10AX115R2F40E2SG vs 10AX115R2F40I1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40E2SG disebabkan oleh Intel dan 10AX115R2F40I1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40E2SG | 10AX115R2F40I1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | — |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | — |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | PCIe Gen3 x8 |
| Process Technology | 20 nm TSMC | — |
| Speed Grade | -2 (E2, mid) | I1 (industrial, fastest) |
| Suhu Operasi | 0C to +100C (commercial) | — |
| Kemasan | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40) |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | — |
| RoHS | Compliant | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | — | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | — | 2,014 |
| User I/O Count | — | 342 |
| Transceivers | — | [DATA_NEEDED: transceiver count for F40 package] |
| Transceiver Speed | — | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40C to +100C) |