10AX115R2F40E2SG vs 10AX115R2F40I1SG 비교
다음의 상세 나란히 비교: 10AX115R2F40E2SG 제조: Intel 및 10AX115R2F40I1SG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115R2F40E2SG | 10AX115R2F40I1SG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $5,410.00 | $3,490.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | — |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | — |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | PCIe Gen3 x8 |
| Process Technology | 20 nm TSMC | — |
| Speed Grade | -2 (E2, mid) | I1 (industrial, fastest) |
| 동작 온도 | 0C to +100C (commercial) | — |
| 패키지 | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40) |
| 실장 유형 | Surface Mount (flip-chip BGA) | — |
| RoHS | Compliant | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | — | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | — | 2,014 |
| User I/O Count | — | 342 |
| Transceivers | — | [DATA_NEEDED: transceiver count for F40 package] |
| Transceiver Speed | — | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40C to +100C) |