10AS048E2F29I2SG vs 10AS048E1F29I1HG तुलना
विस्तृत दोनों ओर की तुलना 10AS048E2F29I2SG द्वारा Intel और 10AS048E1F29I1HG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AS048E2F29I2SG | 10AS048E1F29I1HG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Max HPS Frequency | 1.5 GHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M20K + MLAB) | Approx. 28 Mbits total | — |
| DSP Blocks | [DATA_NEEDED: DSP block count and precision] | [DATA_NEEDED: DSP block count] |
| Transceivers | Multi-protocol up to 12.5 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Memory Controllers | DDR4 / DDR3 / QDRII+ / RLDRAM3 | — |
| PCIe Hard IP | PCI Express Gen2/Gen3 | — |
| Process Technology | 20 nm TSMC | — |
| पैकेज | 780-ball FC-FBGA (29 mm × 29 mm) | 780-ball FCBGA, 29x29 mm |
| Temperature Grade | Industrial | — |
| Lead-Free / RoHS | Yes | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Bitstream Security | AES-256 encryption, JTAG protection | — |
| Configuration Controller | On-chip | — |
| ऑपरेटिंग तापमान | -40 °C to +100 °C (industrial) | -40C to +100C (Industrial) |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Process Node | — | 20 nm |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| RoHS स्थिति | — | Compliant |