10AS057K2F35E1HG vs 10AS057K1F35E1HG 比較
詳細並排比較 10AS057K2F35E1HG 由 Intel 與 10AS057K1F35E1HG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10AS057K2F35E1HG | 10AS057K1F35E1HG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: embedded memory in Mbits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | Up to 24 channels |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| 封裝 | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-BGA (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| RoHS 狀態 | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Device Variant | — | 10AS057 |
| Maximum Processor Frequency | — | 1.5 GHz |
| Speed Grade | — | -1 (F35) |
| Temperature Grade | — | Extended (E) |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Memory Interfaces | — | DDR4 / DDR3 with hard controllers |
| HPS Peripherals | — | USB 2.0, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC |
| Process Node | — | 20 nm |
| 安裝類型 | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |