10AS032H2F34E2LG vs 10AS032H2F34I2LG Perbandingan
Perbandingan bersamaan detil 10AS032H2F34E2LG dari Intel dan 10AS032H2F34I2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AS032H2F34E2LG | 10AS032H2F34I2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Paket | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-ball FC-FBGA, 35 x 35 mm |
| Speed Grade | 2 | — |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Product Type | — | SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | — | 1.5 GHz |
| Process Technology | — | 20 nm |
| Core Voltage (Vcc) | — | 0.9 V |
| Package Code | — | F34 (Flip-Chip BGA, 1.0 mm pitch) |
| Terminal Form | — | Ball |
| Terminal Count | — | 1152 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Design Tool | — | Intel Quartus Prime |
| Transceiver Data Rate | — | Up to 17.4 Gbps (per family) |