10AS057K2F35E1HG vs 10AS057K1F35E1HG तुलना
विस्तृत दोनों ओर की तुलना 10AS057K2F35E1HG द्वारा Intel और 10AS057K1F35E1HG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AS057K2F35E1HG | 10AS057K1F35E1HG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: embedded memory in Mbits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | Up to 24 channels |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| पैकेज | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-BGA (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| RoHS स्थिति | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Device Variant | — | 10AS057 |
| Maximum Processor Frequency | — | 1.5 GHz |
| Speed Grade | — | -1 (F35) |
| Temperature Grade | — | Extended (E) |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | — | DDR4 / DDR3 with hard controllers |
| HPS Peripherals | — | USB 2.0, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC |
| Process Node | — | 20 nm |
| माउंटिंग प्रकार | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |