AMD

XC6SLX25T-3FG484I - 24,051-Cell Spartan-6 LXT FPGA | AMD

Name: XC6SLX25T-3FG484I - 24,051-Cell Spartan-6 LXT FPGA | AMD
Brand: AMD
SKU: XC6SLX25T-3FG484I

부품 번호: XC6SLX25T-3FG484I ✓ 활성

1.2 V Vdss Lead-free FBGA, MO-275 / CSBGA-324 Package 500 MHz Speed 958,464 bits Memory

견적 요청

MOQ: 1 |

데이터시트 보기 (PDF) 대체품 보기

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XC6SLX25T-3FG484I 개요

AMD XC6SLX25T-3FG484I is a Spartan-6 LXT field-programmable gate array with 24,051 logic cells, 250 I/O, a 500 MHz internal frequency, and a 1.2 V core supply in a 15 x 15 mm lead-free FBGA package. The -3 speed grade provides the highest performance among the listed Spartan-6 LX speed grades, while the I suffix identifies the industrial-temperature ordering option.

An FPGA is a programmable semiconductor in which configurable logic blocks, memory, and I/O resources are interconnected by programmable routing. A field-programmable gate array therefore sits within the broader semiconductor hierarchy, but unlike a fixed-function application-specific integrated circuit, its behavior can be changed by loading a bitstream after manufacturing. The Spartan-6 LXT family is positioned for cost-sensitive designs requiring moderate logic density, embedded memory, and high-speed serial connectivity.

The XC6SLX25T-3FG484I provides 24,051 logic cells, 958,464 bits of distributed memory, and 250 I/O in the ordering identified by the product listing. Its 500 MHz internal frequency supports clocked digital logic, interface bridging, control processing, and signal-generation systems. The -3 designation selects the highest-performance Spartan-6 LX speed option listed in the product documentation, making this device useful when timing margin is more important than minimizing unit cost.

The device combines programmable logic, dedicated block RAM, digital signal processing resources, programmable I/O standards, and serial transceivers in one package. Its 1.2 V core operation and 500 MHz internal clock support modern FPGA timing architectures, while the 250 available I/O allow external memory, data converters, communications links, and control peripherals to be connected without adding a separate programmable device.

Typical applications include industrial control, instrumentation, test and measurement, embedded video, communications infrastructure, and high-speed interface aggregation. The Spartan-6 LXT architecture is especially appropriate when moderate logic capacity must coexist with high-speed serial links and enough parallel I/O for external control or data-acquisition circuitry.

The most important design consideration is package and pinout verification. Published listings identify the physical package as a 15 x 15 mm, 0.80 mm-pitch lead-free FBGA, while one specification source reports 324 pins despite naming the 484-BBGA configuration. Use the official AMD Spartan-6 package pinout file before assigning power, ground, configuration, clock, and user I/O connections.

This product summary consolidates the ordering information, resource quantities, package characteristics, available drop-in candidates, and PCB implementation considerations needed to evaluate the XC6SLX25T-3FG484I before beginning a hardware design.

드롭인 대체품: XC6SLX25T-3FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX25T-3FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Speed Grade.

XC6SLX25T-2FG484C

AMD

Device Type: Field Programmable Gate Array (FPGA)

Speed Grade: -2

비교 대상: XC6SLX25T-3FG484I →

XC6SLX25T-3FGG484I

✅ 드롭인

📦 15 x 15 mm lead-free 484 FBGA

Same -3 speed grade and Spartan-6 LXT resource class; G in the package ordering code distinguishes the lead-free package option, while temperature qualification must be confirmed from AMD ordering data.

📋 참조 대체품 (카탈로그에 없음)

XC6SLX25T-3FG484C

✅ 드롭인

📦 15 x 15 mm lead-free 484 FBGA

Same -3 speed grade and FPGA resource class; the ordering suffix changes the temperature option, with the target identified as industrial I and the candidate identified as commercial C.

📋 참조 대체품 (카탈로그에 없음)

XC6SLX25T-2FGG484C

✅ 드롭인

📦 15 x 15 mm lead-free 484 FBGA

Same Spartan-6 LXT device and package family, but the speed grade changes from -3 to -2, a one-grade reduction across the -3N, -2, and -1L performance ordering.

📋 참조 대체품 (카탈로그에 없음)

XC6SLX25T-2FGG484I

✅ 드롭인

📦 15 x 15 mm lead-free 484 FBGA

Same Spartan-6 LXT device and industrial ordering concept, but the speed grade changes from -3 to -2, a one-grade reduction across the -3N, -2, and -1L performance ordering.

📋 참조 대체품 (카탈로그에 없음)

XC6SLX25T-3FG484I 최대 정격 & 전기적 특성

Device Type	FPGA
FPGA Family	Spartan-6 LXT
Logic Cells	24,051 cells
I/O Count	250 I/O
Internal Frequency	500 MHz
Core Supply Voltage	1.2 V
Distributed Memory	958,464 bits
Speed Grade	-3
Temperature Grade	Industrial, 0 to 85 °C
Package Type	Lead-free FBGA, MO-275 / CSBGA-324
Package Body Size	15 x 15 mm
Package Pitch	0.80 mm
Reported Pin Count	324 pins
실장 유형	Surface mount
RoHS 상태	Lead-free package

XC6SLX25T-3FG484I 0.80 mm 핀 구성 가이드

XC6SLX25T-3FG484I(0.80 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

XC6SLX25T-3FG484I의 0.80 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: XC6SLX25T-3FG484I.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

XC6SLX25T-3FG484I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Data Acquisition and Instrumentation, High-Speed Interface Aggregation, Communications and Network Equipment, Test and Measurement Systems, Embedded Video and Image Processing.

🏭

Industrial Control and Automation

The XC6SLX25T-3FG484I fits industrial controllers that combine sequential logic, communication interfaces, and discrete I/O. Its 24,051 logic cells provide capacity for control sequencing, state machines, alarm logic, and data transformation, while 250 I/O support sensors, actuators, relay interfaces, and industrial communications. The listed 0 to 85 °C operating range is appropriate for controlled equipment enclosures. The -3 speed grade gives designers additional timing margin when clocked control paths operate near the FPGA performance limit.

추천

XC6SLX25T-3FGG484I (Same-family -3 speed-grade FPGA option) XC6SLX25T-2FGG484I (Same-family lower-speed industrial option)

📡

Data Acquisition and Instrumentation

For measurement and instrumentation equipment, the XC6SLX25T-3FG484I can implement acquisition control, filtering, digital calibration, and data packaging in one programmable device. Its 958,464 bits of distributed memory provide on-chip resources for buffering, while 250 I/O can connect converters, clocks, memory, and communication transceivers. The 500 MHz internal frequency supports pipelined digital processing, and the -3 grade can help preserve timing margin in multi-stage filtering or protocol-conversion paths.

추천

XC6SLX25T-3FG484I · AMD XC6SLX25T-3FGG484C (Same-resource FPGA for commercial-temperature instrumentation)

🌐

High-Speed Interface Aggregation

The Spartan-6 LXT XC6SLX25T-3FG484I is appropriate for systems that aggregate multiple data paths, bridge protocols, or serialize parallel data. Its programmable logic and 250 I/O can manage control channels, status signaling, and lower-rate interfaces alongside the LXT family's high-speed connectivity capabilities. The 500 MHz internal frequency supports demanding parallel-to-serial and clock-domain-conversion functions, while the -3 speed grade favors designs requiring stronger timing performance than the -2 option.

추천

XC6SLX25T-2FGG484I (Lower-speed same-family interface alternative) XC6SLX25T-2FGG484C (Same-family commercial-temperature interface option)

🌐

Communications and Network Equipment

Network-access and communications-control equipment can use the XC6SLX25T-3FG484I for packet processing, traffic control, status monitoring, and peripheral interfacing. The 24,051 logic cells support parallel packet handling and protocol state machines, while 958,464 bits of distributed memory assist with buffering and temporary data organization. Its 250 I/O leave ample connections for network transceivers, management interfaces, LEDs, and reset or fan-control signals in a cost-sensitive embedded architecture.

추천

XC6SLX25T-3FGG484I (Closest same-speed lead-free family option) XC6SLX25T-3FG484C (Same-resource lower-temperature ordering option)

🔧

Test and Measurement Systems

In automated test equipment, the XC6SLX25T-3FG484I can implement pattern generation, timing control, data capture, and instrument-bus interfacing. The 500 MHz internal frequency supports fast digital test sequences, and the large parallel I/O count can connect converters, memories, and external instruments. Industrial-temperature operation from 0 °C to 85 °C suits production-floor equipment. The -3 speed grade is useful when stimulus timing, acquisition pipelines, or interface round-trip latency constrain the design schedule.

추천

XC6SLX25T-3FGG484I (Same-speed family member for alternate ordering code) XC6SLX25T-2FGG484I (Same-family option when lower speed is acceptable)

📺

Embedded Video and Image Processing

The XC6SLX25T-3FG484I can support embedded image pipelines, pixel transport, timing generation, and interface control when a design does not require a larger video processor. Its 24,051 logic cells handle control and fixed-function pixel operations, while 958,464 bits of distributed memory can support line or tile buffering strategies. The 250 I/O provide parallel connections to image sensors, displays, and memory. The -3 speed grade offers additional timing margin for multi-stage pixel-processing paths.

추천

XC6SLX25T-3FG484C (Same-resource FPGA for commercial-temperature systems) XC6SLX25T-3FGG484I (Closely related -3 lead-free ordering option)

추천 제품 요약

XC6SLX25T-3FGG484I Same-family -3 speed-grade FPGA option 사용처: Industrial Control and Automation, Communications and Network Equipment, Test and Measurement Systems, Embedded Video and Image Processing XC6SLX25T-2FGG484I Same-family lower-speed industrial option 사용처: Industrial Control and Automation, High-Speed Interface Aggregation, Test and Measurement Systems XC6SLX25T-3FG484I AMD 사용처: Data Acquisition and Instrumentation XC6SLX25T-3FGG484C Same-resource FPGA for commercial-temperature instrumentation 사용처: Data Acquisition and Instrumentation XC6SLX25T-2FGG484C Same-family commercial-temperature interface option 사용처: High-Speed Interface Aggregation XC6SLX25T-3FG484C Same-resource lower-temperature ordering option 사용처: Communications and Network Equipment, Embedded Video and Image Processing

Where can I buy the XC6SLX25T-3FG484I online?

Use the Request a Quote form on this page to request the AMD XC6SLX25T-3FG484I, current inventory, and delivery terms. The device is a Spartan-6 LXT FPGA with 24,051 logic cells, 250 I/O, a 500 MHz internal frequency, and a 1.2 V core supply. Because package temperature codes and programmable-device availability can affect sourcing decisions, request the exact XC6SLX25T-3FG484I ordering code rather than accepting a generic Spartan-6 FPGA.

What is the price of the XC6SLX25T-3FG484I?

The current XC6SLX25T-3FG484I price is handled through the Request a Quote form on this page. The exact orderable MPN matters because this is a -3 speed-grade, industrial-temperature Spartan-6 LXT FPGA in a 15 x 15 mm lead-free FBGA package. A quotation request should confirm unit pricing, lot size, production quantity, and lead time for the exact package and temperature combination.

What is the lead time for the XC6SLX25T-3FG484I?

Request the current lead time and minimum order quantity through the Request a Quote form on this page. Lead time can change with procurement volume, inventory, and lifecycle conditions, so the exact XC6SLX25T-3FG484I ordering code should be stated on the request. Confirming the order quantity, authorized sourcing status, and production schedule is especially important for long-lived industrial equipment.

Is the XC6SLX25T-3FG484I in stock?

Use the Request a Quote form on this page to check current stock and allocation status for the exact XC6SLX25T-3FG484I. The component is identified as an industrial-temperature, -3 speed-grade Spartan-6 LXT FPGA with 24,051 logic cells and 250 I/O. Avoid substituting an XC6SLX25T-3FGG484I without reviewing its package and temperature ordering details because the ordering suffixes require careful comparison.

What are the key specifications of XC6SLX25T-3FG484I that engineers should know?

The XC6SLX25T-3FG484I is a -3 speed-grade Spartan-6 LXT FPGA with 24,051 logic cells, 958,464 bits of distributed memory, 250 I/O, a 500 MHz internal frequency, and a 1.2 V core supply. According to the AMD product documentation, it operates from 0 °C to 85 °C and uses a lead-free 15 x 15 mm FBGA package with 0.80 mm pitch.

XC6SLX25T-3FG484I vs XC6SLX25T-3FGG484I - which is better?

Both parts are associated with the -3 Spartan-6 LXT speed grade, but the ordering suffix must be checked before selecting one. The XC6SLX25T-3FG484I listing identifies a 15 x 15 mm lead-free FBGA package and a 0 to 85 °C industrial temperature range. According to AMD ordering information, XC6SLX25T-3FGG484I is the closely related lead-free package option; verify its package code and temperature qualification in the AMD package data.

What is the difference between the XC6SLX25T-3FG484I and XC6SLX25T-2FGG484I?

The primary documented difference is the Spartan-6 speed grade: the XC6SLX25T-3FG484I uses -3, while the XC6SLX25T-2FGG484I uses -2. According to AMD Spartan-6 documentation, -3 is the highest-performance LX speed grade among the listed -3N, -2, and -1L options. A -2 device may be appropriate when timing performance can be reduced, but it should not replace a -3 design without timing analysis.

When should I choose the XC6SLX25T-3FG484I over the XC6SLX25T-2FGG484I?

Choose the XC6SLX25T-3FG484I when the design benefits from the highest listed Spartan-6 LX speed grade and must meet demanding clock or interface timing targets. The XC6SLX25T-2FGG484I is a lower-speed alternative that may be considered when the design has adequate timing margin or procurement priorities favor the -2 grade. Confirm pin, package, temperature, and timing requirements before making either substitution.

Is the XC6SLX25T-3FG484I suitable for industrial control systems?

Yes, the XC6SLX25T-3FG484I is suitable for industrial control systems requiring programmable logic, parallel I/O, and operation from 0 °C to 85 °C. Its 24,051 logic cells, 958,464 bits of distributed memory, and 250 I/O support control logic, interface adaptation, and data acquisition. For safety, EMC, or extended-temperature requirements, verify the complete product qualification and enclosure environment separately.

What is the best drop-in replacement for the XC6SLX25T-3FG484I?

The closest documented candidate is the XC6SLX25T-3FGG484I because it appears under the same -3 Spartan-6 LXT resource class and in a closely related lead-free 484 FBGA ordering code. It should not be treated as an automatic replacement until AMD package data confirms the ball map, temperature rating, and ordering suffix. For a -2-speed alternative, the XC6SLX25T-2FGG484I requires a separate timing review.

Can the XC6SLX25T-3FGG484I replace the XC6SLX25T-3FG484I?

The XC6SLX25T-3FGG484I is a close same-family candidate, but replacement requires verification of the package, temperature, and pin definitions. Both listings refer to Spartan-6 LXT devices in the 484 FBGA class, while the target is identified as a 15 x 15 mm lead-free package operating from 0 °C to 85 °C. Use the AMD Spartan-6 package pinout file and device ordering guide before approving the substitution.

What is the best AMD equivalent for the XC6SLX25T-3FG484I?

The closest AMD-family candidate found for the XC6SLX25T-3FG484I is the XC6SLX25T-3FGG484I, which preserves the -3 speed grade and closely related 484 FBGA package designation. No verified cross-brand drop-in FPGA with the same logic density, pinout, configuration interface, and serial transceiver arrangement was identified. Validate the AMD candidate against the official package pinout file and timing constraints.

What can replace the XC6SLX25T-3FG484I?

The XC6SLX25T-3FGG484I is the nearest documented same-family option because it retains the -3 speed grade and a related lead-free 484 FBGA ordering designation. The XC6SLX25T-2FGG484I or XC6SLX25T-2FGG484C may be considered only after reviewing timing and temperature differences. No verified cross-brand replacement was found that guarantees identical configuration, memory, transceiver, and pin compatibility.

Where can I download the XC6SLX25T-3FG484I datasheet PDF?

The XC6SLX25T-3FG484I datasheet landing page is available through the Octopart datasheet link on this page, and AMD's official Spartan-6 package pinout resource provides authoritative ASCII package files. The manufacturer datasheet should be used for configuration pins, power rails, clocking, memory resources, and electrical limits. Confirm the document revision corresponding to the current AMD website before releasing a production design.

Where can I find the XC6SLX25T-3FG484I pinout and package information?

Use AMD's official Spartan-6 package device pinout files for the definitive ball map and package assignments. The product listing describes a lead-free 15 x 15 mm FBGA with 0.80 mm pitch, while one specification source reports 324 pins and another identifies the configuration as a 484-BBGA. Do not infer the ball map from those conflicting counts; download the package file matching the exact orderable MPN.

엔지니어링 참조 데이터: XC6SLX25T-3FG484I — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the XC6SLX25T-3FG484I for a new Spartan-6 LXT design that needs the highest listed -3 speed grade, 24,051 logic cells, 250 I/O, and operation from 0 to 85 °C. The XC6SLX25T-3FGG484I is the closest same-speed ordering candidate, but its package and temperature suffix must be checked against the target PCB and qualification requirements. Consider the XC6SLX25T-2FGG484I or XC6SLX25T-2FGG484C only when lower timing performance is acceptable and design timing is rerun. The commercial-temperature XC6SLX25T-3FG484C is appropriate when the enclosure environment does not require the target's industrial ordering option. Do not select the larger XC6SLX45T as a direct replacement because its 43,661 logic cells exceed the target by about 81.7%, changing resource utilization and timing characteristics.

대체품과의 비교

파라미터	이 제품	XC6SLX25T-3FGG484I	XC6SLX25T-3FG484C	XC6SLX25T-2FGG484C	XC6SLX25T-2FGG484I
Brand	AMD	AMD	AMD	AMD	AMD
Package	15 x 15 mm lead-free 484 FBGA	15 x 15 mm lead-free 484 FBGA	15 x 15 mm lead-free 484 FBGA	15 x 15 mm lead-free 484 FBGA	15 x 15 mm lead-free 484 FBGA
FPGA Family	Spartan-6 LXT	Spartan-6 LXT	Spartan-6 LXT	Spartan-6 LXT	Spartan-6 LXT
Speed Grade	-3	-3	-3	-2	-2
Temperature Suffix	I	I	C	C	I
Logic Cells	24,051 cells	24,051 cells	24,051 cells	24,051 cells	24,051 cells
I/O Count	250 I/O	250 I/O	250 I/O	250 I/O	250 I/O

주요 차별점

Highest listed Spartan-6 LX speed grade (vs XC6SLX25T-2FGG484I)
Industrial-temperature ordering option (vs XC6SLX25T-3FG484C)
Substantial programmable resources for parallel control (vs XC6SLX45T-3FGG484I)

설계 노트

Treat the XC6SLX25T-3FG484I as a fine-pitch, 15 x 15 mm FBGA device with a 0.80 mm ball pitch. Follow the exact land pattern and mask or paste apertures from the official AMD Spartan-6 package file rather than deriving dimensions from the package name. Assign power and ground balls according to the complete ball map, preserve the exposed thermal requirements specified by AMD, and route high-speed clocks and configuration signals with controlled impedance.

Place configuration, clock, and decoupling connections directly beneath or adjacent to their assigned balls to minimize loop area. Separate sensitive clock inputs from high-speed serial and data outputs where practical, use short return paths for reference planes, and avoid routing fast signals through the region reserved for power-distribution vias. The 250 available I/O should be allocated only after confirming the package's actual ball assignments, because published listing snippets contain conflicting package-count descriptions.

Do not approve a replacement solely because the logic-cell counts match. A valid substitution also requires the same package, configuration interface, power architecture, clock resources, transceiver arrangement, temperature class, and timing grade. Review the AMD package pinout file, ordering guide, and device migration information for the candidate MPN. In particular, changing from -3 to -2 can alter timing closure even though the FPGA resources remain unchanged.

Evaluate junction temperature from the actual FPGA activity, selected package thermal data, ambient temperature, board construction, and airflow. The industrial temperature range of 0 to 85 °C does not by itself guarantee adequate board-level thermal performance. Provide continuous power and ground planes, use the specified via pattern, and confirm the assembled PCB temperature under worst-case operating conditions before approving the 15 x 15 mm FBGA footprint.

규정 준수 정보

RoHS

Unknown

REACH

Unknown

AEC-Q100

Unknown

무연

Yes

무할로겐

Unknown

분쟁 광물

Unknown

The package is identified as lead-free. Formal RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification statements were not identified and therefore remain unknown.

데이터 검증일: 2026-11-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터