10M50SCE144A7G vs 10M50SAE144C8G तुलना
विस्तृत दोनों ओर की तुलना 10M50SCE144A7G द्वारा Intel और 10M50SAE144C8G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10M50SCE144A7G | 10M50SAE144C8G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count and total bits] | — |
| Total User Flash Bits | 1,677,312 bits | — |
| User I/O Count | 101 | — |
| Number of LABs/CLBs | 3,125 | — |
| Supply Voltage - Core | 1.2 V (internal) | [DATA_NEEDED: core Vcc] |
| Supply Voltage - I/O | 3.0 V / 3.3 V LVCMOS/LVTTL | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial) | 0C to +85C (Commercial, "C8" grade) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| पैकेज / केस | 144-LQFP Exposed Pad (EQFP-144) | — |
| Number of PLLs | 2 | — |
| Integrated ADC | 12-bit, 1 MSPS (analog inputs package-dependent) | — |
| RoHS स्थिति | Compliant | Compliant |
| MSL स्तर | 3 (per JEDEC J-STD-020) | 3 |
| Configuration Method | On-chip non-volatile flash (instant-on, no external boot PROM) | — |
| Process Technology | TSMC 55 nm NOR-flash + SRAM | 55 nm embedded flash CMOS |
| Family | — | MAX 10 FPGA |
| Embedded Memory | — | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | — | 101 |
| पैकेज | — | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | — | 22 x 22 mm, 0.50 mm pitch |
| Configuration | — | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | — | Up to 1.4 Mbit |
| ADC | — | 12-bit successive-approximation, up to 17 channels |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| I/O Standards | — | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | — | Yes |
| Thermal Resistance (Theta-JA) | — | [DATA_NEEDED: theta-JA C/W] |