XC6SLX45-3FGG676I - 43,661-Cell Spartan-6 LX FPGA | AMD
MPN: XC6SLX45-3FGG676I ✓ פעילXC6SLX45-3FGG676I סקירה
A field-programmable gate array is a digital semiconductor whose logic functions are established after fabrication through a configuration bitstream. Within the FPGA hierarchy, the Spartan-6 LX family belongs to the AMD/Xilinx FPGA family and provides a programmable alternative to application-specific integrated circuits. The XC6SLX45-3FGG676I is therefore suitable where control logic, parallel interfaces, serial links, memory interfaces, or general-purpose digital processing must be adapted without producing a custom ASIC.
Key characteristics include 43,661 logic cells, a 45 nm CMOS process, a 1.2 V supply, and a 676-ball BGA package. The -3 designation identifies the highest-performance speed grade listed for the Spartan-6 LX family. Its 676-ball package also supports a broad external I/O count, making the device appropriate for designs requiring numerous board-level connections or multiple buses.
The Spartan-6 LX architecture is intended for low-cost, high-volume programmable logic. A design can use parallel processors, digital signal-processing functions, clock and timer logic, protocol bridges, and control blocks within one FPGA. Because configuration is programmable, the same hardware can support different product variants, production updates, and field-configurable behavior without changing the physical PCB.
Typical uses include industrial automation, communications equipment, test and measurement systems, embedded control, video or image-processing control, and general-purpose digital interface consolidation. The large BGA footprint requires careful PCB layout, but it supports high-density connections and is well suited to multilayer boards with dedicated power, ground, and signal-integrity planning.
Design planning should include the exact Spartan-6 pinout file, power-decoupling strategy, configuration interface, clocking, and bank-specific voltage constraints. The 676-ball land pattern is too large and specialized for manual wiring, so a constraint-aware place-and-route flow and manufacturing design-rule review are essential.
This page combines exact device characteristics, engineering-focused application guidance, package considerations, and same-footprint replacement analysis. The alternatives listed retain the FBGA-676 format so engineers can evaluate speed-grade, temperature-grade, and assembly-code changes before modifying a production design.
חלופות תחליף ישיר עבור XC6SLX45-3FGG676I — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC6SLX45-3FGG676I (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Package, Package Type, Logic Cells, Lead-Free Status.
XC6SLX45-2FGG676I
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC6SLX45-3FG676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX45-2FG676I
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC6SLX45-N3FGG676I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX45-3FGG676I דירוגים מרביים ומאפיינים חשמליים
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -3 speed grade |
| Internal Frequency | 500 MHz |
| תדר שעון מקסימלי | 667 MHz |
| Configuration Logic Cells | 3,411 CLBs |
| Package Type | 676-ball BGA |
| Package Code | FGG676 |
| Package Family | FBGA-676 |
| Number of Terminals | 676 balls |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | 0°C to +85°C |
| Temperature Grade | Industrial |
| Lead-Free Status | Lead Free |
| Device Family | Spartan-6 LX |
| Programmable Logic Type | CMOS FPGA |
מדריך תצורת פינים של XC6SLX45-3FGG676I fbga-676
תצורת פינים עבור XC6SLX45-3FGG676I (מארזת fbga-676). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC6SLX45-3FGG676I.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC6SLX45-3FGG676I מתאים עבור 6 יישוםs: Industrial Automation Controllers, Communications Interface Consolidation, Embedded Test and Measurement, Video and Image Processing Control, Programmable Logic Consolidation, Aerospace and Defense Ground Support Equipment.
Industrial Automation Controllers
The XC6SLX45-3FGG676I fits industrial automation controllers that combine sequencing, machine-state monitoring, communication, and safety-adjacent control logic in one programmable device. Its 43,661 logic cells provide substantial capacity for parallel control tasks, while the -3 speed grade offers useful timing margin for synchronous interfaces. The 0°C to +85°C operating range supports controlled industrial environments. Place the device with a layered power structure and use the AMD FBGA-676 pinout file to assign bank supplies, grounds, clocks, and I/O without violating package or voltage constraints.
מומלץ
Communications Interface Consolidation
The AMD XC6SLX45-3FGG676I is appropriate for consolidating parallel data paths, protocol bridges, packet control, clocking, and status logic into a single Spartan-6 LX FPGA. Its 676-ball BGA format provides a high connection count for external memories and multiple interface groups, while the 43,661-cell capacity supports parallel processing and state machines. The -3 grade can improve timing margin for synchronous paths. Final interface rates still depend on the selected I/O standard, clock source, pin placement, board-level signal integrity, and verified AMD timing constraints.
מומלץ
Embedded Test and Measurement
The XC6SLX45-3FGG676I can implement programmable counters, timing engines, acquisition control, data formatting, and communication logic in test and measurement equipment. The 43,661 logic cells allow multiple measurement channels and control functions to share one FPGA, reducing discrete component count and improving configuration flexibility. Its -3 performance grade supports timing-sensitive pipelines, while the industrial temperature range accommodates controlled equipment environments. Designers should use the exact AMD package pinout and bank-voltage rules to implement clock-capable inputs, differential pairs, and high-speed test connections correctly.
מומלץ
Video and Image Processing Control
The AMD XC6SLX45-3FGG676I is suitable for the control side of video and image-processing systems, including pixel timing, frame synchronization, buffer addressing, color-space control, and data routing. Its 43,661 logic cells support parallel pipelines and control state machines, and the 676-ball package offers extensive connections to external memory and interface devices. The -3 speed grade provides additional timing margin for synchronous pixel pipelines. Practical implementation still requires careful bank assignments, source-synchronous layout, and validation against the selected AMD I/O and timing specifications.
מומלץ
Programmable Logic Consolidation
The XC6SLX45-3FGG676I is well suited to consolidating glue logic, parallel processors, memory controllers, arbitration logic, and peripheral bridges onto a single FPGA. The 43,661 logic cells and -3 performance grade make it suitable for designs needing more parallel throughput than a small programmable logic device can provide, while preserving the flexibility of a bitstream-programmable architecture. The 1.2 V core architecture requires a robust power network and decoupling plan. Use manufacturer power guidance and the package pinout to maintain deterministic operation across the 0°C to +85°C range.
מומלץ
Aerospace and Defense Ground Support Equipment
The XC6SLX45-3FGG676I can support programmable control functions in ruggedized ground-support or test equipment where a long-lived industrial-temperature FPGA is useful. Its 43,661 logic cells accommodate telemetry formatting, sequencing, bus translation, and monitoring logic, and the -3 grade can support tighter synchronous timing margins. The standard device is specified from 0°C to +85°C, but it should not be treated as automatically qualified for airborne or space applications. Project-specific qualification, environmental testing, documentation, and assembly requirements must be confirmed independently.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC6SLX45-3FGG676I — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC6SLX45-2FGG676I | XC6SLX45-3FG676C | XC6SLX45-2FG676I | XC6SLX45-N3FGG676I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | FBGA-676 | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| Performance Grade | -3 | -2 | -3 | -2 | N3 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Configurable Logic Blocks | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs |
מבדילים עיקריים
- Higher listed performance than the -2 industrial alternative (לעומתXC6SLX45-2FGG676I)
- Full industrial temperature coverage versus the commercial-grade option (לעומתXC6SLX45-3FG676C)
- Pin-compatible platform choice with differentiated speed and temperature codes (לעומתXC6SLX45-2FG676I)
- Same large BGA footprint for design consolidation (לעומתXC6SLX45-N3FGG676I)
הערות תכנון
Use the AMD Spartan-6 package device pinout file for the exact XC6SLX45 FBGA-676 ball map. Do not infer assignments from another Spartan-6 package because the smaller CSG324 and FGG484 options have different ball counts and layouts. Preserve the package ball pitch and copper-pad definition from the controlled package drawing, then run source-synchronous and other high-speed interfaces through the appropriate signal-integrity and timing verification flow.
Plan the 1.2 V core rail and all configurable I/O bank supplies as separate power domains, following the AMD recommended decoupling values and bank-current limits. Place the required high-frequency bypass capacitors adjacent to their assigned device balls and connect them to a low-impedance ground reference. Verify startup behavior, sequencing, voltage tolerances, and worst-case I/O loading because the 676-ball package can distribute substantial board-level switching demand.
The BGA package can move heat into the PCB rather than directly into the air, so thermal performance depends on the escape-path design, copper area, via structure, and multilayer stackup. Estimate junction temperature from the actual FPGA activity and power data, then confirm the result with a thermal-aware place-and-route workflow and board-level thermal analysis. Provide thermal vias beneath exposed thermal balls where the AMD package guidance permits them.
A footprint-compatible replacement is not automatically a functional substitute. The -2, -3, and N3 designations affect timing, while C and I suffixes affect the commercial and industrial temperature grades. Before changing the fitted device, rebuild the design with the replacement part, compare pin assignments and configuration behavior, rerun static timing, and review operating-temperature and lifecycle requirements. This prevents a mechanically valid change from creating an unverified timing or environmental mismatch.
מידע על תאימות
The device is identified as lead free. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly established for this exact MPN.