10AS032H2F34E2LG vs 10AS032H2F34I2LG तुलना
विस्तृत दोनों ओर की तुलना 10AS032H2F34E2LG द्वारा Intel और 10AS032H2F34I2LG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AS032H2F34E2LG | 10AS032H2F34I2LG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 SX | Arria 10 SX |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| पैकेज | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-ball FC-FBGA, 35 x 35 mm |
| Speed Grade | 2 | — |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | Compliant | Compliant |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Product Type | — | SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | — | 1.5 GHz |
| Process Technology | — | 20 nm |
| Core Voltage (Vcc) | — | 0.9 V |
| Package Code | — | F34 (Flip-Chip BGA, 1.0 mm pitch) |
| Terminal Form | — | Ball |
| Terminal Count | — | 1152 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Design Tool | — | Intel Quartus Prime |
| Transceiver Data Rate | — | Up to 17.4 Gbps (per family) |