10AS057K2F35E1HG vs 10AS057K1F35E1HG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS057K2F35E1HG disebabkan oleh Intel dan 10AS057K1F35E1HG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS057K2F35E1HG | 10AS057K1F35E1HG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: embedded memory in Mbits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | Up to 24 channels |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Kemasan | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-BGA (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| Status RoHS | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Device Variant | — | 10AS057 |
| Maximum Processor Frequency | — | 1.5 GHz |
| Speed Grade | — | -1 (F35) |
| Temperature Grade | — | Extended (E) |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | — | DDR4 / DDR3 with hard controllers |
| HPS Peripherals | — | USB 2.0, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC |
| Process Node | — | 20 nm |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |