10AX115R2F40E2SG vs 10AX115R2F40I1SG तुलना
विस्तृत दोनों ओर की तुलना 10AX115R2F40E2SG द्वारा Intel और 10AX115R2F40I1SG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AX115R2F40E2SG | 10AX115R2F40I1SG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | — |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | — |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | PCIe Gen3 x8 |
| Process Technology | 20 nm TSMC | — |
| Speed Grade | -2 (E2, mid) | I1 (industrial, fastest) |
| ऑपरेटिंग तापमान | 0C to +100C (commercial) | — |
| पैकेज | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40) |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | — |
| RoHS | Compliant | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | — | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | — | 2,014 |
| User I/O Count | — | 342 |
| Transceivers | — | [DATA_NEEDED: transceiver count for F40 package] |
| Transceiver Speed | — | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40C to +100C) |