deriving dimensions from the package name. Assign power and ground balls according to the complete ball map, preserve the exposed thermal requirements specified by AMD, and route high-speed clocks and configuration signals with controlled impedance.
Place configuration, clock, and decoupling connections directly beneath or adjacent to their assigned balls to minimize loop area. Separate sensitive clock inputs from high-speed serial and data outputs where practical, use short return paths for reference planes, and avoid routing fast signals through the region reserved for power-distribution vias. The 250 available I/O should be allocated only after confirming the package's actual ball assignments, because published listing snippets contain conflicting package-count descriptions.
Do not approve a replacement solely because the logic-cell counts match. A valid substitution also requires the same package, configuration interface, power architecture, clock resources, transceiver arrangement, temperature class, and timing grade. Review the AMD package pinout file, ordering guide, and device migration information for the candidate MPN. In particular, changing from -3 to -2 can alter timing closure even though the FPGA resources remain unchanged.
Evaluate junction temperature from the actual FPGA activity, selected package thermal data, ambient temperature, board construction, and airflow. The industrial temperature range of 0 to 85 °C does not by itself guarantee adequate board-level thermal performance. Provide continuous power and ground planes, use the specified via pattern, and confirm the assembled PCB temperature under worst-case operating conditions before approving the 15 x 15 mm FBGA footprint.
מידע על תאימות
The package is identified as lead-free. Formal RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification statements were not identified and therefore remain unknown.
