5CGXFC5C6F27C7N vs 5AGXMA3D4F27I5G तुलना
विस्तृत दोनों ओर की तुलना 5CGXFC5C6F27C7N द्वारा Intel और 5AGXMA3D4F27I5G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 5CGXFC5C6F27C7N | 5AGXMA3D4F27I5G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Cyclone V GX | Arria V GX |
| Logic Elements | 77,000 | — |
| Embedded Memory | 5,001,216 bits | — |
| Number of M10K Blocks | 446 | — |
| Number of MLAB Blocks | 832 | — |
| User I/O Pins | 336 | — |
| Hard Memory Controllers | 2 | — |
| Logic Array Blocks (LABs) | 4,535 | — |
| 18x18 Multipliers | 312 | — |
| PLLs (Fractional) | 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Transceiver Channels | 6 | — |
| Core Voltage | 1.1 V | 1.1 V |
| ऑपरेटिंग तापमान | 0C to +85C (Commercial) | — |
| पैकेज | 672-FBGA (27 mm x 27 mm, 1.0 mm pitch) | 672-ball FCBGA (F27) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| RoHS स्थिति | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm |
| Series | Cyclone V | — |
| Supplier Device Package | 672-FBGA | — |
| Logic Elements (LE) | — | 156,000 |
| Embedded Memory Bits | — | 11,746,304 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| General-Purpose I/Os | — | 336 |
| Package Body Size | — | 27 x 27 mm |
| Seated Height | — | 2.7 mm |
| Transceivers | — | Integrated multi-gigabit transceivers |
| Hard IP Blocks | — | PCIe Gen2, memory controllers |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Configuration | — | JTAG, serial flash, passive parallel |