10M50SCE144A7G vs 10M50SAE144C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50SCE144A7G sa pamamagitan ng Intel at 10M50SAE144C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50SCE144A7G | 10M50SAE144C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count and total bits] | — |
| Total User Flash Bits | 1,677,312 bits | — |
| User I/O Count | 101 | — |
| Number of LABs/CLBs | 3,125 | — |
| Supply Voltage - Core | 1.2 V (internal) | [DATA_NEEDED: core Vcc] |
| Supply Voltage - I/O | 3.0 V / 3.3 V LVCMOS/LVTTL | — |
| Temperature na Operasyon | -40C to +100C (industrial) | 0C to +85C (Commercial, "C8" grade) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 144-LQFP Exposed Pad (EQFP-144) | — |
| Number of PLLs | 2 | — |
| Integrated ADC | 12-bit, 1 MSPS (analog inputs package-dependent) | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 |
| Configuration Method | On-chip non-volatile flash (instant-on, no external boot PROM) | — |
| Process Technology | TSMC 55 nm NOR-flash + SRAM | 55 nm embedded flash CMOS |
| Family | — | MAX 10 FPGA |
| Embedded Memory | — | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | — | 101 |
| Packhaging | — | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | — | 22 x 22 mm, 0.50 mm pitch |
| Configuration | — | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | — | Up to 1.4 Mbit |
| ADC | — | 12-bit successive-approximation, up to 17 channels |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| I/O Standards | — | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | — | Yes |
| Thermal Resistance (Theta-JA) | — | [DATA_NEEDED: theta-JA C/W] |